Methods for depositing a titanium aluminum carbide film structure on a substrate and related semiconductor structures
US-12518970-B2 · Jan 6, 2026 · US
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Johnson Ward patents
Johnson Ward is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Johnson Ward |
| Total patents | 21 |
| First publication | Jul 18, 2019 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US-12020938-B2 · Jun 25, 2024 · US
Wafer handling chamber with moisture reduction
US-11837483-B2 · Dec 5, 2023 · US
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
US-11501973-B2 · Nov 15, 2022 · US
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US-2022351974-A1 · Nov 3, 2022 · US
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US-11398382-B2 · Jul 26, 2022 · US
Wafer handling chamber with moisture reduction
US-2022165595-A1 · May 26, 2022 · US
Wafer handling chamber with moisture reduction
US-11270899-B2 · Mar 8, 2022 · US
Methods for depositing a titanium aluminum carbide film structure on a substrate and related semiconductor structures
US-2022051895-A1 · Feb 17, 2022 · US
Method for forming a doped metal carbide film on a substrate and related semiconductor device structures
US-2021328036-A1 · Oct 21, 2021 · US
Recent patents
Latest publications not already listed above.
Method of forming a doped metal carbide film on a substrate and related semiconductor device structures
US-11056567-B2 · Jul 6, 2021 · US
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
US-2021066084-A1 · Mar 4, 2021 · US
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US-2021028021-A1 · Jan 28, 2021 · US
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
US-10872771-B2 · Dec 22, 2020 · US
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US-10847371-B2 · Nov 24, 2020 · US
Gas distribution device for a wafer processing apparatus
US-10829852-B2 · Nov 10, 2020 · US
Gas distribution device for a wafer processing apparatus
US-2020056282-A1 · Feb 20, 2020 · US
Wafer handling chamber with moisture reduction
US-2019371640-A1 · Dec 5, 2019 · US
Method of forming a doped metal carbide film on a substrate and related semiconductor device structures
US-2019348515-A1 · Nov 14, 2019 · US
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US-2019304790-A1 · Oct 3, 2019 · US
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
US-2019221433-A1 · Jul 18, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Asm Ip Holding Bv | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D64/01318 | 15 |
| H10D64/667 | 15 |
| H01L21/28088 | 15 |
| C23C16/45553 | 14 |
| H10P14/668 | 13 |