Gas distribution device for a wafer processing apparatus

Patent metadata

Field	Value
Publication number	US-10829852-B2
Application number	US-201815998775-A
Country	US
Kind code	B2
Filing date	Aug 16, 2018
Priority date	Aug 16, 2018
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

A reaction system is disclosed that may be used to prevent formation of contaminants. The reaction system includes a showerhead that may be configured with a gated nanochannel grid to prevent particular gaseous precursors from passing through depending on whether a voltage is applied. The gated nanochannel grid may allow for both polar and non-polar molecules to pass, or may be configured to allow just non-polar or just polar molecules to pass.

First claim

The invention claimed is:

1. A gas distribution device configured to distribute a gaseous precursor over a semiconductor substrate comprising:
a top plate with at least a first top aperture through which a first gaseous precursor flows;
a first plenum disposed below the top plate;
a first gated nanochannel grid;
a first voltage source configured to apply a voltage to the first gated nanochannel grid;
an electrical isolation plate;
a bottom plate; and
a plurality of first bottom apertures, wherein the plurality of first bottom apertures are formed in the electrical isolation plate and the bottom plate,
wherein the voltage applied to the first gated nanochannel grid determines whether the first gated nanochannel grid permits the first gaseous precursor to pass through the plurality of first bottom apertures.

2. The gas distribution device of claim 1 , further comprising:
a second plenum through which a second gaseous precursor flows;
a second gated nanochannel grid;
a second voltage source configured to apply a voltage to the second gated nanochannel grid; and
a plurality of second bottom apertures through which the second gaseous precursor flows,
wherein the voltage applied to the second gated nanochannel grid determines whether the second gated nanochannel grid permits the second gaseous precursor to pass through the plurality of second bottom apertures.

3. The gas distribution device of claim 2 , wherein the second gated nanochannel grid always permits a non-polar gas to pass through to the plurality of second bottom apertures.

4. The gas distribution device of claim 2 , wherein the second voltage applied to the second gated nanochannel grid determines whether a non-polar gas passes through to the plurality of second bottom apertures.

5. The gas distribution device of claim 2 , wherein the second gated nanochannel grid comprises at least one of: mesoporous alumina, mesoporous silica, or carbon nanotubes.

6. The gas distribution device of claim 1 , wherein the first gated nanochannel grid always permits a non-polar gas to pass through to the plurality of first bottom apertures.

7. The gas distribution device of claim 1 , wherein the first voltage applied to the first gated nanochannel grid determines whether a non-polar gas passes through to the plurality of first bottom apertures.

8. The gas distribution device of claim 1 , wherein the first gated nanochannel grid comprises at least one of: mesoporous alumina, mesoporous silica, or carbon nanotubes.

9. The apparatus of claim 1 , wherein the gas distribution device further comprises:
a second plenum through which a second gaseous precursor flows;
a second gated nanochannel grid;
a second voltage source configured to apply a voltage to the second gated nanochannel grid; and
a plurality of second bottom apertures through which the second gaseous precursor flows,
wherein the voltage applied to the second gated nanochannel grid determines whether the second gated nanochannel grid permits the second gaseous precursor to pass through the plurality of second bottom apertures.

10. The apparatus of claim 9 , wherein the second gated nanochannel grid always permits a non-polar gas to pass through to the plurality of second bottom apertures.

11. The apparatus of claim 9 , wherein the second voltage applied to the second gated nanochannel grid determines whether a non-polar gas passes through to the plurality of second bottom apertures.

12. The apparatus of claim 9 , wherein the second gated nanochannel grid comprises at least one of: mesoporous alumina, mesoporous silica, or carbon nanotubes.

13. An apparatus for depositing a film on a semiconductor wafer comprising:
a reaction chamber;
a first gas source configured to provide a first gaseous precursor;
a wafer holder configured to hold a semiconductor wafer; and
a gas distribution device configured to distribute the first gaseous precursor over the semiconductor wafer, the gas distribution device comprising:
a top plate with at least a first top aperture through which the first gaseous precursor flows;
a first plenum disposed below the top plate;
a first gated nanochannel grid;
a first voltage source configured to apply a voltage to the first gated nanochannel grid;
an electrical isolation plate;
a bottom plate; and
a plurality of first bottom apertures, wherein the plurality of first bottom apertures are formed in the electrical isolation plate and the bottom plate,
wherein the voltage applied to the first gated nanochannel grid determines whether the first gated nanochannel grid permits the first gaseous precursor to pass through the plurality of first bottom apertures.

14. The apparatus of claim 13 , wherein the first gated nanochannel grid always permits a non-polar gas to pass through to the plurality of first bottom apertures.

15. The apparatus of claim 13 , wherein the first voltage applied to the first gated nanochannel grid determines whether a non-polar gas passes through to the plurality of first bottom apertures.

16. The apparatus of claim 13 , wherein the first gated nanochannel grid comprises at least one of: mesoporous alumina, mesoporous silica, or carbon nanotubes.

Assignees

• Asm Ip Holding Bv

Inventors

• Raisanen Petri
• Johnson Ward

Classifications

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• C23C16/45544

  characterized by the apparatus · CPC title

• C23C16/52

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• C23C16/45553

  characterized by the use of precursors specially adapted for ALD · CPC title

• C23C16/45565

  Shower nozzles · CPC title