Microelectronic device with embedded die substrate on interposer
US-2026018529-A1 · Jan 15, 2026 · US
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May Robert Alan patents
May Robert Alan is listed as an inventor on 113 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | May Robert Alan |
| Total patents | 113 |
| First publication | Sep 21, 2017 |
| Latest publication | Jan 15, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Hybrid panel with a glass substrate
US-2026005160-A1 · Jan 1, 2026 · US
Embedded bridge with protection layer for via formation with bump pitch scaling
US-2026005173-A1 · Jan 1, 2026 · US
Hybrid panel with a glass substrate and plated frame
US-2026001297-A1 · Jan 1, 2026 · US
Integrated circuit packages including substrates with reinforced glass cores
US-2025391718-A1 · Dec 25, 2025 · US
Faraday rotator interconnect as a through-via configuration in a patch architecture
US-12481108-B2 · Nov 25, 2025 · US
Device and method of very high density routing used with embedded multi-die interconnect bridge
US-2025323167-A1 · Oct 16, 2025 · US
Multi-die assemblies with glass support structures
US-2025293122-A1 · Sep 18, 2025 · US
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
US-2025253245-A1 · Aug 7, 2025 · US
Microelectronic component having molded regions with through-mold vias
US-2025226323-A1 · Jul 10, 2025 · US
Recent patents
Latest publications not already listed above.
Methods and apparatus to embed semiconductor devices in cores of package substrates
US-2025218960-A1 · Jul 3, 2025 · US
Resist tenting and plating in core cavity for component attachment
US-2025218879-A1 · Jul 3, 2025 · US
Microelectronic assemblies with strengthened glass cores
US-2025210426-A1 · Jun 26, 2025 · US
Direct bonding for embedded bridges with vias
US-2025183180-A1 · Jun 5, 2025 · US
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate
US-12300613-B2 · May 13, 2025 · US
Microelectronic component having molded regions with through-mold vias
US-2025070030-A1 · Feb 27, 2025 · US
Microelectronic assemblies including a photoimageable dielectric for hybrid bonding and die encapsulation
US-2025006645-A1 · Jan 2, 2025 · US
Microelectronic component having molded regions with through-mold vias
US-12176292-B2 · Dec 24, 2024 · US
Microelectronic device with embedded die substrate on interposer
US-2024332203-A1 · Oct 3, 2024 · US
Device and method of very high density routing used with embedded multi-die interconnect bridge
US-2024258240-A1 · Aug 1, 2024 · US
Microelectronic device with embedded die substrate on interposer
US-12046560-B2 · Jul 23, 2024 · US
Device and method of very high density routing used with embedded multi-die interconnect bridge
US-12040276-B2 · Jul 16, 2024 · US
Optical semiconductor package and method
US-2024219656-A1 · Jul 4, 2024 · US
Optical semiconductor package and method
US-2024219660-A1 · Jul 4, 2024 · US
Optical semiconductor package and method
US-2024219654-A1 · Jul 4, 2024 · US
Optical semiconductor package and method
US-2024219659-A1 · Jul 4, 2024 · US
Device and method of very high density routing used with embedded multi-die interconnect bridge
US-12014989-B2 · Jun 18, 2024 · US
Embedded die architecture and method of making
US-2024128138-A1 · Apr 18, 2024 · US
Hybrid plasmonic waveguide and method for high density packaging integrated with a glass interposer
US-2024111095-A1 · Apr 4, 2024 · US
Enhanced subtractive etch anisotropy using etch rate gradient
US-2024114627-A1 · Apr 4, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 112 |
| Tahoe Res Ltd | 1 |
| Boyapati Sri Ranga Sai | 1 |
| Manepalli Rahul N | 1 |
| Seneviratne Dilan | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 87 |
| H10W70/611 | 79 |
| H10W90/724 | 71 |
| H10W70/635 | 64 |
| H10W70/65 | 59 |