Free configurable power semiconductor module
US-12599012-B2 · Apr 7, 2026 · US
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Mohn Fabian patents
Mohn Fabian is listed as an inventor on 40 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mohn Fabian |
| Total patents | 40 |
| First publication | Sep 14, 2017 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Power semiconductor module
US-12575430-B2 · Mar 10, 2026 · US
Electrical contact arrangement, power semiconductor module, method for manufacturing an electrical contact arrangement and method for manufacturing a power semiconductor module
US-12512413-B2 · Dec 30, 2025 · US
Arrangement of a power semiconductor module and a cooler
US-12068174-B2 · Aug 20, 2024 · US
Power semiconductor module with low inductance gate crossing
US-12068290-B2 · Aug 20, 2024 · US
Electric power converter device with improved integration of cooler frame
US-12016162-B2 · Jun 18, 2024 · US
Semiconductor power module and method for manufacturing a semiconductor power module
US-2024186199-A1 · Jun 6, 2024 · US
Power semiconductor module, method for manufacturing the same and electrical converter
US-2024079279-A1 · Mar 7, 2024 · US
Power Module and Method for Producing a Power Module
US-2024030101-A1 · Jan 25, 2024 · US
Power module comprising at least one semiconductor module, and a method for manufacturing a power module
US-2024014096-A1 · Jan 11, 2024 · US
Recent patents
Latest publications not already listed above.
Electrical contact arrangement, power semiconductor module, method for manufacturing an electrical contact arrangement and method for manufacturing a power semiconductor module
US-2023343715-A1 · Oct 26, 2023 · US
Power semiconductor module
US-2023335472-A1 · Oct 19, 2023 · US
Power semiconductor module with laser-welded leadframe
US-11749633-B2 · Sep 5, 2023 · US
Free Configurable Power Semiconductor Module
US-2023116118-A1 · Apr 13, 2023 · US
Power semiconductor package with highly reliable chip topside
US-11538734-B2 · Dec 27, 2022 · US
Power Semiconductor Module with Laser-Welded Leadframe
US-2022406745-A1 · Dec 22, 2022 · US
Arrangement of a Power Semiconductor Module and a Cooler
US-2022254653-A1 · Aug 11, 2022 · US
Power Semiconductor Module with Low Inductance Gate Crossing
US-2022238493-A1 · Jul 28, 2022 · US
Method for producing a semiconductor module by using adhesive attachment prior to sintering
US-11348896-B2 · May 31, 2022 · US
Heat dissipation for power switches
US-2022166423-A1 · May 26, 2022 · US
Heat dissipation for power switches
US-11343943-B1 · May 24, 2022 · US
Electric power converter device with improved integration of cooler frame
US-2022142015-A1 · May 5, 2022 · US
Manufacturing of a power semiconductor module
US-11189556-B2 · Nov 30, 2021 · US
Half-bridge module with coaxial arrangement of the DC terminals
US-11018117-B2 · May 25, 2021 · US
Power Semiconductor Package with Highly Reliable Chip Topside
US-2021104449-A1 · Apr 8, 2021 · US
Resin encapsulated power semiconductor module with exposed terminal areas
US-10950516-B2 · Mar 16, 2021 · US
Method for producing a semiconductor module
US-2020350276-A1 · Nov 5, 2020 · US
Power module based on multi-layer circuit board
US-10636732-B2 · Apr 28, 2020 · US
Half-bridge module with coaxial arrangement of the dc terminals
US-2020066686-A1 · Feb 27, 2020 · US
Resin encapsulated power semiconductor module with exposed terminal areas
US-2020066609-A1 · Feb 27, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Abb Schweiz Ag | 18 |
| Audi Ag | 12 |
| Hitachi Energy Switzerland Ag | 12 |
| Hitachi Energy Ltd | 6 |
| Abb Power Grids Switzerland Ag | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 26 |
| H10W40/255 | 21 |
| H10W90/754 | 17 |
| H10W70/611 | 15 |
| H10W74/00 | 13 |