Methods for fusion bonding semiconductor devices to temporary carrier wafers with cavity regions for reduced bond strength, and semiconductor device assemblies formed by the same
US-12582001-B2 · Mar 17, 2026 · US
Mcdaniel Terrence B is listed as an inventor on 38 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mcdaniel Terrence B |
| Total patents | 38 |
| First publication | Jan 27, 2022 |
| Latest publication | Mar 17, 2026 |
Publications ranked by popularity score, then publication date.
US-12582001-B2 · Mar 17, 2026 · US
US-12568869-B2 · Mar 3, 2026 · US
US-12532461-B2 · Jan 20, 2026 · US
US-2025391711-A1 · Dec 25, 2025 · US
US-2025336854-A1 · Oct 30, 2025 · US
US-2025336772-A1 · Oct 30, 2025 · US
US-2025323125-A1 · Oct 16, 2025 · US
US-2025275249-A1 · Aug 28, 2025 · US
US-12336288-B2 · Jun 17, 2025 · US
US-2024379596-A1 · Nov 14, 2024 · US
Latest publications not already listed above.
US-2024292603-A1 · Aug 29, 2024 · US
US-12069848-B2 · Aug 20, 2024 · US
US-2024153541-A1 · May 9, 2024 · US
US-2024079369-A1 · Mar 7, 2024 · US
US-2024071968-A1 · Feb 29, 2024 · US
US-2024071823-A1 · Feb 29, 2024 · US
US-2024071989-A1 · Feb 29, 2024 · US
US-11915777-B2 · Feb 27, 2024 · US
US-2024064972-A1 · Feb 22, 2024 · US
US-2024063207-A1 · Feb 22, 2024 · US
US-2024063068-A1 · Feb 22, 2024 · US
US-2024063094-A1 · Feb 22, 2024 · US
US-2024038588-A1 · Feb 1, 2024 · US
US-2024040775-A1 · Feb 1, 2024 · US
US-2023345708-A1 · Oct 26, 2023 · US
US-11785764-B2 · Oct 10, 2023 · US
US-2023014320-A1 · Jan 19, 2023 · US
US-2023005932-A1 · Jan 5, 2023 · US
US-2022358971-A1 · Nov 10, 2022 · US
US-11488981-B2 · Nov 1, 2022 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 38 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B12/315 | 15 |
| H10W90/792 | 11 |
| H01L24/08 | 11 |
| H10B12/0335 | 10 |
| H10B12/482 | 10 |