Cryogenic electrostatic chuck

Patent metadata

Field	Value
Publication number	US-11437261-B2
Application number	US-201816217036-A
Country	US
Kind code	B2
Filing date	Dec 11, 2018
Priority date	Dec 11, 2018
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.

First claim

What is claimed is:

1. A substrate support assembly, comprising:
an electrostatic chuck (ESC) having a support surface and a bottom surface opposite the support surface, the ESC having a chucking electrode and one or more resistive heaters disposed therein;
an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein;
a facility plate having a coolant channel disposed therein, the facility plate comprises a plate portion and a flange portion, the plate portion coupled to the ESC base assembly and the flange portion coupled to a portion of the bottom surface of the ESC extending past a side wall of the ESC base assembly with a seal assembly; and
a vacuum region defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly at the portion of the bottom surface of the ESC extending past the side wall of the ESC base assembly.

2. The substrate support assembly of claim 1 , further comprising an insulator plate coupled to the facility plate and a ground plate coupled to the insulator plate.

3. The substrate support assembly of claim 1 , wherein the ESC base assembly is secured to the ESC with a bonding layer.

4. The substrate support assembly of claim 1 , wherein the ESC comprises alumina (Al 2 O 3 ) and/or aluminum nitride (AlN) containing materials.

5. The substrate support assembly of claim 1 , wherein the ESC base assembly comprises molybdenum or carbon fiber containing materials.

6. The substrate support assembly of claim 1 , wherein the refrigerant channel having an inlet and an outlet is operable to be connected to a cryogenic chiller in fluid communication with the refrigerant channel via a refrigerant inlet conduit connected to the inlet of the refrigerant channel and a refrigerant outlet conduit connected to the outlet of the refrigerant channel.

7. The substrate support assembly of claim 1 , wherein the coolant channel having an inlet and an outlet is operable to be connected to a chiller in fluid communication with the coolant channel via a coolant inlet conduit connected to the inlet of the coolant channel and a coolant outlet conduit connected to the outlet of the coolant channel.

8. The substrate support assembly of claim 1 , wherein the seal assembly comprises a polytetrafluoroethylene (PTFE) body having a helical spring disposed therein to seal the vacuum region at a temperature between about −250 degrees Celsius to about 250 degrees Celsius.

9. The substrate support assembly of claim 8 , wherein the helical spring comprises stainless steel, nickel alloy, nickel-chromium alloy, and cobalt-chromium-nickel-molybdenum alloy containing materials.

10. The substrate support assembly of claim 1 , wherein the vacuum region comprises a vacuum inlet operable to be connected to a vacuum inlet conduit in fluid communication with a vacuum source and vacuum outlet operable to be connected to a vacuum outlet conduit in fluid communication with the vacuum source to maintain vacuum pressure in the vacuum region greater than a pressure of a processing region of a processing chamber.

11. The substrate support assembly of claim 1 , further comprising one or more probe assemblies coupled to a probe controller, each of the one or more probe assemblies comprise a probe tip contacting the ESC.

12. The substrate support assembly of claim 11 , wherein a heater power source of the one or more resistive heaters having a controller is connected to the probe controller.

13. A substrate support assembly, comprising:
an electrostatic chuck (ESC) having a support surface and a bottom surface opposite the support surface, the ESC having a chucking electrode and one or more resistive heaters disposed therein;
an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, the refrigerant channel having a refrigerant inlet in fluid communication with a jacketed refrigerant inlet tube disposed through a facility plate, an insulator plate coupled to the facility plate, and a ground plate coupled to the facility plate, the refrigerant channel having a refrigerant outlet in fluid communication with a jacketed refrigerant outlet tube disposed through the facility plate, the insulator plate, and the ground plate coupled to the facility plate;
the facility plate comprises a plate portion and a flange portion, the plate portion coupled to the ESC base assembly with one or more first screw assemblies and the flange portion coupled to a portion of the bottom surface of the ESC extending past a side wall of the ESC base assembly with a seal assembly, the facility plate having a coolant channel disposed therein, the seal assembly comprises a polytetrafluoroethylene (PTFE) body having a helical spring disposed therein;
a vacuum region defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly at the portion of the bottom surface of the ESC extending past the side wall of the ESC base assembly.

14. The substrate support assembly of claim 13 , wherein the helical spring comprises stainless steel, nickel alloy, nickel-chromium alloy, and cobalt-chromium-nickel-molybdenum alloy containing materials.

15. The substrate support assembly of claim 13 , wherein each of the one or more first screw assemblies includes a bolt inserted through a thermal break, a Belleville washer and the facility plate, and into a thread hole of ESC base assembly, the Belleville washer and bolt force the facility plate against the ESC base assembly.

16. A process chamber comprising:
a chamber body having walls and a lid defining a processing region;
a substrate support assembly disposed in the processing region, the substrate support assembly comprises:
an electrostatic chuck (ESC) having a support surface and a bottom surface opposite the support surface, the ESC having a chucking electrode and one or more resistive heaters disposed therein;
an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein;
a facility plate having a coolant channel disposed therein, the facility plate comprises a plate portion and a flange portion, the plate portion coupled to the ESC base assembly and the flange portion coupled to a portion of the bottom surface of the ESC extending past a side wall of the ESC base assembly with a seal assembly; and
a vacuum region defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly at the portion of the bottom surface of the ESC extending past the side wall of the ESC base assembly.

17. The substrate support assembly of claim 16 , further comprising an insulator plate coupled to the facility plate and a ground plate coupled to the insulator plate.

18. The substrate support assembly of claim 16 , wherein the ESC base assembly is secured to the ESC with a bonding layer.

19. The substrate support assembly of claim 16 , wherein the ESC comprises alumina (Al 2 O 3 ) and/or aluminum nitride (AlN) containing materials.

20. The substrate support assembly of claim 16 , wherein the ESC base assembly comprises molybdenum or carbon fiber containing materials.

Assignees

• Applied Materials Inc

Inventors

• Sarode Vishwanath Yogananda
• Babayan Steven E
• Prouty Stephen Donald
• García De Gorordo Álvaro
• Schmid Andreas
• Noujaim Andrew Antoine

Classifications

• H10P72/0471

  comprising at least one ion or electron beam chamber · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title