Manufacturing method for semiconductor using warpage compensation wafer and manufacturing method for warpage compensation wafer
US-2025379091-A1 · Dec 11, 2025 · US
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Lee Sukwon patents
Lee Sukwon is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Sukwon |
| Total patents | 16 |
| First publication | Apr 28, 2016 |
| Latest publication | Dec 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Atomic layer deposition apparatus
US-2025369112-A1 · Dec 4, 2025 · US
Method of manufacturing a semiconductor package
US-11848301-B2 · Dec 19, 2023 · US
Method of manufacturing a semiconductor package
US-2023238351-A1 · Jul 27, 2023 · US
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
US-11626381-B2 · Apr 11, 2023 · US
Semiconductor chip bonding apparatus including head having thermally conductive materials
US-11607741-B2 · Mar 21, 2023 · US
Semiconductor packages including die over-shift indicating patterns
US-11239177-B2 · Feb 1, 2022 · US
Bonding head, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
US-2021098415-A1 · Apr 1, 2021 · US
Semiconductor chip bonding apparatus including head having thermally conductive materials
US-2021069811-A1 · Mar 11, 2021 · US
Semiconductor packages including die over-shift indicating patterns
US-2020286838-A1 · Sep 10, 2020 · US
Recent patents
Latest publications not already listed above.
Semiconductor packages including die over-shift indicating patterns
US-10692816-B2 · Jun 23, 2020 · US
Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance
US-10312196-B2 · Jun 4, 2019 · US
Semiconductor packages including die over-shift indicating patterns
US-2019139900-A1 · May 9, 2019 · US
Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance
US-2019019761-A1 · Jan 17, 2019 · US
Bonding apparatus and substrate manufacturing equipment including the same
US-9553069-B2 · Jan 24, 2017 · US
Bonding apparatus and substrate manufacturing equipment including the same
US-2016118362-A1 · Apr 28, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 10 |
| Sk Hynix Inc | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 14 |
| H10W90/732 | 12 |
| H10W90/734 | 10 |
| H10W72/00 | 8 |
| H10W74/15 | 8 |