Apparatus and method for effectively mapping reference signal for v2x communication in wireless communication system
US-2026067145-A1 · Mar 5, 2026 · US
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Kim Joonsung patents
Kim Joonsung is listed as an inventor on 53 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kim Joonsung |
| Total patents | 53 |
| First publication | May 21, 2020 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Three-dimensional semiconductor memory device and electronic system including the same
US-12550324-B2 · Feb 10, 2026 · US
Semiconductor package
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Semiconductor package
US-12438133-B2 · Oct 7, 2025 · US
Semiconductor device including separate upper channel structures and electronic system including the same
US-12439603-B2 · Oct 7, 2025 · US
Fan-out semiconductor package
US-12283577-B2 · Apr 22, 2025 · US
Apparatus and method for effectively mapping reference signal for V2X communication in wireless communication system
US-12284066-B2 · Apr 22, 2025 · US
Apparatus and method for effectively mapping reference signal for v2x communication in wireless communication system
US-2025106083-A1 · Mar 27, 2025 · US
Semiconductor device and electronic system including the same
US-2025081457-A1 · Mar 6, 2025 · US
Semiconductor package
US-2025069979-A1 · Feb 27, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor package
US-12176262-B2 · Dec 24, 2024 · US
Fan-out semiconductor packages
US-12159833-B2 · Dec 3, 2024 · US
Semiconductor package
US-2024363542-A1 · Oct 31, 2024 · US
Semiconductor package
US-12062617-B2 · Aug 13, 2024 · US
Semiconductor package
US-2024243053-A1 · Jul 18, 2024 · US
Semiconductor package including a redistribution structure
US-2024186231-A1 · Jun 6, 2024 · US
Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system
US-11968648-B2 · Apr 23, 2024 · US
Semiconductor device and semiconductor package comprising the same
US-2024065002-A1 · Feb 22, 2024 · US
Semiconductor package
US-2024040806-A1 · Feb 1, 2024 · US
Semiconductor package
US-2024038642-A1 · Feb 1, 2024 · US
Semiconductor package
US-2024030089-A1 · Jan 25, 2024 · US
Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad
US-11854912-B2 · Dec 26, 2023 · US
Semiconductor package
US-11798862-B2 · Oct 24, 2023 · US
Fan-out semiconductor package
US-11791230-B2 · Oct 17, 2023 · US
Semiconductor packages
US-11735532-B2 · Aug 22, 2023 · US
Communication device for performing beamforming and operating method thereof
US-11689262-B2 · Jun 27, 2023 · US
Fan-out semiconductor package
US-2023187424-A1 · Jun 15, 2023 · US
Fan-out semiconductor packages
US-2023163070-A1 · May 25, 2023 · US
Mask layout design method, mask and integrated circuit manufacturing methods, masks and integrated circuits
US-2023161937-A1 · May 25, 2023 · US
Semiconductor package
US-2023054984-A1 · Feb 23, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 53 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 33 |
| H10W90/00 | 33 |
| H10W70/65 | 29 |
| H10W70/60 | 29 |
| H10W72/90 | 27 |