Thermal solutions for multi-package assemblies and methods for fabricating the same

Patent metadata

Field	Value
Publication number	US-11652020-B2
Application number	US-201916425264-A
Country	US
Kind code	B2
Filing date	May 29, 2019
Priority date	May 29, 2019
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

Integrated circuit assemblies, electronic systems, and methods for fabricating the same are disclosed. An integrated circuit assembly is formed by thermally contacting at least two integrated circuit packages to opposite sides of a shared heat dissipation device. In one embodiment, the at least two integrated circuit packages are electrically attached to an electronic card to form an intermediate integrated circuit assembly. In a further embodiment, the integrated circuit assembly includes at least one intermediate integrated circuit assembly electrically attached to an electronic board.

First claim

What is claimed is:

1. An integrated circuit (IC) assembly, comprising first, second, third, and fourth IC packages each comprising an IC device, an electronic substrate, and a heat spreader, wherein a first surface of the IC device is electrically attached to the electronic substrate, and an opposing second surface of the IC device thermally contacts the heat spreader;
a liquid cooling heat dissipation device having a first surface and an opposing second surface, wherein the heat spreaders of the first and third IC packages are in thermal contact with the first surface of the liquid cooling heat dissipation device and wherein the heat spreaders of the second and fourth IC packages are in thermal contact with the second surface of the liquid cooling heat dissipation device;
a first securing mechanism comprising first and second plates, wherein the first IC package, the second IC package, and a first portion of the liquid cooling heat dissipation device are between the first and second plates of the first securing mechanism; and
a second securing mechanism comprising first and second plates, wherein the third IC package, the fourth IC package, and a second portion of the liquid cooling heat dissipation device are between the first and second plates of the second securing mechanism, and wherein high surface area projections of the liquid cooling heat dissipation device are between the first and third IC packages and between the second and fourth IC packages.

2. The integrated circuit assembly of claim 1 , wherein the liquid cooling heat dissipation device comprises a cold plate in thermal contact with the heat spreader of the first and second IC packages, and wherein the cold plate comprises a fluid chamber therein.

3. The integrated circuit assembly of claim 1 , wherein the liquid cooling heat dissipation device comprises a heat pipe.

4. The integrated circuit assembly of claim 1 , wherein the first and second plates of the first securing mechanism are connected by one or more first rods, and wherein the first and second plates of the second securing mechanism are connected by one or more second rods.

5. The integrated circuit assembly of claim 4 , further comprising:
an electronic card, wherein the electronic substrate of the first IC package and the electronic substrate of the second IC package are electrically attached to the electronic card; and
an electronic board, wherein the electronic card is electrically attached to the electronic board.

6. The integrated circuit assembly of claim 5 , further comprising:
a second electronic card, wherein the electronic substrate of the third IC package and the electronic substrate of the fourth IC package are electrically attached to the second electronic card, and wherein the second electronic card is electrically attached to the electronic board.

7. An electronic system, comprising:
an integrated circuit (IC) assembly electrically attached to a board, wherein the integrated circuit assembly comprises:
first, second, third, and fourth IC packages each comprising an IC device, an electronic substrate, and a heat spreader, wherein a first surface of the IC device is electrically attached to the electronic substrate, and an opposing second surface of the IC device thermally contacts the heat spreader;
a liquid cooling heat dissipation device having a first surface and an opposing second surface, wherein the heat spreaders of the first and third IC packages are in thermal contact with the first surface of the liquid cooling heat dissipation device and wherein the heat spreaders of the second and fourth IC packages are in thermal contact with the second surface of the liquid cooling heat dissipation device;
a first securing mechanism comprising first and second plates, wherein the first IC package, the second IC package, and a first portion of the liquid cooling heat dissipation device are between the first and second plates of the first securing mechanism; and
a second securing mechanism comprising first and second plates, wherein the third IC package, the fourth IC package, and a second portion of the liquid cooling heat dissipation device are between the first and second plates of the second securing mechanism, and wherein high surface area projections of the liquid cooling heat dissipation device are between the first and third IC packages and between the second and fourth IC packages.

8. The electronic system of claim 7 , wherein the liquid cooling heat dissipation device comprises a cold plate in thermal contact with the heat spreader of the first and second IC packages, and wherein the cold plate comprises a fluid chamber therein.

9. The electronic system of claim 7 , wherein the liquid cooling heat dissipation device comprises a heat pipe.

10. The electronic system of claim 7 , wherein the first and second plates of the first securing mechanism are connected by one or more first rods, and wherein the first and second plates of the second securing mechanism are connected by one or more second rods.

11. The electronic system of claim 10 , further comprising:
an electronic card, wherein the electronic substrate of the first IC package and the electronic substrate of the second IC package are electrically attached to the electronic card, and wherein the electronic card is electrically attached to the board.

12. The electronic system of claim 11 , further comprising:
a second electronic card, wherein the electronic substrate of the third IC package and the electronic substrate of the fourth IC package are electrically attached to the second electronic card, and wherein the second electronic card is electrically attached to the board.

13. A method for fabricating an integrated circuit assembly, comprising:
forming first, second, third, and fourth IC packages each comprising an IC device, an electronic substrate, and a heat spreader, wherein a first surface of the IC device is attached to the electronic substrate, and an opposing second surface of the IC device thermally contacts the heat spreader;
receiving a liquid cooling heat dissipation device having a first surface and an opposing second surface;
thermally contacting the heat spreader of the first and third IC packages with the first surface of the liquid cooling heat dissipation device and thermally contacting the heat spreader of the second and fourth IC integrated circuit packages with the second surface of the liquid cooling heat dissipation device;
providing a first securing mechanism comprising first and second plates, wherein the first IC package, the second IC package, and a first portion of the liquid cooling heat dissipation device are between the first and second plates of the first securing mechanism;
providing a second securing mechanism comprising first and second plates, wherein the third IC package, the fourth IC package, and a second portion of the liquid cooling heat dissipation device are between the first and second plates of the second securing mechanism, and wherein high surface area projections of the liquid cooling heat dissipation device are between the first and third IC packages and between the second and fourth IC packages.

14. The method of claim 13 , wherein the liquid cooling heat dissipation device comprises a cold plate in thermal contact with the heat spreader of the first and second IC packages, and wherein the cold plate comprises a fluid chamber therein.

15. The method of claim 13 , wherein the liquid cooling heat dissipation device comprises a heat pipe.

16. The method of claim 13 , wherein the first and second plates of the first securing mechanism are

Assignees

• Intel Corp

Inventors

• Chiu Chia-Pin
• Sankman Robert

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title