Storage array including a bridge module interconnect to provide bridge connections to different protocol bridge protocol modules
US-10467170-B2 · Nov 5, 2019 · US
US11263508B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11263508-B2 |
| Application number | US-201715853669-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 22, 2017 |
| Priority date | Sep 22, 2017 |
| Publication date | Mar 1, 2022 |
| Grant date | Mar 1, 2022 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An assembly for a solid-state drive (SSD) includes a base printed circuit board having a PCIe adapter form factor, and at least one U.2 connector that is capable of being connected to a NGSFF device. The NGSFF device includes an NGSFF PCB, a first PCIe connector and a second PCIe connector. The NGSFF PCB is capable of receiving at least one SSD device and includes a first end and a second end in which the first end is opposite the second end. The first PCIe connector is at an edge of the first end of the NGSFF PCB and is capable of physical insertion into the at least one U.2 connector on the base PCB, and the second PCIe connector is at an edge of the second end of the NGSFF PCB and is capable of receiving a first PCIe connector of another NGSFF PCB.
Opening claim text (preview).
What is claimed is: 1. An assembly for a solid-state drive (SSD), comprising: a peripheral component interconnect express (PCIe) adapter card comprising a base printed circuit board (PCB) having a card-edge connector to insert into a mating connector on a host device; a first U.2 connector to connect a first memory module device; and a second U.2 connector to connect a second memory module device; wherein the first and second U.2 connectors are arranged on the base PCB to position the first and second memory module devices parallel on the base PCB; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; wherein the first memory module device comprises: a second PCB to receive at least one SSD device, the second PCB comprising a first end and a second end, the first end being opposite the second end; a first PCIe connector at an edge of the first end of the second PCB, the first PCIe connector arranged to be physically inserted into the first U.2 connector on the base PCB; a second PCIe connector at an edge of the second end of the second PCB, the second PCIe connector to receive a first PCIe connector of another second PCB; and wherein the first memory module device is hot swappable to the base PCB. 2. The assembly of claim 1 , further comprising at least one SSD device. 3. The assembly of claim 1 , wherein the first PCIe connector includes a plurality of PCIe lanes. 4. The assembly of claim 1 , wherein the PCIe adapter card comprises a half height, half length (HHHL) form factor. 5. The assembly of claim 1 , wherein the PCIe adapter card further comprises a panel comprising an opening through which a memory module device is hot swappable to the first U.2 connector on the PCIe adapter card. 6. The assembly of claim 1 , further comprising a controller configured to control an in-rush to the first memory module device. 7. An assembly for a solid-state drive (SSD), comprising: a peripheral component interconnect express (PCIe) adapter card comprising a base printed circuit board (PCB) having a card-edge connector to insert into a mating connector on a host device; a first U.2 connector to connect a first memory module device; a second U.2 connector to connect a second memory module device; and at least one SSD device; wherein the first and second U.2 connectors are arranged on the base PCB to position the first and second memory module devices parallel on the base PCB; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; wherein the first memory module device comprises: a second PCB to receive the at least one SSD device, the second PCB comprising a first end and a second end, the first end being opposite the second end; a first PCIe connector at an edge of the first end of the second PCB, the first PCIe connector arranged to be physically inserted into the first U.2 connector on the base PCB; and a second PCIe connector at an edge of the second end of the second PCB, the second PCIe connector to receive a first PCIe connector of another second PCB; and wherein the second PCB is hot swappable to the base PCB. 8. A solid-state drive (SSD) assembly, comprising: a base printed circuit board (PCB) comprising a peripheral component interconnect express (PCIe) form factor, a first U.2 connector, a second U.2 connector, and a card-edge connector capable of being inserted into a mating connector on a host device; and a first memory module device, the first memory module device comprising: a second PCB capable of receiving at least one SSD device, the second PCB comprising a first end and a second end, the first end being opposite the second end; a first PCIe connector at an edge of the first end of the second PCB, the first PCIe connector being capable of physical insertion into the first U.2 connector on the base PCB; and a second PCIe connector at an edge of the second end of the second PCB, the second PCIe connector being capable of receiving a first PCIe connector of another second PCB; wherein the first and second U.2 connectors are arranged on the base PCB to position the first memory module device and a second memory module device parallel on the base PCB; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; and wherein the first memory module device is hot swappable to the base PCB. 9. The SSD assembly of claim 8 , wherein the first PCIe connector includes a plurality of PCIe lanes, and wherein the second PCIe connector includes a plurality of PCIe lanes. 10. The SSD assembly of claim 8 , wherein the base PCB comprises a PCIe adapter card. 11. The SSD assembly of claim 9 , wherein the base PCB comprises a PCIe adapter card. 12. The SSD assembly of claim 10 , wherein the PCIe adapter card comprises a half height, half length (HHHL) form factor. 13. The SSD assembly of claim 10 , wherein the PCIe adapter card further comprises a panel comprising an opening through which the first memory module device is hot swappable to the first U.2 connector. 14. A solid-state drive (SSD) assembly, comprising: a peripheral component interconnection express (PCIe) adapter card comprising a first U.2 connector and a second U.2 connector, the PCIe adapter card further comprising a card-edge connector capable of being inserted into a mating connector on a host device; and a first base PCB and a second base PCB, each base PCB comprising: a first end and a second end, the first end being opposite the second end, the first end being configured to connect to one of the U.2 connectors on the PCIe adapter card; at least one SSD device; and a first PCIe connector at an edge of the second end of the first or second base PCB, the first PCIe connector being capable of receiving a second PCIe connector of a third base PCB; wherein the first and second U.2 connectors are arranged on the PCIe adapter card to position the first and second base PCBs parallel on the PCIe adapter card; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; and wherein at least one base PCB is hot swappable to one of the U.2 connectors on the PCIe adapter card. 15. The SSD assembly of claim 14 , wherein the first U.2 connector includes a plurality of PCIe lanes, and wherein the second U.2 connector includes a plurality of PCIe lanes. 16. The SSD assembly of claim 15 , wherein the PCIe adapter card comprises a half height, half length (HHHL) form factor. 17. The SSD assembly of claim 16 , wherein the PCIe adapter card further comprises a panel comprising an opening through which the at least one base PCB is hot swappable.
for adaptation of different data processing systems to different peripheral devices, e.g. protocol converters for incompatible systems, open system · CPC title
structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title
the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks (housings for electrical equipment in general, see H05K5/02) · CPC title
Live connection to bus, e.g. hot-plugging (current or voltage limitation during live insertion H02H9/004) · CPC title
Mounting of fixed or removable disk drives · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.