Multiple MLCC modules

Patent metadata

Field	Value
Publication number	US-9805872-B2
Application number	US-201514963766-A
Country	US
Kind code	B2
Filing date	Dec 9, 2015
Priority date	Dec 9, 2015
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.

First claim

The invention claimed is:

1. A module comprising:
a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge;
a first lead connected to each said first longitudinal edge by a first interconnect;
a second lead connected to said second longitudinal edge by a second interconnect.

2. The module of claim 1 wherein said first lead is connected to each first longitudinal edge by said first interconnect.

3. The module of claim 1 wherein said first lead is a flat plated lead with at least one said electronic component on each side of said flat plated lead.

4. The module of claim 1 wherein said first lead comprises an offset.

5. The module of claim 4 wherein said offset is selected from laterally offset and horizontally offset.

6. The module of claim 1 wherein said first lead is selected from a round lead frame and a flat lead.

7. The module of claim 6 wherein said first lead comprises at least one flattened region.

8. The module of claim 1 wherein said first lead is selected from a through-hole lead, surface mount lead and a compliant pin lead.

9. The module of claim 8 further comprising a through-hole assembly stand-off feature.

10. The module of claim 1 wherein said first lead comprises a material selected from a ferrous material and a non-ferrous material.

11. The module of claim 1 wherein at least one of said first interconnect or said second interconnect is selected from the group consisting of a transient liquid phase sintering conductive interconnect material, a conductive epoxy, polymer solder and a solder.

12. The module of claim 1 wherein each said electronic component is independently selected from the group consisting of a capacitor, a diode, a resistor, a varistor, an inductor, a fuse and an integrated circuit.

13. The module of claim 11 wherein at least one said electronic component is a capacitor.

14. The module of claim 13 wherein each said electronic component is a capacitor.

15. The module of claim 14 wherein each said capacitor is an MLCC.

16. The module of claim 1 wherein at least two said electronic components have a different size.

17. The module of claim 1 further comprising an encapsulation.

18. The module of claim 1 comprising at least 2 electronic components to no more than 100 electronic components.

19. The module of claim 1 further comprising at least one electronic component in a second row or a second column wherein adjacent longitudinal edges are attached by an interconnect.

20. A method for forming a module comprising:
providing a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination with at least one first longitudinal edge and a second external termination with at least on second longitudinal edge;
placing a first lead into contact with each said first longitudinal edge with a first interconnect between said first lead and said first longitudinal edge;
placing a second lead into contact with said second longitudinal edge with a second interconnect between said second lead and said second longitudinal edge; and
heating to form a bond of said first interconnect and said second interconnect.

21. The method for forming a module of claim 20 comprising bonding said first lead to each first longitudinal edge by said first interconnect.

22. The method for forming a module of claim 20 wherein said first lead is a flat plated lead with at least one said electronic component on each side of said flat plated lead.

23. The method for forming a module of claim 20 wherein said first lead comprises an offset.

24. The method for forming a module of claim 23 wherein said offset is selected from laterally offset and horizontally offset.

25. The method for forming a module of claim 20 wherein said first lead is selected from a round lead frame and a flat lead.

26. The method for forming a module of claim 25 wherein said first lead comprises at least one flattened region.

27. The method for forming a module of claim 20 wherein said first lead is selected from a through-hole lead and a surface mount lead.

28. The method for forming a module of claim 27 further comprising a through-hole assembly stand-off feature.

29. The method for forming a module of claim 20 wherein said first lead comprises a material selected from a ferrous material and a non-ferrous material.

30. The method for forming a module of claim 20 wherein at least one of said first interconnect or said second interconnect is selected from the group consisting of a transient liquid phase sintering conductive interconnect material, a conductive epoxy, a polymer solder and a solder.

31. The method for forming a module of claim 20 wherein each said electronic component is independently selected from the group consisting of a capacitor, a diode, a resistor, a varistor, an inductor, a fuse and an integrated circuit.

32. The method for forming a module of claim 31 wherein at least one said electronic component is a capacitor.

33. The method for forming a module of claim 32 wherein each said electronic component is a capacitor.

34. The method for forming a module of claim 33 wherein each said capacitor is an MLCC.

35. The method for forming a module of claim 20 wherein at least two said electronic components have a different size.

36. The method for forming a module of claim 20 further comprising forming an encapsulation.

37. The method for forming a module of claim 20 comprising at least 2 electronic components to no more than 100 electronic components.

38. The method for forming a module of claim 20 further comprising placing at least one electronic component in a second row or a second column with an interconnect between adjacent longitudinal edges and forming a bond of said interconnect.

Assignees

• Kemet Electronics Corp

Inventors

• Miller Galen W
• Mcconnell John E
• Bultitude John
• Renner Garry L

Classifications

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/228

  Terminals · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/38 Primary

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H01G2/106

  Fixing the capacitor in a housing · CPC title