In-situ apparatus for semiconductor process module

Patent metadata

Field	Value
Publication number	US-11075105-B2
Application number	US-201816103531-A
Country	US
Kind code	B2
Filing date	Aug 14, 2018
Priority date	Sep 21, 2017
Publication date	Jul 27, 2021
Grant date	Jul 27, 2021

Abstract

Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.

First claim

What is claimed is:

1. A carrier for supporting an edge ring, comprising:
a plate having a perimeter including two opposing curved edges;
a first plurality of receptacles disposed in the plate with each configured to receive a lift pin therein, the first plurality of receptacles being disposed in the plate along a first triangular pattern having a first base side and two sides that extend from the first base side and intersect at a first apex that points in a first direction;
a second plurality of receptacles disposed in the plate with each configured to engage a supporting structure, the second plurality of receptacles being disposed in the plate along a second triangular pattern having a second base side and two sides that extend from the second base side and intersect at a second apex that points in a second direction that is opposite of the first direction, wherein the second base side of the second triangular pattern is parallel to the first base side of the first triangular pattern;
a first arcuate support structure coupled to one of the two opposing curved edges, the first arcuate support structure extending above a plane of an upper surface of the plate, and the first arcuate support structure comprising:
a stepped surface formed on a radially outward edge of the first arcuate support structure and disposed above the plane of the upper surface of the plate, the stepped surface of the first arcuate support structure comprising:
a supporting surface positioned parallel to the upper surface of the plate, and
a wall positioned radially inward of the supporting surface of the first arcuate support structure and oriented perpendicular to the upper surface of the plate, the wall of the first arcuate support structure extending upward relative to the supporting surface of the first arcuate support structure; and

a second arcuate support structure coupled to the other of the two opposing curved edges, the second arcuate support structure extending above the plane of the upper surface of the plate, and the second arcuate support structure comprising:
a stepped surface formed on a radially outward edge of the second arcuate support structure and disposed above the plane of the upper surface of the plate, the stepped surface of the second arcuate support structure comprising:
a supporting surface positioned parallel to the upper surface of the plate, and
a wall positioned radially inward of the supporting surface of the second arcuate support structure and oriented perpendicular to the upper surface of the plate, the wall of the second arcuate support structure extending upward relative to the supporting surface of the second arcuate support structure.

2. The carrier of claim 1 , wherein the plate comprises a semi-circular plate having the perimeter defined by two parallel edges with the two opposing curved edges coupling the two parallel edges.

3. The carrier of claim 1 , wherein the first plurality of receptacles are located radially inward with respect to the second plurality of receptacles from a center of the plate.

4. The carrier of claim 1 , wherein each of the first plurality of receptacles comprises a cap disposed within a bore of the plate.

5. The carrier of claim 1 , wherein each of the first plurality of receptacles comprises a body with a recess extending into the body, and wherein the recess comprises an oblong or parabolic shape.

6. The carrier of claim 1 , wherein each of the second plurality of receptacles comprises a body disposed within an opening in the plate, the body comprising a flared portion with an increased outer diameter with respect to the body and a bore formed through the body.

7. The carrier of claim 1 , wherein the plate comprises a plurality of openings formed therethrough.

8. The carrier of claim 7 , wherein the plurality of openings comprise a round central opening formed in the plate and a plurality of semi-circular openings positioned concentrically around the round central opening, the first plurality of receptacles are positioned radially outward of the plurality of semi-circular openings, and the second plurality of receptacles are positioned radially outward of the first plurality of receptacles.

9. The carrier of claim 1 , wherein a distance between the wall of the first arcuate support structure and the wall of the second arcuate support structure is equal to or lesser than an inner diameter of the edge ring such that the edge ring engages the supporting surface and the wall of each of the first arcuate support structure and the second arcuate support structure.

10. A carrier apparatus for transferring an edge ring, comprising:
a robot blade, the robot blade comprising:
a base,
two fingers extending from the base,
a base carrier engagement feature coupled to an upper surface of the base, and
finger carrier engagement features each coupled to an upper surface of a respective one of the two fingers; and

a carrier supported on the robot blade, the carrier comprising:
a plate having a perimeter including two opposing curved edges,
a first plurality of receptacles disposed in the plate with each configured to receive a lift pin therein, the first plurality of receptacles being disposed in the plate along a first triangular pattern having a first base side and two sides that extend from the first base side and intersect at a first apex points in a first direction,
a second plurality of receptacles disposed in the plate with each configured to engage the robot blade, the second plurality of receptacles being disposed in the plate along a second triangular pattern having a second base side and two sides that extend from the second base side and intersect at a second apex that points in a second direction that is opposite of the first direction, wherein the second base side of the second triangular pattern is parallel to the first base side of the first triangular pattern,
a first arcuate support structure coupled to one of the two opposing curved edges, the first arcuate support structure extending above a plane of an upper surface of the plate, and the first arcuate support structure comprising:
a stepped surface formed on a radially outward edge of the first arcuate support structure and disposed above the plane of the upper surface of the plate, the stepped surface of the first arcuate support structure comprising:
a supporting surface positioned parallel to the upper surface of the plate, and
a wall positioned radially inward of the supporting surface of the first arcuate support structure and oriented perpendicular to the upper surface of the plate, the wall of the first arcuate support structure extending upward relative to the supporting surface of the first arcuate support structure, and

a second arcuate support structure coupled to the other of the two opposing curved edges, the second arcuate support structure extending above the plane of the upper surface of the plate, and the second arcuate support structure comprising:
a stepped surface formed on a radially outward edge of the second arcuate support structure and disposed above the plane of the upper surface of the plate, the stepped surface of the second arcuate support structure comprising:
a supporting surface positioned parallel to the upper surface of the plate, and
a wall positioned radially inward of the supporting surface of the second arcuate support structure and oriented perpendicular to the upper surface of the plate, the wall of the second arcuate support structure extending upward relative to the supporting surface of the second arcuate support structure.

11. The carrier apparatus of claim 10 , wherein the base carrier engagement feature comprises a first

Assignees

• Applied Materials Inc

Inventors

• Sarode Vishwanath Yogananda
• Babayan Steven E
• Prouty Stephen
• Schmid Andreas

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/3306 Primary

  Horizontal transfer of a single workpiece · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/7602 Primary

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title