Method of controlling exhausting of equipment in multi-equipment system
US-2026056523-A1 · Feb 26, 2026 · US
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KIM SungHyup patents
KIM SungHyup is listed as an inventor on 64 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | KIM SungHyup |
| Total patents | 64 |
| First publication | Apr 20, 2017 |
| Latest publication | Feb 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Light generation device and lithography apparatus including the same
US-2026050226-A1 · Feb 19, 2026 · US
Deposition apparatus
US-2026035781-A1 · Feb 5, 2026 · US
Method of manufacturing semiconductor element
US-2026018535-A1 · Jan 15, 2026 · US
Wafer chucking system
US-2026005061-A1 · Jan 1, 2026 · US
Semiconductor manufacturing method using warpage deformation
US-2026005071-A1 · Jan 1, 2026 · US
Manufacturing method for semiconductor using warpage compensation wafer and manufacturing method for warpage compensation wafer
US-2025379091-A1 · Dec 11, 2025 · US
Atomic layer deposition apparatus
US-2025369112-A1 · Dec 4, 2025 · US
Substrate processing apparatus
US-2025216802-A1 · Jul 3, 2025 · US
Substrate processing apparatus
US-12298676-B2 · May 13, 2025 · US
Recent patents
Latest publications not already listed above.
Catalyst scrubber apparatus
US-2025135448-A1 · May 1, 2025 · US
Gas mixer
US-2025128215-A1 · Apr 24, 2025 · US
Semiconductor devices including substrate structure
US-2025107190-A1 · Mar 27, 2025 · US
Extreme ultraviolet (euv) source and a substrate processing apparatus including the same
US-2025076776-A1 · Mar 6, 2025 · US
Extreme ultraviolet light generating device
US-2025081320-A1 · Mar 6, 2025 · US
Wafer before semiconductor process and semiconductor chip manufacturing method using the same
US-2025046727-A1 · Feb 6, 2025 · US
Top module and exposing apparatus including the same
US-2025021008-A1 · Jan 16, 2025 · US
Gas mixing device, substrate processing system including the same, and substrate processing method using the same
US-2024424457-A1 · Dec 26, 2024 · US
Robot blade
US-2024416529-A1 · Dec 19, 2024 · US
Plasma treatment apparatus, a method of monitoring a process of manufacturing a semiconductor device by using the same, and a method of manufacturing a semiconductor device including the monitoring method
US-12170233-B2 · Dec 17, 2024 · US
Source vessel for euv
US-2024215140-A1 · Jun 27, 2024 · US
Substrate processing apparatus
US-2024142886-A1 · May 2, 2024 · US
Extreme ultraviolet light source device
US-2024121877-A1 · Apr 11, 2024 · US
Apparatus for heating wafer
US-2024071806-A1 · Feb 29, 2024 · US
Pipe blockage prediction methods
US-2024061982-A1 · Feb 22, 2024 · US
Target debris collection device and extreme ultraviolet light source apparatus including the same
US-11852984-B2 · Dec 26, 2023 · US
Method of manufacturing a semiconductor package
US-11848301-B2 · Dec 19, 2023 · US
Chip bonding apparatus and method of manufacturing semiconductor device using the apparatus
US-11837573-B2 · Dec 5, 2023 · US
Apparatus for generating extreme ultraviolet light and lithography apparatus including the same
US-11720027-B2 · Aug 8, 2023 · US
Method of manufacturing a semiconductor package
US-2023238351-A1 · Jul 27, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 64 |
| Samsung Electronics Ltd | 1 |
| Iucf Hyu | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/70033 | 23 |
| G03F7/70916 | 19 |
| H05G2/008 | 19 |
| G03F7/70925 | 12 |
| G03F7/2004 | 12 |