Solid state drive multi-card adapter with integrated processing
US-12530154-B2 · Jan 20, 2026 · US
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Ping Zhan patents
Ping Zhan is listed as an inventor on 69 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ping Zhan |
| Total patents | 69 |
| First publication | Apr 30, 2015 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Advanced thermal control for ssd
US-2025181127-A1 · Jun 5, 2025 · US
Multi-protocol IO infrastructure for a flexible storage platform
US-12321296-B2 · Jun 3, 2025 · US
Active disturbance rejection based thermal control
US-12197259-B2 · Jan 14, 2025 · US
Advanced thermal control for SSD
US-12197260-B2 · Jan 14, 2025 · US
Adaptive multipath fabric for balanced performance and high availability
US-12181984-B2 · Dec 31, 2024 · US
Multi-protocol io infrastructure for a flexible storage platform
US-2024168903-A1 · May 23, 2024 · US
Multi-protocol IO infrastructure for a flexible storage platform
US-11907150-B2 · Feb 20, 2024 · US
Solid state drive multi-card adapter with integrated processing
US-2024012582-A1 · Jan 11, 2024 · US
Advanced thermal control for ssd
US-2023376094-A1 · Nov 23, 2023 · US
Recent patents
Latest publications not already listed above.
Active disturbance rejection based thermal control
US-2023333613-A1 · Oct 19, 2023 · US
Adaptive multipath fabric for balanced performance and high availability
US-2023325288-A1 · Oct 12, 2023 · US
Solid state drive multi-card adapter with integrated processing
US-11775224-B2 · Oct 3, 2023 · US
Solid state drive multi-card adapter with integrated processing
US-2023289104-A1 · Sep 14, 2023 · US
Advanced thermal control for SSD
US-11755085-B2 · Sep 12, 2023 · US
Active disturbance rejection based thermal control
US-11709528-B2 · Jul 25, 2023 · US
Adaptive multipath fabric for balanced performance and high availability
US-11693747-B2 · Jul 4, 2023 · US
Solid state drive multi-card adapter with integrated processing
US-11650764-B2 · May 16, 2023 · US
Advanced thermal control for ssd
US-2022326748-A1 · Oct 13, 2022 · US
Advanced thermal control for SSD
US-11460898-B2 · Oct 4, 2022 · US
Modular ngsff module to meet different density and length requirements
US-2022261610-A1 · Aug 18, 2022 · US
Modular NGSFF module to meet different density and length requirements
US-11263508-B2 · Mar 1, 2022 · US
Multi-protocol io infrastructure for a flexible storage platform
US-2021263871-A1 · Aug 26, 2021 · US
Solid state drive multi-card adapter with integrated processing
US-2021208821-A1 · Jul 8, 2021 · US
Multi-protocol IO infrastructure for a flexible storage platform
US-11003609-B2 · May 11, 2021 · US
Solid state drive multi-card adapter with integrated processing
US-10996896-B2 · May 4, 2021 · US
Solid state drive multi-card adapter with integrated processing
US-2021055889-A1 · Feb 25, 2021 · US
Active disturbance rejection based thermal control
US-2021004067-A1 · Jan 7, 2021 · US
Multi-protocol io infrastructure for a flexible storage platform
US-2020379933-A1 · Dec 3, 2020 · US
Solid state drive multi-card adapter with integrated processing
US-2020364000-A1 · Nov 19, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 68 |
| Ping Zhan | 2 |
| Samsung Electronics Ltd | 2 |
| WORLEY Fred | 1 |
| Rogers Harry | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F13/4022 | 38 |
| G06F13/4282 | 33 |
| G06F13/387 | 28 |
| G06F2213/0026 | 26 |
| G06F2213/0032 | 25 |