Stacked structure and semiconductor manufacturing apparatus member
US-12315757-B2 · May 27, 2025 · US
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Nishimura Noboru patents
Nishimura Noboru is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nishimura Noboru |
| Total patents | 21 |
| First publication | Jul 2, 2015 |
| Latest publication | May 27, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body
US-11845697-B2 · Dec 19, 2023 · US
Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device
US-11548829-B2 · Jan 10, 2023 · US
Sintered compact, circuit component, and method of producing sintered compact
US-11332410-B2 · May 17, 2022 · US
Stacked structure and semiconductor manufacturing apparatus member
US-2021305083-A1 · Sep 30, 2021 · US
Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device
US-2021230074-A1 · Jul 29, 2021 · US
Ceramic structure, member for substrate-holding apparatus, and method for producing the ceramic structure
US-11011404-B2 · May 18, 2021 · US
Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body
US-2020407279-A1 · Dec 31, 2020 · US
Ceramic structure, method for manufacturing the same, and member for semiconductor manufacturing apparatus
US-10863587-B2 · Dec 8, 2020 · US
Container conveyor system
US-10800611-B2 · Oct 13, 2020 · US
Recent patents
Latest publications not already listed above.
Sintered compact, circuit component, and method of producing sintered compact
US-2020165168-A1 · May 28, 2020 · US
Member for semiconductor manufacturing apparatus, method for producing the same, and heater including shaft
US-10631370-B2 · Apr 21, 2020 · US
Container conveyor system
US-2019329985-A1 · Oct 31, 2019 · US
Bonding material composition, aluminum nitride bonded body, and method for producing the same
US-10293581-B2 · May 21, 2019 · US
Ceramic structure, method for manufacturing the same, and member for semiconductor manufacturing apparatus
US-2017251524-A1 · Aug 31, 2017 · US
Member for semiconductor manufacturing apparatus, method for producing the same, and heater including shaft
US-2017127475-A1 · May 4, 2017 · US
Ceramic structure, member for substrate-holding apparatus, and method for producing the ceramic structure
US-2017117175-A1 · Apr 27, 2017 · US
Bonding material composition, aluminum nitride bonded body, and method for producing the same
US-2016361900-A1 · Dec 15, 2016 · US
Bonding material composition, aluminum nitride bonded body, and method for producing the same
US-9481813-B2 · Nov 1, 2016 · US
Ceramic member and member for semiconductor manufacturing equipment
US-9177847-B2 · Nov 3, 2015 · US
Bonding material composition, aluminum nitride bonded body, and method for producing the same
US-2015184030-A1 · Jul 2, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ngk Insulators Ltd | 19 |
| Shibuya Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C04B2237/366 | 10 |
| C04B2235/3217 | 8 |
| C04B2235/77 | 8 |
| C04B2235/6567 | 8 |
| C04B2235/96 | 8 |