Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials

Patent metadata

Field	Value
Publication number	US-9779874-B2
Application number	US-201213542375-A
Country	US
Kind code	B2
Filing date	Jul 5, 2012
Priority date	Jul 8, 2011
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.

First claim

The invention claimed is:

1. A method of making a metal foil coated ceramic, comprising:
providing a metal foil;
applying a ceramic precursor to said metal foil wherein said ceramic precursor comprises at least one susceptor, a high dielectric constant oxide and an organic binder, and
sintering said ceramic precursor at a temperature of at least 600 to no more than 1000° C. with an ultraviolet light having a pulse duration of 1 microsecond to 100 milliseconds and a pulse frequency of up to 40 Hz to form said metal foil coated ceramic.

2. The method of making a metal foil coated ceramic of claim 1 , wherein said ceramic precursor comprises at least one of a nano-oxide or nano-metal susceptor.

3. The method of making a metal foil coated ceramic of claim 2 , wherein said nano-metal susceptor is selected from the group consisting of Cu, Ag, Li, Pb, Bi, B, Al and Zn.

4. The method of making a metal foil coated ceramic of claim 2 , further comprising forming an adhesive layer to said foil wherein said adhesive layer comprises one of said nano-oxide or nano-metal susceptor.

5. The method of making a metal foil coated ceramic of claim 4 , wherein said nano-oxide comprises copper aluminum oxide.

6. The method of making a metal foil coated ceramic of claim 1 , wherein said metal foil comprises a material selected from the group consisting of aluminum, copper, zinc, titanium, nickel, steel, platinum, palladium, silver and gold.

7. The method of making a metal foil coated ceramic of claim 1 , wherein said susceptor is selected from the group consisting of CuO, Ag 2 O, Cu 2 O, BaCuO 2 , PbO, Bi 2 O 3 , ZnO/B 2 O 3 , Li 2 O, Li 2 SiO 3 , CaO/B 2 O 3 , SiO 2 , GeO 2 and SrO/B 2 O 3 .

8. The method of making a metal foil coated ceramic of claim 1 , wherein said high dielectric constant oxide is selected from the group consisting of BaTiO 3 , SrTiO 3 , CaZrO 3 , Pb(Mg 1/3 Nb 2/3 )O 3 , Pb(Zr 1/2 Ti 1/2 )O 3 including La 2 O 3 , PbTiO 3 and mixtures or solid solutions thereof.

9. The method of making a metal foil coated ceramic of claim 1 , wherein said sintering with said ultraviolet light occurs on a curved surface of said ceramic precursor.

10. A method of forming a metal foil ceramic capacitor, comprising:
applying a conductor to said ceramic of said metal foil ceramic of claim 1 , opposite said metal foil.

11. The method of making a metal foil ceramic capacitor of claim 10 , further comprising applying a paste to said metal foil ceramic capacitor.

12. The method of making a metal foil ceramic capacitor of claim 11 , further comprising sintering said paste with a second ultraviolet light to form said conductor.

13. The method of making a metal foil ceramic capacitor of claim 12 , further comprising masking and etching said conductor to form a circuit.

14. The method of making a metal foil ceramic capacitor of claim 10 , further comprising segmenting said metal foil ceramic capacitor.

15. The method of making a metal foil ceramic capacitor of claim 10 , further comprising forming vias in said metal foil.

16. The method of making a metal foil ceramic capacitor of claim 10 , further comprising applying a polymeric insulator material to define discrete areas of said ceramic.

17. The method of making a metal foil ceramic capacitor of claim 10 , further comprising winding, stacking, or folding of said metal foil ceramic capacitor to form a layered metal foil ceramic capacitor.

18. The method of making a metal foil ceramic capacitor of claim 17 , further comprising molding said layered metal foil ceramic capacitor in insulating polymer, exposing internal electrodes and forming external terminals of opposed polarity with one external terminal of said external terminals in electrical contact with said conductor and a second external terminal of said external terminals in electrical contact with said metal foil.

19. The method of making a metal foil ceramic capacitor of claim 10 , further comprising forming said metal foil on a polymeric carrier film.

20. The method of making a metal foil ceramic capacitor of claim 10 , wherein said ceramic precursor comprises at least one of a nano-oxide or nano-metal susceptor.

21. The method of making a metal foil ceramic capacitor of claim 20 , wherein said nano-metal susceptor is selected from the group consisting of Cu, Ag, Li, Pb, Bi, B, Al and Zn.

22. The method of making a metal foil ceramic capacitor of claim 10 , wherein said metal foil comprises a material selected from the group consisting of aluminum, copper, zinc, titanium, nickel, steel, platinum, palladium, silver and gold.

23. The method of making a metal foil ceramic capacitor of claim 10 , wherein said susceptor is selected from the group consisting of CuO, Ag 2 O, Cu 2 O, BaCuO 2 , PbO, Bi 2 O 3 , ZnO/B 2 O 3 , Li 2 O, Li 2 SiO 3 , CaO/B 2 O 3 , SiO 2 , GeO 2 and SrO/B 2 O 3 .

24. The method of making a metal foil ceramic capacitor of claim 10 , wherein said high dielectric constant oxide is selected from the group consisting of BaTiO 3 , SrTiO 3 , CaZrO 3 , Pb(Mg 1/3 Nb 2/3 )O 3 , Pb(Zr 1/2 Ti 1/2 )O 3 including La 2 O 3 , PbTiO 3 and mixtures or solid solutions thereof.

25. A method of forming a circuit, comprising embedding the metal foil ceramic capacitor of claim 10 in a circuit board.

Assignees

• Mcconnell John E
• Bultitude John
• Gurav Abhijit
• Kemet Electronics Corp

Inventors

• Mcconnell John E
• Bultitude John
• Gurav Abhijit

Classifications

• H01G4/1227

  based on alkaline earth titanates · CPC title

• B05D3/06

  by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141}) · CPC title

• H01G13/06

  with provision for removing metal surfaces · CPC title

• H01G13/02 Primary

  Machines for winding capacitors · CPC title

• Y10T29/43

  Electric condenser making · CPC title