Semiconductor memory device with selection patterns, storage patterns, and a gap fill layer and method for fabricating the same
US-11856794-B2 · Dec 26, 2023 · US
Lee Ja Bin is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Ja Bin |
| Total patents | 20 |
| First publication | Jan 18, 2018 |
| Latest publication | Dec 26, 2023 |
Publications ranked by popularity score, then publication date.
US-11856794-B2 · Dec 26, 2023 · US
US-11616197-B2 · Mar 28, 2023 · US
US-2022059615-A1 · Feb 24, 2022 · US
US-11245073-B2 · Feb 8, 2022 · US
US-11211427-B2 · Dec 28, 2021 · US
US-11202511-B2 · Dec 21, 2021 · US
US-11152064-B2 · Oct 19, 2021 · US
US-2021193922-A1 · Jun 24, 2021 · US
US-2021120959-A1 · Apr 29, 2021 · US
US-2020365801-A1 · Nov 19, 2020 · US
Latest publications not already listed above.
US-10777745-B2 · Sep 15, 2020 · US
US-10700266-B2 · Jun 30, 2020 · US
US-2020152264-A1 · May 14, 2020 · US
US-2020091234-A1 · Mar 19, 2020 · US
US-2020075853-A1 · Mar 5, 2020 · US
US-10128312-B2 · Nov 13, 2018 · US
US-9985204-B2 · May 29, 2018 · US
US-2018040669-A1 · Feb 8, 2018 · US
US-2018019281-A1 · Jan 18, 2018 · US
US-2018019392-A1 · Jan 18, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 17 |
| Cj Cgv Co Ltd | 2 |
| Hyesung Mfg Co Ltd | 2 |
| Univ Hanyang Ind Univ Coop Found | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10N70/231 | 17 |
| H10N70/826 | 17 |
| H10B63/24 | 17 |
| H10N70/8828 | 17 |
| H10N70/882 | 15 |