Molded embedded bridge for enhanced EMIB applications
US-10892219-B2 · Jan 12, 2021 · US
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Manepalli Rahul N patents
Manepalli Rahul N holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Apr 7, 2015 |
| Latest publication | Jan 12, 2021 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Package with passivated interconnects
US-10043740-B2 · Aug 7, 2018 · US
Microelectronic package and stacked microelectronic assembly and computing system containing same
US-9159649-B2 · Oct 13, 2015 · US
Flexible underfill compositions for enhanced reliability
US-9068067-B2 · Jun 30, 2015 · US
Multichip integration with through silicon via (TSV) die embedded in package
US-9000599-B2 · Apr 7, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Molded embedded bridge for enhanced EMIB applications
US-10892219-B2 · Jan 12, 2021 · US
Package with passivated interconnects
US-10043740-B2 · Aug 7, 2018 · US
Microelectronic package and stacked microelectronic assembly and computing system containing same
US-9159649-B2 · Oct 13, 2015 · US
Flexible underfill compositions for enhanced reliability
US-9068067-B2 · Jun 30, 2015 · US
Multichip integration with through silicon via (TSV) die embedded in package
US-9000599-B2 · Apr 7, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/00 | 4 |
| H10W90/724 | 4 |
| H10W70/685 | 4 |
| H10W74/15 | 3 |
| H10W90/701 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 5 |
| Chemistry & Metallurgy | 1 |
| Cross-Sectional Technologies | 1 |