Method of forming a leadless stack comprising multiple components

Patent metadata

Field	Value
Publication number	US-10790094-B2
Application number	US-201916456912-A
Country	US
Kind code	B2
Filing date	Jun 28, 2019
Priority date	May 26, 2010
Publication date	Sep 29, 2020
Grant date	Sep 29, 2020

Abstract

A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.

First claim

The invention claimed is:

1. A method for forming an electronic element comprising:
forming at least one multi-layered ceramic capacitor (MLCC) comprising a first capacitor external termination and a second capacitor external termination;
forming at least one electronic component comprising a first element external termination and a second element external termination; and
arranging said MLCC and said electronic element in a leadless stack with a transient liquid phase sintering adhesive (TLPS) bond between said first capacitor external termination and said first element external termination.

2. The method for forming an electronic element of claim 1 further comprising:
arranging multiple electronic components in said leadless stack with said TLPS bond between adjacent first element external terminations.

3. The method for forming an electronic element of claim 1 wherein each electronic component of said electronic components is selected from the group consisting of resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch, electrostatic discharge suppressor, semiconductor and integrated circuit.

4. The method for forming an electronic element of claim 1 wherein each electronic component of said electronic components is selected from the group consisting of resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch, electrostatic discharge suppressor and integrated circuit.

5. The method for forming an electronic element of claim 1 wherein said MLCC comprises first electrodes and second electrodes separated by a dielectric wherein said first electrodes terminate at said first external termination and said second electrodes terminate at said second external termination.

6. The method for forming an electronic element of claim 1 wherein at least one said first external termination comprises a metal selected from the group consisting of Ni, Ag, Sn, Au, Cu, Al and SnPb.

7. The method for forming an electronic element of claim 1 wherein at least one said first external termination comprises nickel plated with an element selected from the group consisting of Ag, Sn, Au or SnPb.

8. A method for forming an electronic element comprising:
forming at least one multi-layered ceramic capacitor (MLCC) comprising a first capacitor external termination and a second capacitor external termination;
forming at least one electronic component comprising a first element external termination and a second element external termination; and
arranging said MLCC and said electronic element in a leadless stack with a transient liquid phase sintering adhesive (TLPS) bond between said first capacitor external termination and said first element external termination wherein said MLCC comprises first electrodes and second electrodes separated by a dielectric wherein said first electrodes terminate at said first external termination and said second electrodes terminate at said second external termination and wherein said MLCC further comprises at least conductor selected from a floating electrode and a shield electrode.

9. The method for forming an electronic element of claim 8 wherein said floating electrode is selected from the group consisting of an external floating electrode and an internal floating electrode.

10. The method for forming an electronic element of claim 9 wherein said an internal floating electrode is coplanar with at least one first electrode of said first electrodes.

Assignees

• Kemet Electronics Corp

Inventors

• Mcconnell John E
• Renner Garry L
• Bultitude John
• Hill R Allen
• Miller Galen W

Classifications

• H10W72/07336

  Soldering or alloying · CPC title

• B23K20/22

  taking account of the properties of the materials to be welded · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title

• B23K20/026

  with diffusion of soldering material · CPC title

• B22F3/1035

  Liquid phase sintering · CPC title