Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same

Patent metadata

Field	Value
Publication number	US-11626381-B2
Application number	US-202016837025-A
Country	US
Kind code	B2
Filing date	Apr 1, 2020
Priority date	Sep 27, 2019
Publication date	Apr 11, 2023
Grant date	Apr 11, 2023

Abstract

A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

First claim

What is claimed is:

1. A bonding head for a die bonding apparatus, the bonding head comprising:
a head body;
a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and
a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

2. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein the thermal compensating block extends to surround a corner portion of the die.

3. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein the thermal compensating block extends to completely surround the die.

4. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein the thermal compensating block includes a thermal insulating material.

5. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein a spacing distance between the second heating surface and the side surface of the die is 10 mm or less.

6. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein the thermal compensating block has a height from the lower surface of the head body that is less than a height of the die from the lower surface of the head body.

7. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein the thermal compensating block includes a plurality of stacked blocks.

8. The bonding head for a die bonding apparatus as claimed in claim 7 , wherein at least one stacked block of the plurality of stacked blocks has a spacing distance from the side surface of the die that is different from a spacing distance from the side surface of the die to at least one other stacked block of the plurality of stacked blocks.

9. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein the second heating surface is perpendicular to the first heating surface.

10. The bonding head for a die bonding apparatus as claimed in claim 1 , wherein the heater includes a plurality of heating sources, a temperature of each heating source of the plurality of heating sources being controlled independently.

11. A bonding head for a die bonding apparatus, the bonding head comprising:
a head body;
a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and
a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a heat reflective surface that reflects heat from the die held on the thermal pressurizer.

12. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein the thermal compensating block includes a thermal insulating material.

13. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein:
the thermal compensating block includes a heating source therein, and
the heat reflective surface is a second heating surface that faces a side surface of the die.

14. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein the thermal compensating block extends to surround a corner portion of the die.

15. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein the thermal compensating block extends to completely surround the die.

16. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein a spacing distance between the second heating surface and the side surface of the die is 10 mm or less.

17. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein the thermal compensating block has a height from the lower surface of the head body less than a height of the die from the lower surface of the head body.

18. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein the thermal compensating block includes a plurality of stacked blocks.

19. The bonding head for a die bonding apparatus as claimed in claim 18 , wherein at least one stacked block of the plurality of stacked blocks has a spacing distance from the side surface of the die that is different from a spacing distance from the side surface of the die to at least one other stacked block of the plurality of stacked blocks.

20. The bonding head for a die bonding apparatus as claimed in claim 11 , wherein the heater includes a plurality of heating sources, a temperature of each heating source of the plurality of heating sources being controlled independently.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Jonggu
• KIM SungHyup
• Kim Byungjo
• Lee Sanghoon
• Lee Sukwon
• Choi Sebin

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title