Nested interposer package for ic chips
US-2025323132-A1 · Oct 16, 2025 · US
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Sankman Robert patents
Sankman Robert is listed as an inventor on 62 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sankman Robert |
| Total patents | 62 |
| First publication | Mar 29, 2016 |
| Latest publication | Oct 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
US-2025293117-A1 · Sep 18, 2025 · US
Interconnect architecture with silicon interposer and EMIB
US-12347783-B2 · Jul 1, 2025 · US
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
US-12341080-B2 · Jun 24, 2025 · US
Heterogeneous nested interposer package for ic chips
US-2025201734-A1 · Jun 19, 2025 · US
Heterogeneous nested interposer package for IC chips
US-12272656-B2 · Apr 8, 2025 · US
Programmable logic device with fine-grained disaggregation
US-12206410-B2 · Jan 21, 2025 · US
Heterogeneous nested interposer package for IC chips
US-12199048-B2 · Jan 14, 2025 · US
EMIB patch on glass laminate substrate
US-12148703-B2 · Nov 19, 2024 · US
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
US-2024234245-A1 · Jul 11, 2024 · US
Recent patents
Latest publications not already listed above.
In-package 3D antenna
US-12003023-B2 · Jun 4, 2024 · US
Package on active silicon semiconductor packages
US-11978727-B2 · May 7, 2024 · US
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
US-11978689-B2 · May 7, 2024 · US
Interconnect architecture with silicon interposer and emib
US-2024145395-A1 · May 2, 2024 · US
Heterogeneous nested interposer package for ic chips
US-2024128205-A1 · Apr 18, 2024 · US
Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling
US-11915996-B2 · Feb 27, 2024 · US
Interconnect architecture with silicon interposer and EMIB
US-11901299-B2 · Feb 13, 2024 · US
Heterogeneous nested interposer package for ic chips
US-2024038687-A1 · Feb 1, 2024 · US
Heterogeneous nested interposer package for IC chips
US-11824018-B2 · Nov 21, 2023 · US
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
US-11756860-B2 · Sep 12, 2023 · US
Heterogeneous nested interposer package for IC chips
US-11735533-B2 · Aug 22, 2023 · US
Emib patch on glass laminate substrate
US-2023253332-A1 · Aug 10, 2023 · US
Programmable logic device with fine-grained disaggregation
US-2023198526-A1 · Jun 22, 2023 · US
EMIB patch on glass laminate substrate
US-11658122-B2 · May 23, 2023 · US
Disaggregated die interconnection with on-silicon cavity bridge
US-11652057-B2 · May 16, 2023 · US
Thermal solutions for multi-package assemblies and methods for fabricating the same
US-11652020-B2 · May 16, 2023 · US
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
US-2023140685-A1 · May 4, 2023 · US
Heterogeneous nested interposer package for ic chips
US-2023134049-A1 · May 4, 2023 · US
Interconnect architecture with silicon interposer and emib
US-2023107106-A1 · Apr 6, 2023 · US
Connectivity between integrated circuit dice in a multi-chip package
US-11610856-B2 · Mar 21, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 62 |
| Ma Qing | 1 |
| Rao Valluri | 1 |
| Eid Feras | 1 |
| Lin Kevin | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 52 |
| H10W90/724 | 37 |
| H10W72/252 | 37 |
| H10W70/611 | 35 |
| H10W90/722 | 34 |