Semiconductor device including buried contact and method for manufacturing the same
US-12178034-B2 · Dec 24, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10B12/482 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 4,634 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 170 |
| 2016 | 177 |
| 2017 | 105 |
| 2018 | 133 |
| 2019 | 190 |
| 2020 | 241 |
| 2021 | 332 |
| 2022 | 507 |
| 2023 | 727 |
| 2024 | 805 |
| 2025 | 973 |
| 2026 | 274 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Capacitor and semiconductor device including the same
US-2024387608-A1 · Nov 21, 2024 · US
Method of manufacturing semiconductor structure having air gap
US-12132087-B2 · Oct 29, 2024 · US
Semiconductor device and method for preparing semiconductor device
US-2024339405-A1 · Oct 10, 2024 · US
Methods of manufacturing semiconductor devices
US-2024332030-A1 · Oct 3, 2024 · US
Semiconductor device
US-2024321938-A1 · Sep 26, 2024 · US
Semiconductor memory device
US-2024237333-A9 · Jul 11, 2024 · US
Semiconductor device
US-2024188285-A1 · Jun 6, 2024 · US
Transistors with mitigated free body effect
US-2024072174-A1 · Feb 29, 2024 · US
3d 1t1c stacked dram structure and method to fabricate
US-2024064958-A1 · Feb 22, 2024 · US
Semiconductor structure and semiconductor manufacturing method
US-2024057322-A1 · Feb 15, 2024 · US
Semiconductor device and method for fabricating the same
US-2015380415-A1 · Dec 31, 2015 · US
Method for providing electrical connections to spaced conductive lines
US-9224742-B2 · Dec 29, 2015 · US
Capacitors including amorphous dielectric layers and methods of forming the same
US-2015357399-A1 · Dec 10, 2015 · US
Semiconductor device having junctionless vertical gate transistor and method of manufacturing the same
US-2015348976-A1 · Dec 3, 2015 · US
Method of forming semiconductor device including protrusion type isolation layer
US-2015333151-A1 · Nov 19, 2015 · US
Semiconductor device and manufacturing method thereof
US-2015333069-A1 · Nov 19, 2015 · US
Manufacturing method of capacitor structure and semiconductor device using the same
US-9184166-B2 · Nov 10, 2015 · US
Semiconductor memory device having three-dimensional cross point array
US-9184218-B2 · Nov 10, 2015 · US
Methods of manufacturing semiconductor devices having self-aligned contact pads
US-9184227-B1 · Nov 10, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10B12/482?
- CPC H10B12/482 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10B12/482 (Electricity)?
- Our database includes 4,634 publications tagged with this CPC code.
- Is patent activity under CPC H10B12/482 growing?
- Publication counts under this code: 805 in 2024 vs 973 in 2025 (latest complete years).