Bonding apparatus and substrate manufacturing equipment including the same

Patent metadata

Field	Value
Publication number	US-9553069-B2
Application number	US-201514852825-A
Country	US
Kind code	B2
Filing date	Sep 14, 2015
Priority date	Oct 23, 2014
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.

First claim

What is claimed is:

1. A bonding apparatus comprising:
an upper stage;
a lower stage facing the upper stage and dedicated to support a stack of electronic components to be bonded; and
an elevating mechanism that raises and lowers the lower stage relative to the upper stage to produce pressure for compressing a stack of components supported by the lower stage,
wherein the upper stage comprises:
a body having a bottom surface facing towards the lower stage;
an elastic section at the bottom surface of the body; and
an array of blocks supported by the elastic section and exposed at the bottom of the upper stage, whereby the blocks can contact and compress an array of components supported by the lower stage as the upper and lower stages are brought towards each other by the elevating mechanism, and
wherein the elevating mechanism comprises:
a joint connected to the lower stage;
an actuator operatively connected to the lower stage and operable to raise and lower the lower stage; and
a load sensor interposed between the actuator and the joint to detect a load applied to the lower stage in the vertical direction.

2. The bonding apparatus of claim 1 , wherein the upper stage further comprises first bridges connecting the blocks to each other.

3. The bonding apparatus of claim 2 , wherein the first bridges and the blocks are disposed at the bottom surface of the elastic member in a pattern of a mesh.

4. The bonding apparatus of claim 3 , wherein the blocks are located at nodes of the mesh, the nodes being locations where the first bridges would otherwise intersect.

5. The bonding apparatus of claim 2 , wherein each of the blocks is rectangular, and
cross-shaped portions of the elastic member are delimited and exposed by the first bridges and the blocks.

6. The bonding apparatus of claim 2 , wherein each of the first bridges comprises a flexible film.

7. The bonding apparatus of claim 2 , wherein the upper stage comprises:
a heating member disposed in the elastic member to heat upper ones of the electronic components stack on and supported by the lower stage; and
second bridges connecting the first bridges to the heating member.

8. The bonding apparatus of claim 7 , wherein each of the first bridges, the second bridges, and the blocks comprises a metal.

9. The bonding apparatus of claim 7 , wherein the second bridges pass through the first bridges, and
the blocks have first sections disposed in the elastic member as interposed between the first bridges and the body, and second sections disposed on bottom surfaces of the first bridges and coupled to the first blocks.

10. The bonding apparatus of claim 1 , further comprising a stage position monitor that controls a position of the lower stage,
wherein the stage position monitor comprises:
first actuators operatively connected to the lower stage to move the lower stage in a direction parallel to the bottom surface of the upper stage; and
position sensors disposed adjacent to the first actuators to sense a distance over which the lower stage has been moved by the first actuators.

11. The bonding apparatus of claim 10 , wherein the stage position monitor further comprises:
level sensors disposed on a side of the lower stage and operative to detect a degree to which the upper surface of the lower stage is level; and
columns disposed laterally of the lower stage adjacent to the level sensors, respectively, and having reference scales for each of the level sensors.

12. A bonding apparatus comprising:
a frame;
an upper stage disposed within and supported by an upper portion of the frame;
a lower stage disposed within and supported by a lower portion of the frame, the lower stage dedicated to support a stack of electronic components to be bonded;
a jack disposed under the frame and connected to the lower stage to move the lower stage towards the upper stage such that a stack of components supported by the lower stage can be compressed by and between the upper and lower stages; and
a stage position monitor that controls a position of the lower stage,
wherein the upper stage comprises:
a body having a bottom surface facing towards the lower stage;
an elastic section at the bottom surface of the body; and
an array of blocks supported by the elastic section and exposed at a bottom of the upper stage, whereby the blocks can contact and compress an array of components supported by the lower stage as the lower stage is brought towards the upper stage by the jack, and
wherein the stage position monitor comprises:
level sensors disposed on a side of the lower stage and operative to detect a degree to which the upper surface of the lower stage is level; and
columns disposed laterally of the lower stage adjacent to the level sensors, respectively, and having reference scales for each of the level sensors.

13. The bonding apparatus of claim 12 ,
wherein the stage position monitor further comprises:
first actuators operatively connected to the lower stage to move the lower stage in a direction parallel to the bottom surface of the upper stage; and
position sensors disposed adjacent to the first actuators to sense a distance over which the lower stage has been moved by the first actuators.

14. Semiconductor device manufacturing equipment comprising:
a chip mounter that produces an unbonded stack of electronic components including chips disposed on a substrate, the chip mounter comprising a substrate support and a chip picker that sets chips in an array on a substrate supported by the substrate support;
a bonding apparatus that bonds the chips, the bonding apparatus comprising:
a lower stage,
an upper stage including a body having a bottom surface facing towards the lower stage, an elastic section at the bottom surface of the body, and an array of blocks supported by the elastic section and exposed at the bottom of the lower stage, and
an elevating mechanism that raises and lowers the lower stage relative to the upper stage,
wherein the elevating mechanism comprises:
a joint connected to the lower stage,
an actuator operatively connected to the lower stage and operable to raise and lower the lower stage, and
a load sensor interposed between the actuator and the joint to detect a load applied to the lower stage in the vertical direction; and
a transfer unit that transfers the unbonded stack of electronic components from the chip mounter to the lower stage of the bonding apparatus,
whereby the blocks of the bonding apparatus can contact the array of chips of an unbonded stack of electronic components supported by the lower stage and compress the stack with the lower stage as the upper and lower stages are brought towards each other by the elevating mechanism.

15. The manufacturing equipment as claimed in claim 14 , wherein at least one of the stages of the bonding apparatus comprises a heater.

16. The manufacturing equipment as claimed in claim 14 , wherein the elastic section is a pad of elastomeric material, and the blocks are of material that is more rigid than the elastomeric material.

17. The manufacturing equipment as claimed in claim 14 , wherein the upper stage further comprises bridges of flexible material, discrete from the pad of elastomeric material, and connecting the blocks to each other.

18. The bonding apparatus of claim 17 , wherein the upper stage further comprises:
a heating element of a heater disposed in the pad of elastomeric material; and
second bridges connecting the first bridges to the heating element.

19. The bonding appara

Assignees

• Samsung Electronics Co Ltd

Inventors

• Han Ilyoung
• Kim Kyoungran
• Shim Donggil
• Oh Geunsik
• Lee Youngjoo
• Lee Junho
• Lee Sukwon

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title