Cooling base for a substrate support

Patent metadata

Field	Value
Publication number	US-12459071-B2
Application number	US-202418409683-A
Country	US
Kind code	B2
Filing date	Jan 10, 2024
Priority date	Jan 10, 2024
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

In one example, a substrate support assembly having a cooling base that promotes temperature uniformity. In one embodiment, the cooling base has a top plate. The top plate has cooling channels formed therein. The cooling base has a middle plate. The middle plate has a cooling return plenum disposed on a middle layer. A plurality of islands are disposed in the cooling return plenum. The middle plate has a cooling supply plenum disposed below the middle layer. A plurality of cooling inlets are disposed through the islands and couple the cooling supply plenum to the cooling channels. Cooling outlets fluidly couple the cooling channels to the cooling return plenum. The cooling base has a bottom plate. The bottom plate has a cooling inlets fluidly coupled to cooling supply plenum and cooling outlets fluidly coupled to the cooling return plenum.

First claim

What is claimed is:

1 . A cooling base comprising:
a top plate having cooling channels formed therein; a middle plate disposed below the top plate, the middle plate comprising:
a cooling return plenum disposed on a middle layer;
a cooling supply plenum disposed below the middle layer;
a plurality of islands disposed on the middle layer in the cooling return plenum;
a plurality of cooling inlets disposed through the plurality of islands and coupling the cooling supply plenum to the cooling channels; and
a plurality of cooling outlets fluidly coupling the cooling channels to the cooling return plenum; and
a bottom plate disposed below the middle plate, the bottom plate having cooling inlets fluidly coupled to the cooling supply plenum and cooling outlets fluidly coupled to the cooling return plenum.

2 . The cooling base of claim 1 , further comprising:
a first insert disposed in one or more of the cooling inlets of the plurality of cooling inlets wherein the first insert determines fluid flow through the cooling inlet.

3 . The cooling base of claim 1 , further comprising:
a second insert disposed in one or more of the cooling outlets of the plurality of cooling outlets wherein the second insert determines fluid flow through the cooling inlet.

4 . The cooling base of claim 1 , wherein the top plate further comprises:
a plurality of zones in which the cooling channels are arranged, wherein each zone is fluidly isolated from all other zones and is fluidly coupled to 2 or more cooling inlets of the plurality of cooling inlets.

5 . The cooling base of claim 4 , wherein first fluid inlets disposed in a first zone of the plurality of zones has a first opening size through which fluid flows which is different than second fluid inlets disposed in a second zone of the plurality of zones.

6 . The cooling base of claim 4 , wherein cooling fluid flow through a first zone of the plurality of zones is different than cooling fluid flow through a second zone of the plurality of zones.

7 . The cooling base of claim 4 , wherein each zone is fluidly coupled to 2 or more cooling outlets of the plurality of cooling outlets.

8 . The cooling base of claim 7 , wherein the plurality of zones are concentric to one another.

9 . The cooling base of claim 7 , wherein a first number of the cooling outlets in a first zone is less than a second number of the cooling outlets in a second zone.

10 . A substrate support assembly comprising:
a substrate support; a cooling base coupled to the substrate support, the cooling base comprising:
a top plate having cooling channels formed therein;
a middle plate disposed below the top plate, the middle plate comprising:
a cooling return plenum disposed on a middle layer;
a cooling supply plenum disposed below the middle layer;
a plurality of islands disposed on the middle layer in the cooling return plenum;
a plurality of cooling inlets disposed through the plurality of islands and coupling the cooling supply plenum to the cooling channels; and
a plurality of cooling outlets fluidly coupling the cooling channels to the cooling return plenum; and
a bottom plate disposed below the middle plate, the bottom plate having cooling inlets fluidly coupled to the cooling supply plenum and cooling outlets fluidly coupled to the cooling return plenum.

11 . The substrate support assembly of claim 10 , further comprising:
a first insert disposed in one or more of the cooling inlets of the plurality of cooling inlets wherein the first insert determines fluid flow through the cooling inlet.

12 . The substrate support assembly of claim 10 , further comprising:
a second insert disposed in one or more of the cooling outlets of the plurality of cooling outlets wherein the second insert determines fluid flow through the cooling inlet.

13 . The substrate support assembly of claim 10 , wherein the top plate further comprises:
a plurality of zones in which the cooling channels are arranged, wherein each zone is fluidly isolated from all other zones and is fluidly coupled to 2 or more cooling inlets of the plurality of cooling inlets.

14 . The substrate support assembly of claim 13 , wherein first fluid inlets disposed in a first zone of the plurality of zones has a first opening size through which fluid flows which is different than second fluid inlets disposed in a second zone of the plurality of zones.

15 . The cooling base of claim 13 , wherein cooling fluid flow through a first zone of the plurality of zones is different than cooling fluid flow through a second zone of the plurality of zones.

16 . The substrate support assembly of claim 13 , wherein each zone is fluidly coupled to 2 or more cooling outlets of the plurality of cooling outlets.

17 . The substrate support assembly of claim 16 , wherein the plurality of zones are concentric to one another.

18 . The substrate support assembly of claim 17 , wherein a first number of the cooling outlets in a first zone is less than a second number of the cooling outlets in a second zone.

19 . A method for regulating a temperature of a substrate support disposed on a cooling base, the method comprising:
flowing cooling fluid into a cooling fluid supply plenum disposed in a middle plate of the cooling base; flowing the cooling fluid into one of a plurality of cooling channels in a top plate of the cooling base from the cooling fluid supply plenum; and flowing the cooling fluid from the cooling channel through a cooling fluid outlet into a cooling fluid return plenum disposed in the middle plate, wherein the cooling fluid return plenum is vertically adjacent a cooling fluid supply plenum.

20 . The method of claim 19 wherein the cooling channels have three or more cooling fluid inlets and respective cooling fluid outlets and the cooling fluid return plenum is disposed in the cooling base vertically adjacent to the cooling fluid supply plenum.

Assignees

• Applied Materials Inc

Inventors

• Sarode Vishwanath Yogananda
• Kumar Anand

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title

• B23Q3/15

  Devices for holding work using magnetic or electric force acting directly on the work · CPC title

• B23Q11/10 Primary

  Arrangements for cooling or lubricating tools or work · CPC title