Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures

Patent metadata

Field	Value
Publication number	US-10872771-B2
Application number	US-201916242829-A
Country	US
Kind code	B2
Filing date	Jan 8, 2019
Priority date	Jan 16, 2018
Publication date	Dec 22, 2020
Grant date	Dec 22, 2020

Abstract

A method of depositing a material film on a substrate within a reaction chamber by a cyclical deposition process is disclosed. The method may include: contacting the substrate with a first vapor phase reactant and purging the reaction chamber with a first main purge. The method also includes: contacting the substrate with a second vapor phase reactant by two or more micro pulsing processes, wherein each micro pulsing process comprises: contacting the substrate with a micro pulse of a second vapor phase reactant; and purging the reaction chamber with a micro purge, wherein each of the micro pulses of the second vapor phase reactant provides a substantially constant concentration of the second vapor phase reactant into the reaction chamber. The method may also include; purging the reaction chamber with a second main purge. Device structures including a material film deposited by the methods of the disclosure are also disclosed.

First claim

What is claimed is:

1. A method of depositing a material film on a substrate within a reaction chamber by a cyclical deposition process, the method comprising;
contacting the substrate with a first vapor phase reactant;
purging the reaction chamber with a first main purge;
contacting the substrate with a second vapor phase reactant by two or more micro pulsing processes, wherein each micro pulsing process is a sub-cycle that comprises:
contacting the substrate with a micro pulse of a second vapor phase reactant, and
purging the reaction chamber with a micro purge, wherein each of the micro pulses of the second vapor phase reactant provides a constant concentration of the second vapor phase reactant into the reaction chamber; and

purging the reaction chamber with a second main purge;
wherein the material film deposited on the substrate comprises a transition metal aluminum carbide;
wherein the transition metal aluminum carbide comprises titanium aluminum carbide (TiAlC); and
wherein the titanium aluminum carbide (TiAlC) has an average titanium to aluminum content ratio (Ti:Al) of less than 0.15.

2. The method of claim 1 , wherein the cyclical deposition process comprises an atomic layer deposition process.

3. The method of claim 1 , wherein the cyclical deposition process comprises a cyclical chemical vapor deposition process.

4. The method of claim 1 , wherein the first vapor phase reactant comprises one or more metal vapor phase reactants.

5. The method of claim 4 , wherein the one or more metal vapor phase reactants comprises at least one transition metal selected from the group consisting of titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), molybdenum (Mo), and tungsten (W).

6. The method of claim 4 , wherein the one or metal vapor phase reactants comprises at least one of a transition metal chloride, a transition metal bromide, a transition metal iodide, or a transition metal fluoride.

7. The method of claim 1 , wherein the second vapor phase reactant comprises a metalorganic precursor.

8. The method of claim 7 , wherein the metalorganic precursor comprises at least one of dimethylaluminumhydride (DMAH) or tritertbutylaluminum (TTBA).

9. The method of claim 1 , wherein each micro pulse of the second vapor phase reactant has a pulse time period of between 0.05 seconds and 10 seconds.

10. The method of claim 1 , wherein each micro purge has a purge time period of between 0.1 seconds and 10 seconds.

11. The method of claim 1 , wherein the titanium aluminum carbide (TiAlC) has an aluminum atomic-% greater than 20%.

12. The method of claim 1 , wherein the titanium aluminum carbide (TiAlC) is deposited with a thickness non-uniformity standard deviation of less than 2% one-sigma.

13. The method of claim 1 , wherein the titanium aluminum carbide (TiAlC) is deposited over a non-planar substrate with a step coverage greater than 90%.

14. The method of claim 1 , further comprising replenishing the concentration of the second vapor source at the source vessel to a constant concentration during each micro purge.

15. A device structure including a material film deposited by the method of claim 1 .

16. A reaction system configured to perform the method of claim 1 .

Assignees

• Asm Ip Holding Bv

Inventors

• Raisanen Petri
• Olstad Mark
• Romero Jose Alexandro
• Li Dong
• Johnson Ward
• Chen Peijun

Classifications

• H10D64/01318

  the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN (comprising a layer of alloys of Si, Ge or C H10D64/01314) · CPC title

• H10D64/667

  the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers (having lateral variation H10D64/671) · CPC title

• H10P14/43 Primary

  Chemical deposition, e.g. chemical vapour deposition [CVD] · CPC title

• H10D84/85

  Complementary IGFETs, e.g. CMOS · CPC title

• H10D84/0165

  the components including complementary IGFETs, e.g. CMOS devices · CPC title