Expandable thermal solution for laptops
US-12061502-B2 · Aug 13, 2024 · US
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Loo Howe Yin patents
Loo Howe Yin is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Loo Howe Yin |
| Total patents | 43 |
| First publication | Oct 1, 2015 |
| Latest publication | Aug 13, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Laptop arrangement for heat control
US-2024147654-A1 · May 2, 2024 · US
Composite printed circuit boards and devices
US-2024006786-A1 · Jan 4, 2024 · US
Multi-orientation display device
US-2023409084-A1 · Dec 21, 2023 · US
Micro-hinge for an electronic device
US-11639623-B2 · May 2, 2023 · US
Device, method and system for providing recessed interconnect structures of a substrate
US-11355427-B2 · Jun 7, 2022 · US
Expandable thermal solution for laptops
US-2021333848-A1 · Oct 28, 2021 · US
Three-dimensional decoupling integration within hole in motherboard
US-11006514-B2 · May 11, 2021 · US
3D stacked-in-recess system in package
US-10943792-B2 · Mar 9, 2021 · US
Micro-hinge for an electronic device
US-2020325711-A1 · Oct 15, 2020 · US
Recent patents
Latest publications not already listed above.
Multi-orientation display device
US-2020192432-A1 · Jun 18, 2020 · US
Extended stiffener for platform miniaturization
US-10643983-B2 · May 5, 2020 · US
Micro-hinge for an electronic device
US-10633898-B2 · Apr 28, 2020 · US
Three-dimensional decoupling integration within hole in motherboard
US-2019394871-A1 · Dec 26, 2019 · US
Multi-orientation display device
US-10503211-B2 · Dec 10, 2019 · US
Wearable electronic devices and components thereof
US-10394280-B2 · Aug 27, 2019 · US
3d stacked-in-recess system in package
US-2019206698-A1 · Jul 4, 2019 · US
Device, method and system for providing recessed interconnect structures of a substrate
US-2019131227-A1 · May 2, 2019 · US
Micro-hinge for an electronic device
US-2019093402-A1 · Mar 28, 2019 · US
Extended stiffener for platform miniaturization
US-2019013303-A1 · Jan 10, 2019 · US
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus
US-10153253-B2 · Dec 11, 2018 · US
Microelectronic device attachment on a reverse microelectronic package
US-10136516-B2 · Nov 20, 2018 · US
Microelectronic device having an air core inductor
US-10085342-B2 · Sep 25, 2018 · US
Inductor interconnect
US-10083922-B2 · Sep 25, 2018 · US
Micro-hinge for an electronic device
US-10041282-B2 · Aug 7, 2018 · US
Micro-hinge for an electronic device
US-10036187-B2 · Jul 31, 2018 · US
Package-bottom interposers for land-side configured devices for system-in-package apparatus
US-2018175002-A1 · Jun 21, 2018 · US
Microelectronic device having an air core inductor
US-2018168043-A1 · Jun 14, 2018 · US
Wearable electronic devices and components thereof
US-2018157289-A1 · Jun 7, 2018 · US
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus
US-2018145051-A1 · May 24, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 43 |
| Loo Howe Yin | 3 |
| Cheah Bok Eng | 2 |
| Lim Min Suet | 2 |
| Kong Jackson Chung Peng | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 16 |
| H10W90/00 | 14 |
| G06F1/1616 | 13 |
| G06F1/1681 | 10 |
| G06F1/1618 | 10 |