Ceramic structure, method for manufacturing the same, and member for semiconductor manufacturing apparatus

Patent metadata

Field	Value
Publication number	US-10863587-B2
Application number	US-201715425098-A
Country	US
Kind code	B2
Filing date	Feb 6, 2017
Priority date	Feb 29, 2016
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A ceramic structure 10 includes a heater electrode 14 within a disk-shaped AlN ceramic substrate 12. The heater electrode 14 contains a metal filler in the main component WC. The metal filler (such as Ru or RuAl) has a lower resistivity and a higher thermal expansion coefficient than AlN. An absolute value of a difference |ΔCTE| between a thermal expansion coefficient of the AlN ceramic substrate 12 and a thermal expansion coefficient of the heater electrode 14 at a temperature in the range of 40° C. to 1000° C. is 0.35 ppm/° C. or less.

First claim

What is claimed is:

1. A ceramic structure including a heater electrode on a surface of or within an AlN ceramic substrate containing 50% or more by volume of AlN as a main component,
wherein the heater electrode contains WC as a main component and, in addition, a metal filler, the metal filler has a lower resistivity and a higher thermal expansion coefficient than AlN,
an absolute value of a difference between a thermal expansion coefficient of the AlN ceramic substrate and a thermal expansion coefficient of the heater electrode at a temperature in a range of 40° C. to 1000° C. is 0.35 ppm/° C. or less.

2. The ceramic structure according to claim 1 , wherein the metal filler is Ru or a Ru alloy.

3. The ceramic structure according to claim 1 , wherein the metal filler is RuAl.

4. The ceramic structure according to claim 1 ,
wherein the heater electrode has a resistivity of 3.0×10 −5 Ωcm or less at a room temperature.

5. A member for a semiconductor manufacturing apparatus including the ceramic structure according to claim 1 .

6. A method for manufacturing a ceramic structure including:
placing a heater electrode containing WC as a main component and, in addition, a metal filler on a surface of a first substrate of an AlN sintered body, calcined body, or formed body each containing 50% or more by volume of AlN as a main component,
placing a second substrate of AlN sintered body, calcined body, or formed body, each containing 50% or more by volume of AlN as a main component thereon to form a layered body, and hot-press firing the layered body to form the ceramic structure,
wherein the metal filler has a lower resistivity and a higher thermal expansion coefficient than AlN, and an absolute value of a difference between a thermal expansion coefficient of the AlN ceramic substrate and a thermal expansion coefficient of the heater electrode at a temperature in a range of 40° C. to 1000° C. is 0.35 ppm/° C. or less.

7. The method for manufacturing a ceramic structure according to claim 6 ,
wherein the metal filler is Ru or Ru alloy, and the amount of the metal filler is determined such that an absolute value of a difference between a thermal expansion coefficient of the AlN ceramic substrate and a thermal expansion coefficient of the heater electrode at a temperature in a range of 40° C. to 1000° C. is 0.35 ppm/° C. or less.

Assignees

• Ngk Insulators Ltd

Inventors

• Atsuji Kyohei
• Nishimura Noboru
• Katsuda Yuji

Classifications

• H10P72/0432

  mainly by conduction · CPC title

• H05B3/143 Primary

  applied to semiconductors, e.g. wafers heating (H05B3/0047 takes precedence) · CPC title

• H05B3/12

  characterised by the composition or nature of the conductive material · CPC title

• C04B2237/68

  Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode · CPC title

• C04B2237/84

  Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube · CPC title