High density multi-component packages

Patent metadata

Field	Value
Publication number	US-10707145-B2
Application number	US-201715804515-A
Country	US
Kind code	B2
Filing date	Nov 6, 2017
Priority date	Sep 8, 2017
Publication date	Jul 7, 2020
Grant date	Jul 7, 2020

Abstract

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

First claim

The invention claimed is:

1. An electronic circuit comprising:
a high density multi-component package comprising:
at least two electronic components wherein each electronic component comprises a first external termination and a second external termination;
an interposer between adjacent electronic components wherein said interposer is selected from an active interposer and a mechanical interposer,
wherein an active interposer comprises active pads, mechanical pads, and a substrate, each active pad is in electrical contact with a corresponding active pad on an opposite side of the substrate, each mechanical pad is not in electrical contact with a corresponding mechanical pad on the opposite side of the substrate, wherein for at least one of said adjacent electronic components, the first external termination is electrically connected by one of said two of said active pads opposing each other on the substrate, and the second external termination is in contact with and adhered to a respective one of two of said mechanical pads but not electrically connected to the other of said two mechanical pads, said two mechanical pads opposing each other on the substrate,
wherein a mechanical interposer comprises a substrate and mechanical pads and does not have an active pad, and
wherein said adjacent electronic components are connected serially;
a circuit board comprising traces wherein at least one trace of said traces is an active trace and at least one trace of said traces is a mechanical trace;
wherein at least one first external termination of at least one first electronic component of said electronic components is in electrical contact with at least one said active trace; and
wherein at least one second external termination of at least one second electronic component of said electronic components is in electrical contact with at least one said mechanical trace; and

a circuit substrate, wherein said circuit substrate comprises at least two circuit traces.

2. The electronic circuit of claim 1 wherein said electronic components form at least one stack.

3. The electronic circuit of claim 2 further comprising a secondary electrical component.

4. The electronic circuit of claim 3 comprising at least two stacks wherein said secondary electrical component spans said stacks.

5. The electronic circuit of claim 4 wherein said secondary electrical component is selected from an active interposer or a mechanical interposer.

6. The electronic circuit of claim 1 wherein at least one said electronic component comprises at least three terminals.

7. The electronic circuit of claim 1 wherein at least one said electronic component comprises at least three terminals wherein each terminal of said terminals is independently in electrical contact with a trace of said traces of said circuit board.

8. The electronic circuit of claim 1 wherein said interposer comprises at least three pads.

9. The electronic circuit of claim 1 wherein said circuit substrate comprises at least three circuit traces.

10. The electronic circuit of claim 1 wherein said electronic components form at least two stacks.

11. The electronic circuit of claim 10 further comprising an interstack interposer.

12. The electronic circuit of claim 11 wherein said interstack interposer is an active interposer.

13. The electronic circuit of claim 10 further comprising an intrastack interposer.

14. The electronic circuit of claim 1 further comprising a flexible circuit.

15. The electronic circuit of claim 1 further comprising overmolding.

16. The electronic circuit of claim 1 further comprising a functional interposer.

17. The electronic circuit of claim 1 wherein said high density multi-component package is mounted vertically on said circuit board.

18. The electronic circuit of claim 17 further comprising a connector between one of said first and second external terminations and one said active trace.

19. The electronic circuit of claim 18 wherein said connector is selected the group consisting of an electrical connection and a functional connection.

20. The electronic circuit of claim 19 wherein said connector is an additional electronic component.

21. The electronic circuit of claim 20 wherein said additional electronic component is selected from capacitor, resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch, electrostatic discharge suppressor, semiconductor and integrated circuit.

22. The electronic circuit of claim 21 wherein said additional electronic component is an MLCC.

23. The electronic circuit of claim 21 wherein said additional electronic component is selected from resistor, inductor and fuse.

24. The electronic circuit of claim 1 wherein said high density multi-component package is mounted horizontally on said circuit board.

25. The electronic circuit of claim 24 wherein at least one trace of said traces electrically connects adjacent external terminations.

26. The electronic circuit of claim 1 wherein each said electronic component is independently selected from the group consisting of MLCC, resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch, electrostatic discharge suppressor, semiconductor and integrated circuit.

27. The electronic circuit of claim 26 wherein each said electronic component is selected from the group consisting of MLCC, resistor, varistor, inductor, diode, fuse, overvoltage discharge device, sensor, switch and electrostatic discharge suppressor.

28. The electronic circuit of claim 27 wherein at least one said electronic component is an MLCC.

29. The electronic circuit of claim 26 wherein at least one electronic component is a light emitting diode.

30. The electronic circuit of claim 1 wherein all electronic components are serially connected.

31. The electronic circuit of claim 1 , further comprising at least two additional electronic components, wherein said at least two additional electronic components are electrically connected in parallel.

32. The electronic circuit of claim 1 further comprising multiple interposers of said interposer selected from an active interposer and a mechanical interposer.

33. The electronic circuit of claim 32 wherein each interposer of said multiple interposers is an active interposer.

34. The electronic circuit of claim 32 wherein each interposer of said multiple interposers is a mechanical interposer.

35. The electronic circuit of claim 32 wherein at least one interposer of said multiple interposers is an active interposer and at least one interposer of said multiple interposers is a mechanical interposer.

36. The electronic circuit of claim 1 wherein at least one electronic component of said electronic components is directly attached to an adjacent electronic component by an interconnect.

37. The electronic circuit of claim 3 wherein said secondary electrical component is in electrical parallel with at least two said electronic components.

38. The electronic circuit of claim 36 wherein said interconnect is selected from the group consisting of solder, conductive adhesive, polymer solder and transient liquid phase sintering adhesive.

3

Assignees

• Kemet Electronics Corp

Inventors

• Bultitude John
• Miller Galen
• Mcconnell John E

Classifications

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W80/314

  characterized by direct bonding of pads or other interconnections · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W80/312

  characterised by the direct bonding of electrically conductive pads · CPC title

• H10W72/247

  Dispositions of multiple bumps · CPC title