Lift pin assembly

Patent metadata

Field	Value
Publication number	US-12444644-B2
Application number	US-202418640411-A
Country	US
Kind code	B2
Filing date	Apr 19, 2024
Priority date	Jul 20, 2017
Publication date	Oct 14, 2025
Grant date	Oct 14, 2025

Abstract

Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.

First claim

The invention claimed is:

1. A lift pin assembly comprising:
a lift pin guide;
a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough that is configured to receive a lift pin suitable for lifting a substrate, wherein the purge cylinder comprises:
a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder that receives the lift pin, wherein each nozzle included in the plurality of nozzles has an outer diameter of about 20 mil to about 80 mil; and

a bushing, wherein the purge cylinder is disposed between the lift pin guide and the bushing.

2. The lift pin assembly of claim 1 , wherein the purge cylinder comprises a ceramic material.

3. The lift pin assembly of claim 1 , wherein the lift pin guide is disposed above the purge cylinder.

4. The lift pin assembly of claim 1 , wherein the lift pin is disposed in the passage, wherein the lift pin is fabricated from sapphire.

5. The lift pin assembly of claim 1 , wherein the plurality of nozzles are disposed in a staggered pattern surrounding the lift pin.

6. The lift pin assembly of claim 1 , wherein the plurality of nozzles comprise at least two nozzles that are disposed at an angle of about 120 degrees to about 180 degrees circumferentially around the lift pin.

7. The lift pin assembly of claim 1 , further comprising a hoop assembly disposed below the purge cylinder.

8. The lift pin assembly of claim 7 , wherein the purge cylinder is disposed between the lift pin guide and the hoop assembly.

9. The lift pin assembly of claim 1 , further comprising a facility plate comprising a conduit, a circumferential plenum, and the purge cylinder, wherein the conduit is fluidly coupled to the circumferential plenum, and the circumferential plenum is fluidly coupled to and disposed radially outward from the plurality of nozzles.

10. A substrate processing assembly comprising:
a substrate support;
a facility plate disposed below the substrate support; and
a lift pin assembly disposed within the substrate support and the facility plate, the lift pin assembly comprising:
a lift pin guide;
a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough that is configured to receive a lift pin suitable for lifting a substrate, wherein the purge cylinder comprises:
a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder that receives the lift pin, wherein each nozzle included in the plurality of nozzles has an outer diameter of about 20 mil to about 80 mil; and
a bushing, wherein the purge cylinder is disposed between the lift pin guide and the bushing.

11. The lift pin assembly of claim 10 , wherein the lift pin is fabricated from sapphire.

12. The lift pin assembly of claim 10 , wherein the plurality of nozzles are disposed in a staggered pattern surrounding the lift pin.

13. The lift pin assembly of claim 10 , wherein the purge cylinder comprises a ceramic material.

14. The lift pin assembly of claim 10 , wherein the purge cylinder is disposed below the lift pin guide.

15. The lift pin assembly of claim 10 , wherein the plurality of nozzles comprise at least two nozzles that are disposed at an angle of about 120 degrees to about 180 degrees circumferentially around the lift pin.

16. The lift pin assembly of claim 10 , further comprising a hoop assembly disposed below the purge cylinder, wherein the purge cylinder is disposed between the lift pin guide and the hoop assembly.

17. A lift pin assembly comprising:
a lift pin guide;
a purge cylinder disposed adjacent the lift pin guide, the lift pin guide and the purge cylinder having a passage formed therethrough, wherein the purge cylinder is disposed below the lift pin guide, and wherein the purge cylinder comprises:
a plurality of nozzles configured to direct a flow of gas radially inward into a portion of the passage disposed in the purge cylinder, wherein each nozzle included in the plurality of nozzles has an outer diameter of about 20 mil to about 80 mil;

a lift pin disposed in the passage and configured to lift a substrate; and
a bushing, wherein the purge cylinder is disposed between the lift pin guide and the bushing.

Assignees

• Applied Materials Inc

Inventors

• Sarode Vishwanath Yogananda
• Kumar Anand

Classifications

• H10P72/0421

  for drying etching · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/0434

  mainly by convection · CPC title