Semiconductor substrate having an alignment structure
US-12532748-B2 · Jan 20, 2026 · US
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Moder Iris patents
Moder Iris is listed as an inventor on 57 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Moder Iris |
| Total patents | 57 |
| First publication | Jul 14, 2016 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-12412740-B2 · Sep 9, 2025 · US
Apparatus for Electrochemical Treating of a Semiconductor Substrate and a Process using the Apparatus
US-2025253168-A1 · Aug 7, 2025 · US
Method of manufacturing a semiconductor device including a wide band gap semiconductor body
US-2025239459-A1 · Jul 24, 2025 · US
Method of processing a semiconductor wafer
US-2025183031-A1 · Jun 5, 2025 · US
Manufacturing and reuse of semiconductor substrates
US-12249504-B2 · Mar 11, 2025 · US
Semiconductor device having semiconductor device elements in a semiconductor layer
US-12107130-B2 · Oct 1, 2024 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-2024153759-A1 · May 9, 2024 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-11881397-B2 · Jan 23, 2024 · US
Method of porosifying part of a semiconductor wafer
US-11810779-B2 · Nov 7, 2023 · US
Recent patents
Latest publications not already listed above.
Semiconductor substrate having an alignment structure
US-2023275033-A1 · Aug 31, 2023 · US
Manufacturing and reuse of semiconductor substrates
US-2023127556-A1 · Apr 27, 2023 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-2022359194-A1 · Nov 10, 2022 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-11476111-B2 · Oct 18, 2022 · US
Method of porosifying part of a semiconductor wafer
US-2022310380-A1 · Sep 29, 2022 · US
Silicon Carbide Devices, Semiconductor Devices and Methods for Forming Silicon Carbide Devices and Semiconductor Devices
US-2022246745-A1 · Aug 4, 2022 · US
Method for partially removing a semiconductor wafer
US-11404262-B2 · Aug 2, 2022 · US
Semiconductor surface smoothing and semiconductor arrangement
US-11373857-B2 · Jun 28, 2022 · US
Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices
US-11342433-B2 · May 24, 2022 · US
Semiconductor device manufacturing by thinning and dicing
US-2021391218-A1 · Dec 16, 2021 · US
Method of thinning a semiconductor substrate to high evenness and semiconductor substrate having a device layer of high evenness
US-2021391377-A1 · Dec 16, 2021 · US
Semiconductor device having semiconductor device elements in a semiconductor layer
US-2021265468-A1 · Aug 26, 2021 · US
Semiconductor device and manufacturing method
US-11038028-B2 · Jun 15, 2021 · US
Devices with backside metal structures and methods of formation thereof
US-11011409-B2 · May 18, 2021 · US
Semiconductor surface smoothing and semiconductor arrangement
US-2020365385-A1 · Nov 19, 2020 · US
Reticle and exposure method including projection of a reticle pattern into neighboring exposure fields
US-10802404-B2 · Oct 13, 2020 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-2020286730-A1 · Sep 10, 2020 · US
Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing
US-10714377-B2 · Jul 14, 2020 · US
Silicon Carbide Devices, Semiconductor Devices and Methods for Forming Silicon Carbide Devices and Semiconductor Devices
US-2020176580-A1 · Jun 4, 2020 · US
Method for Partially Removing a Semiconductor Wafer
US-2020168449-A1 · May 28, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 57 |
| Rena Tech Gmbh | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P52/00 | 22 |
| H10D30/66 | 19 |
| H10D12/481 | 19 |
| H10P50/644 | 18 |
| H10D30/668 | 18 |