Electrical break for substrate processing systems

US2024339302A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024339302-A1
Application numberUS-202318206456-A
CountryUS
Kind codeA1
Filing dateJun 6, 2023
Priority dateApr 10, 2023
Publication dateOct 10, 2024
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Systems, methods, and apparatus including designs embodied in machine-readable media for a gas break used in semiconductor processing systems. The apparatus includes a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between a grounded gas distribution manifold and an electrically charged gas delivery nozzle, the gas break structure further comprising an internal structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. The gas break can be formed using additive manufacturing.

First claim

Opening claim text (preview).

What is claimed is: 1 . A system for semiconductor processing, the system comprising: a chamber enclosing a first processing region; a first substrate support within the chamber and configured to retain a first substrate in the first processing region of the chamber; a plasma source configured to direct RF energy into the chamber; a gas distribution manifold wherein the gas distribution manifold is operatively coupled to the chamber to introduce an etching gas comprising one or more gases from the gas distribution manifold to a gas delivery nozzle of the chamber; and a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between a grounded gas distribution manifold and an electrically charged gas delivery nozzle, the gas break structure further comprising an internal structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. 2 . The system of claim 1 , wherein the one or more gas flow paths have a helical coil geometry. 3 . The system of claim 1 , wherein the one or more gas flow paths comprise two gas flow paths, the two gas flow paths have a double helical geometry. 4 . The system of claim 1 , wherein the one or more gas flow paths have a “U” shaped cross-section. 5 . The system of claim 1 , wherein the one or more gas flow paths have a dovetail shaped cross-section. 6 . The system of claim 1 , wherein the internal structure comprises a plurality of rib structures joined by one or more cross members. 7 . The system of claim 1 , wherein the internal structure comprises a coil structure surrounding a hollow interior. 8 . The system of claim 1 , wherein the internal structure comprises a hollow cylinder structure having a pair of cross beams within the hollow interior. 9 . The system of claim 1 , wherein the internal structure corresponds to a particular infill pattern, wherein the infill pattern comprises one or more of a grid pattern, a triangle pattern, a honeycomb pattern, a gyroid pattern, or a stacked wave pattern. 10 . The system of claim 1 , wherein the RF gas break is formed from one or more of a thermoplastic material or a ceramic material including ceramic matrix composites. 11 . A gas break structure embodied in a machine-readable medium for designing, manufacturing, or testing a design, the gas break structure comprising: a gas break body comprising an insulating material configured to provide a specified impedance, the gas break body having one or more gas flow paths formed within the body and having a particular path geometry, the gas break structure further comprising an internal infill structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. 12 . The gas break structure embodied in the machine readable medium of claim 11 , wherein the one or more gas flow paths have a curved geometry comprising one or more of a helical coil, double helical coil, or spiral geometry. 13 . The system of claim 1 , wherein the one or more gas flow paths comprise a first gas flow path having a first radial distance from a center of the gas break body and a second gas flow path having a second radial distance from the center of the gas break body, wherein the second radial distance is greater than the first radial distance. 14 . The system of claim 1 , wherein the one or more gas flow paths have a n-gon cross section where n is greater than 2. 15 . The system of claim 1 , wherein the internal structure comprises a plurality of rib structures joined by one or more cross members. 16 . The system of claim 1 , wherein the internal structure comprises a coil structure surrounding an interior that is at least partially hollow. 17 . The system of claim 1 , wherein the internal structure corresponds to a particular infill pattern, wherein the infill pattern comprises one or more of a grid pattern, a triangle pattern, a honeycomb pattern, a gyroid pattern, or a stacked wave pattern. 18 . A method of manufacturing a gas break structure, the method comprising: forming, by an additive manufacturing system, a plurality of layers, the plurality of layers comprising: a body having a solid outer surface; two or more gas flow paths defined within the body, wherein the two or more gas flow paths extend along a longitudinal length of the body, each gas flow path having a specified path geometry; and an internal infill structure occupying a portion of the body, the internal infill structure having a specified geometry comprising structural elements and one or more hallow spaces between the structure elements. 19 . The method of claim 18 , wherein forming the plurality of layers comprising the internal infill structure comprises forming a particular infill pattern for the internal infill structure, wherein the infill pattern comprises one or more of a grid pattern, a triangle pattern, a honeycomb pattern, a gyroid pattern, or a stacked wave pattern. 20 . The method of claim 18 , wherein forming the plurality of layers comprises the one or more gas flow paths comprises forming two or more curved paths extending longitudinally from a first end face of the body to a second end face of the body.

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2024339302A1 cover?
Systems, methods, and apparatus including designs embodied in machine-readable media for a gas break used in semiconductor processing systems. The apparatus includes a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H01J37/32449. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).