Inductively coupled plasma chamber with electrically powered magnet ring
US-2026066241-A1 · Mar 5, 2026 · US
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Sarode Vishwanath Yogananda patents
Sarode Vishwanath Yogananda is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sarode Vishwanath Yogananda |
| Total patents | 58 |
| First publication | Apr 9, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor wafer processing with electromagnetic plasma confinement
US-2026031306-A1 · Jan 29, 2026 · US
Cooling base for a substrate support
US-12459071-B2 · Nov 4, 2025 · US
Lift pin assembly
US-12444644-B2 · Oct 14, 2025 · US
Substrate support assembly having an edge voltage delivery system
US-2025299929-A1 · Sep 25, 2025 · US
Cooling base for a substrate support
US-2025222550-A1 · Jul 10, 2025 · US
Process kit enclosure system
US-2025087524-A1 · Mar 13, 2025 · US
Wafer edge ring lifting solution
US-2024429088-A1 · Dec 26, 2024 · US
Electrostatic substrate support
US-2024420984-A1 · Dec 19, 2024 · US
Substrate support
US-2024420932-A1 · Dec 19, 2024 · US
Recent patents
Latest publications not already listed above.
Process kit enclosure system
US-12165905-B2 · Dec 10, 2024 · US
Icp source gas delivery hub and nozzle
US-2024351055-A1 · Oct 24, 2024 · US
Electrical break for substrate processing systems
US-2024339302-A1 · Oct 10, 2024 · US
Ccp gas delivery nozzle
US-2024339301-A1 · Oct 10, 2024 · US
Wafer edge ring lifting solution
US-12094752-B2 · Sep 17, 2024 · US
Differential substrate backside cooling
US-2024304486-A1 · Sep 12, 2024 · US
Lift pin assembly
US-2024266206-A1 · Aug 8, 2024 · US
Lift pin assembly
US-12002703-B2 · Jun 4, 2024 · US
In-situ apparatus for semiconductor process module
US-11887879-B2 · Jan 30, 2024 · US
Process kit with adjustable tuning ring for edge uniformity control
US-11728143-B2 · Aug 15, 2023 · US
Semiconductor processing with cooled electrostatic chuck
US-11569114-B2 · Jan 31, 2023 · US
Wafer edge ring lifting solution
US-2022319904-A1 · Oct 6, 2022 · US
Cryogenic electrostatic chuck
US-11437261-B2 · Sep 6, 2022 · US
Semiconductor processing with cooled electrostatic chuck
US-2022262664-A1 · Aug 18, 2022 · US
Wafer edge ring lifting solution
US-11393710-B2 · Jul 19, 2022 · US
Cryogenic electrostatic chuck
US-11373893-B2 · Jun 28, 2022 · US
Process kit with adjustable tuning ring for edge uniformity control
US-11201037-B2 · Dec 14, 2021 · US
In-situ apparatus for semiconductor process module
US-2021351063-A1 · Nov 11, 2021 · US
Lift pin assembly
US-2021233799-A1 · Jul 29, 2021 · US
In-situ apparatus for semiconductor process module
US-11075105-B2 · Jul 27, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 58 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/722 | 28 |
| H10P72/72 | 25 |
| H10P72/7612 | 23 |
| H01L21/6833 | 23 |
| H01J2237/334 | 22 |