Faraday rotator interconnect as a through-via configuration in a patch architecture

Patent metadata

Field	Value
Publication number	US-12481108-B2
Application number	US-202017122340-A
Country	US
Kind code	B2
Filing date	Dec 15, 2020
Priority date	Dec 15, 2020
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.

First claim

What is claimed is:

1 . A photonics package, comprising:
an interposer; a patch over the interposer, the patch vertically separated from the interposer, and the patch coupled to the interposer by a plurality of interconnects, wherein the patch overhangs an edge of the interposer; a photonics die on the patch; and a Faraday rotator in an opening passing through a thickness of the patch, wherein the opening and the Faraday rotator are in a portion of the patch that overhangs the edge of the interposer, wherein the Faraday rotator is below the photonics die, and wherein the photonics die is vertically overlapping with the opening.

2 . The photonics package of claim 1 , wherein the Faraday rotator comprises:
a tube; a first polarizer in the tube; a second polarizer in the tube; and a magnetic region between the first polarizer and the second polarizer.

3 . The photonics package of claim 2 , wherein the Faraday rotator further comprises:
a first lens in the tube; and a second lens in the tube, wherein the first polarizer and the second polarizer are between the first lens and the second lens.

4 . The photonics package of claim 2 , further comprising:
a connector over an end of the tube; and an optical cable coupled to the connector.

5 . The photonics package of claim 4 , wherein the connector is on a surface of the patch opposite from the photonics die.

6 . The photonics package of claim 2 , further comprising:
a dielectric shell around the tube, wherein the dielectric shell mechanically couples the tube to the patch.

7 . The photonics package of claim 1 , further comprising:
an opening through the patch, wherein the Faraday rotator is provided in the opening.

8 . The photonics package of claim 7 , wherein the Faraday rotator comprises:
a magnetic shell in the opening; and an optically clear plug within the magnetic shell.

9 . The photonics package of claim 8 , further comprising:
a lens over the optically clear plug on a surface of the patch opposite from the photonics die.

10 . The photonics package of claim 9 , further comprising:
an optical cable connected to the lens.

11 . The photonics package of claim 1 , further comprising:
a compute die over the patch.

12 . The photonics package of claim 11 , wherein the compute die is communicatively coupled to the photonics die by a bridge embedded in the patch.

13 . A patch for an electronic package, wherein the patch comprises:
a patch substrate for coupling to separate interposer by a plurality of interconnects, wherein the patch substrate comprises a core and routing layers above and below the core; a Faraday rotator in an opening passing through a thickness of the patch substrate, wherein the opening and the Faraday rotator are in a portion of the patch for overhanging an edge of the interposer; and a photonics die over the patch substrate, wherein the photonics die is above the Faraday rotator, and wherein the photonics die is vertically overlapping with the opening.

14 . The patch of claim 13 , wherein the Faraday rotator comprises:
a tube; a first polarizer in the tube; a second polarizer in the tube; and a magnetic region between the first polarizer and the second polarizer.

15 . The patch of claim 13 , wherein the Faraday rotator comprises:
a magnetic shell passing through the thickness of the patch substrate; and an optically clear plug filling the interior of the magnetic shell.

16 . The patch of claim 13 , further comprising:
a compute die over the patch substrate, wherein the compute die is communicatively coupled to the photonics die by a bridge embedded in the patch substrate.

17 . An electronic system, comprising:
a board; an interposer over the board; a patch over the interposer, the patch vertically separated from the interposer, and the patch coupled to the interposer by a plurality of interconnects, wherein the patch overhangs an edge of the interposer; a photonics die over the patch; a compute die over the patch, wherein the compute die is communicatively coupled to the photonics die by a bridge embedded in the patch; and a Faraday rotator in an opening passing through a thickness of the patch, wherein the opening and the Faraday rotator are in a portion of the patch that overhangs the edge of the interposer, wherein the Faraday rotator is below the photonics die, and wherein the photonics die is vertically overlapping with the opening.

18 . The electronic system of claim 17 , wherein the Faraday rotator comprises:
a tube; a first polarizer in the tube; a second polarizer in the tube; and a magnetic region between the first polarizer and the second polarizer.

19 . The electronic system of claim 17 , wherein the Faraday rotator comprises:
a magnetic shell passing through the thickness of the patch; and an optically clear plug filling the interior of the magnetic shell.

Assignees

• Intel Corp

Inventors

• Marin Brandon C
• Pratap Divya
• Tanaka Hiroki
• Deshpande Nitin
• Karhade Omkar
• May Robert Alan
• Boyapati Sri Ranga Sai
• Pietambaram Srinivas V
• Li Xiaoqian
• Vadlamani Sai
• Ecton Jeremy

Classifications

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• G02B6/2746 Primary

  comprising non-reciprocal devices, e.g. isolators, FRM, circulators, quasi-isolators (magneto-optic non-reciprocal devices G02F1/093) · CPC title