In-situ apparatus for semiconductor process module

Patent metadata

Field	Value
Publication number	US-2021351063-A1
Application number	US-202117365612-A
Country	US
Kind code	A1
Filing date	Jul 1, 2021
Priority date	Sep 21, 2017
Publication date	Nov 11, 2021
Grant date	—

Abstract

Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.

First claim

What is claimed is:

1 . A carrier for supporting an edge ring, comprising:
a plate having a perimeter including a plurality of curved edges and a plurality of parallel edges; a plurality of inserts disposed in the plate, each insert of the plurality of inserts formed of a soft polymer material, and each of the plurality of inserts configured to engage a supporting structure; and a plurality of support structures coupled to the plurality of curved edges, each respective support structure extending above a plane of an upper surface of the plate, and each respective support structure of the plurality of support structures comprising:
a step formed on a radially outward edge of the respective support structure and disposed above the plane of the upper surface of the plate, the step of each respective support structure comprising:
a supporting surface parallel to the upper surface of the plate, and
an arcuate wall positioned radially inward of the supporting surface of the respective support structure and oriented perpendicular to the upper surface of the plate, the arcuate wall of each respective support structure extending perpendicularly to the supporting surface of the respective support structure, and

a male extension positioned radially inward of the wall and extending into the plate.

2 . The carrier of claim 1 , wherein the arcuate wall of each respective support structure of the plurality of support structures has a radius of curvature that is less than an inner radius of the edge ring.

3 . The carrier of claim 2 , wherein the arcuate wall of each respective support structure of the plurality of support structures is disposed at a radius relative to a center of the plate, and the radius is equal to or lesser than the inner radius of the edge ring.

4 . The carrier of claim 1 , wherein the plate is a semi-circular plate.

5 . The carrier of claim 1 , wherein at least some of the plurality of inserts are positioned radially inward of the plurality of support structures.

6 . The carrier of claim 1 , wherein each insert of the plurality of inserts comprises a body disposed in an opening formed in the plate.

7 . The carrier of claim 6 , wherein the body of each insert of the plurality of inserts comprises a flared portion having an outer diameter that is larger than a cylindrical portion of the body.

8 . The carrier of claim 7 , wherein the body of each insert of the plurality of inserts further comprises a bore formed through the body.

9 . The carrier of claim 1 , wherein the plate comprises one or more openings formed therein.

10 . The carrier of claim 9 , where the one or more openings comprises a plurality of openings, and at least one of the plurality of inserts is positioned between two of the plurality of openings.

11 . A carrier for supporting an edge ring, comprising:
a plate having a perimeter including a plurality of curved edges and a plurality of parallel edges; a plurality of inserts disposed in the plate, each insert of the plurality of inserts formed of a soft polymer material, and each of the plurality of inserts configured to engage a supporting structure; and a plurality of support structures coupled to the plurality of curved edges, each respective support structure of the plurality of support structures comprising:
a step formed on a radially outward edge of the respective support structure, the step of each respective support structure comprising:
a supporting surface, and
an arcuate wall positioned radially inward of the supporting surface of the respective support structure and extending perpendicularly to the supporting surface of the respective support structure.

12 . The carrier of claim 11 , wherein the arcuate wall of each respective support structure of the plurality of support structures has a radius of curvature that is less than an inner radius of the edge ring.

13 . The carrier of claim 12 , wherein the arcuate wall of each respective support structure of the plurality of support structures is disposed at a radius relative to a center of the plate, and the radius is equal to or lesser than the inner radius of the edge ring.

14 . The carrier of claim 11 , wherein the plate is a semi-circular plate.

15 . The carrier of claim 11 , wherein each insert of the plurality of inserts comprises a body disposed in an opening formed in the plate, and the body of each insert of the plurality of inserts comprises a flared portion having an outer diameter that is larger than a cylindrical portion of the body.

16 . The carrier of claim 15 , wherein the body of each insert of the plurality of inserts further comprises a bore formed through the body.

17 . A method of transferring an edge ring, comprising:
inserting a robot blade into a chamber through a slit valve door, the robot blade having a carrier thereon and an edge ring supported on the carrier; positioning the carrier and the edge ring thereon over a substrate support; actuating substrate lift pins to lift the edge ring from the carrier; and retracting the robot blade and the carrier from the chamber.

18 . The method of claim 17 , further comprising:
lowering the edge ring into contact with the substrate support.

19 . The method of claim 18 , wherein lowering the edge ring into contact with the substrate support includes positioning the edge ring in a non-parallel configuration with respect to an upper surface of the substrate support to adjust a position of a plasma sheath during processing.

20 . The method of claim 17 , wherein a plurality of inserts of the carrier are engaged with the robot blade during the inserting the robot blade into the chamber and the retracting the robot blade and the carrier from the chamber, wherein each insert of the plurality of inserts formed of a soft polymer material.

Assignees

• Applied Materials Inc

Inventors

• Sarode Vishwanath Yogananda
• Babayan Steven E
• Prouty Stephen
• Schmid Andreas

Classifications

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/3306 Primary

  Horizontal transfer of a single workpiece · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/7602 Primary

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title