Enhanced base die heat path using through-silicon vias
US-2025191998-A1 · Jun 12, 2025 · US
Mccann Aaron is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mccann Aaron |
| Total patents | 16 |
| First publication | Feb 6, 2020 |
| Latest publication | Jun 12, 2025 |
Publications ranked by popularity score, then publication date.
US-2025191998-A1 · Jun 12, 2025 · US
US-12266589-B2 · Apr 1, 2025 · US
US-2024282667-A1 · Aug 22, 2024 · US
US-12057369-B2 · Aug 6, 2024 · US
US-11869824-B2 · Jan 9, 2024 · US
US-11854935-B2 · Dec 26, 2023 · US
US-11832419-B2 · Nov 28, 2023 · US
US-11769753-B2 · Sep 26, 2023 · US
US-11679407-B2 · Jun 20, 2023 · US
US-2023128903-A1 · Apr 27, 2023 · US
Latest publications not already listed above.
US-2021272885-A1 · Sep 2, 2021 · US
US-2021257277-A1 · Aug 19, 2021 · US
US-2021195798-A1 · Jun 24, 2021 · US
US-2021134698-A1 · May 6, 2021 · US
US-2021125896-A1 · Apr 29, 2021 · US
US-2020043894-A1 · Feb 6, 2020 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 16 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/22 | 15 |
| H10W90/00 | 14 |
| H10W90/724 | 14 |
| H10W90/288 | 12 |
| H10W40/70 | 12 |