Bonding material composition, aluminum nitride bonded body, and method for producing the same

US9481813B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9481813-B2
Application numberUS-201414561449-A
CountryUS
Kind codeB2
Filing dateDec 5, 2014
Priority dateDec 27, 2013
Publication dateNov 1, 2016
Grant dateNov 1, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A first bonding material composition according to the present invention is a bonding material composition used when aluminum nitride sintered bodies containing a rare-earth metal oxide are bonded to each other, in which the bonding immaterial composition contains, in addition, to an O element-containing aluminum nitride raw material, (a) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, or (b) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide.

First claim

Opening claim text (preview).

What is claimed is: 1. A bonding material composition used when aluminum nitride sintered bodies containing a rare-earth metal oxide are bonded to each other, wherein the bonding material composition contains in addition to an O element-containing aluminum nitride raw material, (a) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, or (b) as a fluorine compound,, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide. 2. The bonding material composition according to claim 1 , wherein the content of O element in the aluminum nitride raw material is 0.4% to 30% by mass. 3. The bonding material composition according to claim 1 , containing an amount of 20% to 85% by mass of aluminum nitride (excluding the oxygen content in terms of Al 2 O 3 ) and an amount of 10% to 50% by mass of the fluorine compound. 4. The bonding material composition according claim 1 , having an aluminum oxide content of 0.4% to 60% by mass, including a value obtained by calculating the content of O element in the aluminum nitride raw material in terms of Al 2 O 3 . 5. The bonding material composition according to claim 4 , containing a rare-earth metal oxide in an amount of 40% to 150% by mass with respect to Al 2 O 3 content (including a value obtained by calculating O element in the aluminum nitride raw material in terms of Al 2 O 3 ). 6. A method for producing an aluminum nitride bonded body in which the aluminum nitride sintered bodies are bonded to each other, including; sandwiching the bonding material composition according to claim 1 between aluminum nitride sintered bodies and heating the resulting assembly at 1450° C. or lower with a bonding load applied. 7. A bonding material composition used when an aluminum nitride sintered body free from a rare-earth metal oxide is bonded to an aluminum nitride sintered body that contains or does not contain a rare-earth metal oxide, wherein the bonding material composition contains in addition to an O element-containing aluminum nitride raw material, (a) at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide, (b) a fluorine compound of a rare-earth metal, or (c) a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal. 8. The bonding material composition, according to claim 7 , wherein the content of O element in the aluminum nitride raw material is 0.4% to 30% by mass. 9. The bonding material composition according to claim 7 , containing an amount of 20% to 85% by mass of aluminum nitride (excluding the oxygen content in terms of Al 2 O 3 ) and an amount of 10% to 50% by mass of the fluorine compound. 10. The bonding material composition according claim 7 , having an aluminum oxide content of 0.4% to 60% by mass, including a value obtained by calculating the content of O element in the aluminum nitride raw material in terms of Al 2 O 3 . 11. The bonding material composition according to claim 10 , containing a rare-earth metal oxide in an amount of 40% to 150% by mass with respect to Al 2 O 3 content (including a value obtained by calculating O element in the aluminum nitride raw material in terms of Al 2 O 3 ). 12. A method for producing an aluminum nitride bonded body in which the aluminum nitride sintered bodies are bonded to each other, including: sandwiching the bonding material composition according to claim 7 between aluminum nitride sintered bodies and heating the resulting assembly at 1450° C. or lower with a bonding load applied.

Assignees

Inventors

Classifications

  • C09J1/00Primary

    Adhesives based on inorganic constituents · CPC title

  • involving heating of the applied adhesive · CPC title

  • in the substrate · CPC title

  • consisting of glass or ceramic material · CPC title

  • Including interfacial reaction product of adjacent layers · CPC title

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What does patent US9481813B2 cover?
A first bonding material composition according to the present invention is a bonding material composition used when aluminum nitride sintered bodies containing a rare-earth metal oxide are bonded to each other, in which the bonding immaterial composition contains, in addition, to an O element-containing aluminum nitride raw material, (a) as a fluorine compound, at least one of a fluorine compou…
Who is the assignee on this patent?
Ngk Insulators Ltd
What technology area does this patent fall under?
Primary CPC classification C09J1/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).