Semiconductor packages including die over-shift indicating patterns

Patent metadata

Field	Value
Publication number	US-11239177-B2
Application number	US-202016884777-A
Country	US
Kind code	B2
Filing date	May 27, 2020
Priority date	Nov 9, 2017
Publication date	Feb 1, 2022
Grant date	Feb 1, 2022

Abstract

A semiconductor package includes a package substrate including a die attachment region, a semiconductor die attached to the die attachment region, and a die over-shift indicating pattern disposed on or in the package substrate and spaced apart from the die attachment region. The die over-shift indicating pattern is used as a reference pattern for obtaining a shifted distance of the semiconductor die.

First claim

What is claimed is:

1. A semiconductor package comprising:
a package substrate including a die attachment region;
a first semiconductor die attached to the die attachment region;
a second semiconductor die stacked on the first semiconductor die and offset from the first semiconductor die; and
a die over-shift indicating pattern disposed in the package substrate and spaced apart from the die attachment region,
wherein the die over-shift indicating pattern is used as a reference pattern for obtaining a shifted distance of the second semiconductor die,
wherein the die over-shift indicating pattern is configured to detect whether the shifted distance of the second semiconductor die is greater than an allowable range, and
wherein the die over-shift indicating pattern is disposed such that at least a portion of the die over-shift indicating pattern is covered by the second semiconductor die when the shifted distance is greater than the allowable range.

2. The semiconductor package of claim 1 , wherein the die over-shift indicating pattern includes a line-shaped pattern which is parallel with a line at the side of the die attachment region.

3. The semiconductor package of claim 1 , wherein the die over-shift indicating pattern includes two line-shaped patterns which are spaced apart from each other and are parallel with each other.

4. The semiconductor package of claim 1 , wherein the die over-shift indicating pattern is a groove-shaped pattern that is engraved at a surface of the package substrate.

5. The semiconductor package of claim 1 , wherein the die over-shift indicating pattern protrudes from a surface of the package substrate.

6. The semiconductor package of claim 1 , wherein the die over-shift indicating pattern is located at substantially the same level as interconnection patterns formed in the package substrate.

Assignees

• Sk Hynix Inc

Inventors

• Lee Sukwon
• Min Bok Gyu

Classifications

• H10P72/70

  for supporting or gripping · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/385

  Alignment aids, e.g. alignment marks · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title