Stable Power Modules By Thermoelectric Cooling
US-2023038175-A1 · Feb 9, 2023 · US
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Mcconnell John E patents
Mcconnell John E is listed as an inventor on 36 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mcconnell John E |
| Total patents | 36 |
| First publication | Mar 24, 2015 |
| Latest publication | Feb 9, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of forming an electronic device
US-11432448-B2 · Aug 30, 2022 · US
Leadless multi-layered ceramic capacitor stack
US-11227719-B2 · Jan 18, 2022 · US
Electronic component structures with reduced microphonic noise
US-10984955-B2 · Apr 20, 2021 · US
Component Stability Structure
US-2020323112-A1 · Oct 8, 2020 · US
Method of forming a leadless stack comprising multiple components
US-10790094-B2 · Sep 29, 2020 · US
High density multi-component packages
US-10757810-B2 · Aug 25, 2020 · US
Component stability structure
US-10729051-B2 · Jul 28, 2020 · US
High density multi-component packages
US-10707145-B2 · Jul 7, 2020 · US
Leadless Stack Comprising Multiple Components
US-2019318877-A1 · Oct 17, 2019 · US
Recent patents
Latest publications not already listed above.
Electronic Component Structures with Reduced Microphonic Noise
US-2019304698-A1 · Oct 3, 2019 · US
Leadless stack comprising multiple components
US-10381162-B2 · Aug 13, 2019 · US
Electronic component structures with reduced microphonic noise
US-10366836-B2 · Jul 30, 2019 · US
High Density Multi-Component Packages
US-2019090348-A1 · Mar 21, 2019 · US
High Density Multi-Component Packages
US-2019080982-A1 · Mar 14, 2019 · US
Multi-layered ceramic capacitor with soft leaded module
US-10229785-B2 · Mar 12, 2019 · US
Bulk MLCC capacitor module
US-10224149-B2 · Mar 5, 2019 · US
Leadless multi-layered ceramic capacitor stacks
US-10068707-B2 · Sep 4, 2018 · US
Leadless Multi-Layered Ceramic Capacitor Stack
US-2018190430-A1 · Jul 5, 2018 · US
Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds
US-9881744-B2 · Jan 30, 2018 · US
Component Stability Structure
US-2017367228-A1 · Dec 21, 2017 · US
Leadless Stack Comprising Multiple Components
US-2017358397-A1 · Dec 14, 2017 · US
Multiple MLCC modules
US-9805872-B2 · Oct 31, 2017 · US
Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
US-9793057-B2 · Oct 17, 2017 · US
Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials
US-9779874-B2 · Oct 3, 2017 · US
Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
US-9748043-B2 · Aug 29, 2017 · US
Bulk MLCC Capacitor Module
US-2017169956-A1 · Jun 15, 2017 · US
Multiple MLCC Modules
US-2017169955-A1 · Jun 15, 2017 · US
Electronic Component Structures with Reduced Microphonic Noise
US-2017025223-A1 · Jan 26, 2017 · US
Leadless multi-layered ceramic capacitor stacks
US-9472342-B2 · Oct 18, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kemet Electronics Corp | 36 |
| Mcconnell John E | 3 |
| Bultitude John | 2 |
| Kemet Electroncs Corp | 1 |
| Webster Alan P | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01G4/30 | 29 |
| H01G4/38 | 26 |
| H01G4/232 | 20 |
| H01G4/2325 | 18 |
| H10W72/07336 | 16 |