Modular NGSFF module to meet different density and length requirements

US11263508B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11263508-B2
Application numberUS-201715853669-A
CountryUS
Kind codeB2
Filing dateDec 22, 2017
Priority dateSep 22, 2017
Publication dateMar 1, 2022
Grant dateMar 1, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An assembly for a solid-state drive (SSD) includes a base printed circuit board having a PCIe adapter form factor, and at least one U.2 connector that is capable of being connected to a NGSFF device. The NGSFF device includes an NGSFF PCB, a first PCIe connector and a second PCIe connector. The NGSFF PCB is capable of receiving at least one SSD device and includes a first end and a second end in which the first end is opposite the second end. The first PCIe connector is at an edge of the first end of the NGSFF PCB and is capable of physical insertion into the at least one U.2 connector on the base PCB, and the second PCIe connector is at an edge of the second end of the NGSFF PCB and is capable of receiving a first PCIe connector of another NGSFF PCB.

First claim

Opening claim text (preview).

What is claimed is: 1. An assembly for a solid-state drive (SSD), comprising: a peripheral component interconnect express (PCIe) adapter card comprising a base printed circuit board (PCB) having a card-edge connector to insert into a mating connector on a host device; a first U.2 connector to connect a first memory module device; and a second U.2 connector to connect a second memory module device; wherein the first and second U.2 connectors are arranged on the base PCB to position the first and second memory module devices parallel on the base PCB; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; wherein the first memory module device comprises: a second PCB to receive at least one SSD device, the second PCB comprising a first end and a second end, the first end being opposite the second end; a first PCIe connector at an edge of the first end of the second PCB, the first PCIe connector arranged to be physically inserted into the first U.2 connector on the base PCB; a second PCIe connector at an edge of the second end of the second PCB, the second PCIe connector to receive a first PCIe connector of another second PCB; and wherein the first memory module device is hot swappable to the base PCB. 2. The assembly of claim 1 , further comprising at least one SSD device. 3. The assembly of claim 1 , wherein the first PCIe connector includes a plurality of PCIe lanes. 4. The assembly of claim 1 , wherein the PCIe adapter card comprises a half height, half length (HHHL) form factor. 5. The assembly of claim 1 , wherein the PCIe adapter card further comprises a panel comprising an opening through which a memory module device is hot swappable to the first U.2 connector on the PCIe adapter card. 6. The assembly of claim 1 , further comprising a controller configured to control an in-rush to the first memory module device. 7. An assembly for a solid-state drive (SSD), comprising: a peripheral component interconnect express (PCIe) adapter card comprising a base printed circuit board (PCB) having a card-edge connector to insert into a mating connector on a host device; a first U.2 connector to connect a first memory module device; a second U.2 connector to connect a second memory module device; and at least one SSD device; wherein the first and second U.2 connectors are arranged on the base PCB to position the first and second memory module devices parallel on the base PCB; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; wherein the first memory module device comprises: a second PCB to receive the at least one SSD device, the second PCB comprising a first end and a second end, the first end being opposite the second end; a first PCIe connector at an edge of the first end of the second PCB, the first PCIe connector arranged to be physically inserted into the first U.2 connector on the base PCB; and a second PCIe connector at an edge of the second end of the second PCB, the second PCIe connector to receive a first PCIe connector of another second PCB; and wherein the second PCB is hot swappable to the base PCB. 8. A solid-state drive (SSD) assembly, comprising: a base printed circuit board (PCB) comprising a peripheral component interconnect express (PCIe) form factor, a first U.2 connector, a second U.2 connector, and a card-edge connector capable of being inserted into a mating connector on a host device; and a first memory module device, the first memory module device comprising: a second PCB capable of receiving at least one SSD device, the second PCB comprising a first end and a second end, the first end being opposite the second end; a first PCIe connector at an edge of the first end of the second PCB, the first PCIe connector being capable of physical insertion into the first U.2 connector on the base PCB; and a second PCIe connector at an edge of the second end of the second PCB, the second PCIe connector being capable of receiving a first PCIe connector of another second PCB; wherein the first and second U.2 connectors are arranged on the base PCB to position the first memory module device and a second memory module device parallel on the base PCB; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; and wherein the first memory module device is hot swappable to the base PCB. 9. The SSD assembly of claim 8 , wherein the first PCIe connector includes a plurality of PCIe lanes, and wherein the second PCIe connector includes a plurality of PCIe lanes. 10. The SSD assembly of claim 8 , wherein the base PCB comprises a PCIe adapter card. 11. The SSD assembly of claim 9 , wherein the base PCB comprises a PCIe adapter card. 12. The SSD assembly of claim 10 , wherein the PCIe adapter card comprises a half height, half length (HHHL) form factor. 13. The SSD assembly of claim 10 , wherein the PCIe adapter card further comprises a panel comprising an opening through which the first memory module device is hot swappable to the first U.2 connector. 14. A solid-state drive (SSD) assembly, comprising: a peripheral component interconnection express (PCIe) adapter card comprising a first U.2 connector and a second U.2 connector, the PCIe adapter card further comprising a card-edge connector capable of being inserted into a mating connector on a host device; and a first base PCB and a second base PCB, each base PCB comprising: a first end and a second end, the first end being opposite the second end, the first end being configured to connect to one of the U.2 connectors on the PCIe adapter card; at least one SSD device; and a first PCIe connector at an edge of the second end of the first or second base PCB, the first PCIe connector being capable of receiving a second PCIe connector of a third base PCB; wherein the first and second U.2 connectors are arranged on the PCIe adapter card to position the first and second base PCBs parallel on the PCIe adapter card; wherein the first and second U.2 connectors are substantially perpendicular to the card-edge connector; and wherein at least one base PCB is hot swappable to one of the U.2 connectors on the PCIe adapter card. 15. The SSD assembly of claim 14 , wherein the first U.2 connector includes a plurality of PCIe lanes, and wherein the second U.2 connector includes a plurality of PCIe lanes. 16. The SSD assembly of claim 15 , wherein the PCIe adapter card comprises a half height, half length (HHHL) form factor. 17. The SSD assembly of claim 16 , wherein the PCIe adapter card further comprises a panel comprising an opening through which the at least one base PCB is hot swappable.

Assignees

Inventors

Classifications

  • G06F13/387Primary

    for adaptation of different data processing systems to different peripheral devices, e.g. protocol converters for incompatible systems, open system · CPC title

  • structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

  • the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks (housings for electrical equipment in general, see H05K5/02) · CPC title

  • Live connection to bus, e.g. hot-plugging (current or voltage limitation during live insertion H02H9/004) · CPC title

  • G06F1/187Primary

    Mounting of fixed or removable disk drives · CPC title

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What does patent US11263508B2 cover?
An assembly for a solid-state drive (SSD) includes a base printed circuit board having a PCIe adapter form factor, and at least one U.2 connector that is capable of being connected to a NGSFF device. The NGSFF device includes an NGSFF PCB, a first PCIe connector and a second PCIe connector. The NGSFF PCB is capable of receiving at least one SSD device and includes a first end and a second end i…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification G06F13/387. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 01 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).