Active disturbance rejection based thermal control

Patent metadata

Field	Value
Publication number	US-12197259-B2
Application number	US-202318213704-A
Country	US
Kind code	B2
Filing date	Jun 23, 2023
Priority date	Mar 13, 2017
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

A system and method for active disturbance rejection based thermal control is configured to receive, at a first active disturbance rejection thermal control (ADRC) controller, a first temperature measurement from a first thermal zone. The ADRC controller generates a first output control signal for controlling a first cooling element, wherein the first output control signal is generated according a first estimated temperature and a first estimated disturbance calculated by a first extended state observer (ESO) of the first ADRC controller.

First claim

What is claimed is:

1. A method comprising:
calculating, by a controller, an estimated temperature and an estimated disturbance for a thermal zone according to a temperature measurement; and
controlling, by the controller, a temperature of the thermal zone according to the estimated temperature and the estimated disturbance, the estimated disturbance corresponding to an impact on the temperature of the thermal zone of an unknown task workload of one or more devices located in the thermal zone.

2. The method of claim 1 , further comprising receiving, by the controller, a temperature measurement from the thermal zone,
wherein the estimated temperature and the estimated disturbance is calculated based on the temperature measurement.

3. The method of claim 1 , wherein the one or more devices comprise at least one of a solid state drive (SSD), a processor, or a graphics processing unit.

4. The method of claim 1 , further comprising:
comparing, by the controller, a temperature measurement from the thermal zone with a target temperature of the thermal zone; and
calculating, by the controller, a temperature tracking error according to the comparing.

5. The method of claim 4 , wherein to control the temperature of the thermal zone, the method further comprises generating, by the controller, an output control signal to control a cooling element associated with the thermal zone, the output control signal being generated according to the temperature tracking error, the estimated temperature, and the estimated disturbance.

6. The method of claim 1 , wherein the controller comprises an extended state observer (ESO) configured to output a control signal as a function of outputs of the ESO to control a cooling element associated with the thermal zone.

7. The method of claim 6 , wherein the ESO is configured to operate according to a max temperature reading from the thermal zone, an estimation of the max temperature reading from the thermal zone, an estimation of a total disturbance, the control signal, an observer gain, and at least one tunable parameter.

8. The method of claim 7 , wherein the observer gain is inversely proportional to values of a tunable observer bandwidth and a sampling time.

9. A storage server comprising a controller configured to:
calculate an estimated temperature and an estimated disturbance for a thermal zone according to a temperature measurement; and
control a temperature of the thermal zone according to the estimated temperature and the estimated disturbance, the estimated disturbance corresponding to an impact on the temperature of the thermal zone of an unknown task workload of one or more devices located in the thermal zone.

10. The storage server of claim 9 , wherein the controller is further configured to receive a temperature measurement from the thermal zone,
wherein the estimated temperature and the estimated disturbance is calculated based on the temperature measurement.

11. The storage server of claim 9 , wherein the one or more devices comprise at least one of a solid state drive (SSD), a processor, or a graphics processing unit.

12. The storage server of claim 9 , wherein the controller is further configured to:
compare a temperature measurement from the thermal zone with a target temperature of the thermal zone; and
calculate a temperature tracking error according to the comparing.

13. The storage server of claim 12 , wherein to control the temperature of the thermal zone, the controller is further configured to generate an output control signal to control a cooling element associated with the thermal zone, the output control signal being generated according to the temperature tracking error, the estimated temperature, and the estimated disturbance.

14. The storage server of claim 9 , wherein the controller comprises an extended state observer (ESO) configured to output a control signal as a function of outputs of the ESO to control a cooling element associated with the thermal zone.

15. The storage server of claim 14 , wherein the ESO is configured to operate according to a max temperature reading from the thermal zone, an estimation of the max temperature reading from the thermal zone, an estimation of a total disturbance, the control signal, an observer gain, and at least one tunable parameter.

16. The storage server of claim 15 , wherein the observer gain is inversely proportional to values of a tunable observer bandwidth and a sampling time.

17. A datacenter comprising:
a device in a thermal zone; and
a controller configured to:
calculate an estimated temperature and an estimated disturbance for the thermal zone according to a temperature measurement; and
control a temperature of the thermal zone according to the estimated temperature and the estimated disturbance,

wherein the estimated disturbance corresponds to an impact on the temperature of the thermal zone of an unknown task workload sent to the device located in the thermal zone.

18. The datacenter of claim 17 , wherein the device comprises at least one of a solid state drive (SSD), a processor, or a graphics processing unit.

19. The datacenter of claim 17 , wherein the controller is further configured to:
compare a temperature measurement from the thermal zone with a target temperature of the thermal zone; and
calculate a temperature tracking error according to the comparing.

20. The datacenter of claim 19 , wherein to control the temperature of the thermal zone, the controller is further configured to generate an output control signal to control a cooling element associated with the thermal zone, the output control signal being generated according to the temperature tracking error, the estimated temperature, and the estimated disturbance.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Ping Zhan
• Zheng Qinling

Classifications

• G06F3/0616

  in relation to life time, e.g. increasing Mean Time Between Failures [MTBF] · CPC title

• G06F3/0679

  Non-volatile semiconductor memory device, e.g. flash memory, one time programmable memory [OTP] · CPC title

• G06F3/0625

  Power saving in storage systems · CPC title

• G05D23/1934

  each space being provided with one sensor acting on one or more control means · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title