Resin composition, adhesive film, and circuit board using the same
US-2017369747-A1 · Dec 28, 2017 · US
US9481813B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9481813-B2 |
| Application number | US-201414561449-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 5, 2014 |
| Priority date | Dec 27, 2013 |
| Publication date | Nov 1, 2016 |
| Grant date | Nov 1, 2016 |
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A first bonding material composition according to the present invention is a bonding material composition used when aluminum nitride sintered bodies containing a rare-earth metal oxide are bonded to each other, in which the bonding immaterial composition contains, in addition, to an O element-containing aluminum nitride raw material, (a) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, or (b) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide.
Opening claim text (preview).
What is claimed is: 1. A bonding material composition used when aluminum nitride sintered bodies containing a rare-earth metal oxide are bonded to each other, wherein the bonding material composition contains in addition to an O element-containing aluminum nitride raw material, (a) as a fluorine compound, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, or (b) as a fluorine compound,, at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide. 2. The bonding material composition according to claim 1 , wherein the content of O element in the aluminum nitride raw material is 0.4% to 30% by mass. 3. The bonding material composition according to claim 1 , containing an amount of 20% to 85% by mass of aluminum nitride (excluding the oxygen content in terms of Al 2 O 3 ) and an amount of 10% to 50% by mass of the fluorine compound. 4. The bonding material composition according claim 1 , having an aluminum oxide content of 0.4% to 60% by mass, including a value obtained by calculating the content of O element in the aluminum nitride raw material in terms of Al 2 O 3 . 5. The bonding material composition according to claim 4 , containing a rare-earth metal oxide in an amount of 40% to 150% by mass with respect to Al 2 O 3 content (including a value obtained by calculating O element in the aluminum nitride raw material in terms of Al 2 O 3 ). 6. A method for producing an aluminum nitride bonded body in which the aluminum nitride sintered bodies are bonded to each other, including; sandwiching the bonding material composition according to claim 1 between aluminum nitride sintered bodies and heating the resulting assembly at 1450° C. or lower with a bonding load applied. 7. A bonding material composition used when an aluminum nitride sintered body free from a rare-earth metal oxide is bonded to an aluminum nitride sintered body that contains or does not contain a rare-earth metal oxide, wherein the bonding material composition contains in addition to an O element-containing aluminum nitride raw material, (a) at least one of a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal, and a rare-earth metal oxide, (b) a fluorine compound of a rare-earth metal, or (c) a fluorine compound of an alkaline-earth metal and a fluorine compound of a rare-earth metal. 8. The bonding material composition, according to claim 7 , wherein the content of O element in the aluminum nitride raw material is 0.4% to 30% by mass. 9. The bonding material composition according to claim 7 , containing an amount of 20% to 85% by mass of aluminum nitride (excluding the oxygen content in terms of Al 2 O 3 ) and an amount of 10% to 50% by mass of the fluorine compound. 10. The bonding material composition according claim 7 , having an aluminum oxide content of 0.4% to 60% by mass, including a value obtained by calculating the content of O element in the aluminum nitride raw material in terms of Al 2 O 3 . 11. The bonding material composition according to claim 10 , containing a rare-earth metal oxide in an amount of 40% to 150% by mass with respect to Al 2 O 3 content (including a value obtained by calculating O element in the aluminum nitride raw material in terms of Al 2 O 3 ). 12. A method for producing an aluminum nitride bonded body in which the aluminum nitride sintered bodies are bonded to each other, including: sandwiching the bonding material composition according to claim 7 between aluminum nitride sintered bodies and heating the resulting assembly at 1450° C. or lower with a bonding load applied.
Adhesives based on inorganic constituents · CPC title
involving heating of the applied adhesive · CPC title
in the substrate · CPC title
consisting of glass or ceramic material · CPC title
Including interfacial reaction product of adjacent layers · CPC title
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