Method of forming a doped metal carbide film on a substrate and related semiconductor device structures

Patent metadata

Field	Value
Publication number	US-11056567-B2
Application number	US-201916400814-A
Country	US
Kind code	B2
Filing date	May 1, 2019
Priority date	May 11, 2018
Publication date	Jul 6, 2021
Grant date	Jul 6, 2021

Abstract

Methods for depositing a doped metal carbide film on a substrate are disclosed. The methods may include: depositing a doped metal carbide film on a substrate utilizing at least one deposition cycle of a cyclical deposition process; and contacting the doped metal carbide film with a plasma generated from a hydrogen-containing gas. Semiconductor device structures including a doped metal carbide film formed by the methods of the disclosure are also disclosed.

First claim

What is claimed is:

1. A method for forming a doped metal carbide film on a substrate, the method comprising:
depositing the doped metal carbide film on the substrate utilizing at least one deposition cycle of a cyclical deposition process, and
contacting the doped metal carbide film with a plasma generated from a hydrogen-containing gas,
wherein depositing the doped metal carbide film is performed in a first reaction chamber and contacting the doped metal carbide film with the plasma is performed in a second reaction chamber.

2. The method of claim 1 , wherein the at least one deposition cycle of the cyclical deposition process comprises contacting the substrate with a first vapor phase reactant comprising a metal precursor and contacting the substrate with a second vapor phase reactant comprising a carbon component and a metal component.

3. The method of claim 1 , wherein the cyclical deposition process comprises an atomic layer deposition process.

4. The method of claim 1 , wherein the steps of depositing the doped metal carbide film and contacting the doped metal carbide film with the plasma are repeated one or more times.

5. The method of claim 2 , wherein the metal precursor comprises a transition metal precursor.

6. The method of claim 5 , wherein the transition metal precursor comprises a transition metal halide.

7. The method of claim 6 , wherein the transitional metal halide comprises at least one of a transition metal chloride, a transition metal bromide, or a transition metal iodide.

8. The method of claim 6 , wherein the transition metal halide comprises at least one of titanium, tantalum, niobium, hafnium, tungsten, molybdenum, or zirconium.

9. The method of claim 2 , wherein the metal component of the second vapor phase reactant comprises aluminum.

10. The method of claim 9 , wherein the second vapor phase reactant comprise an aluminum metalorganic precursor.

11. The method of claim 10 , wherein the aluminum metalorganic precursor comprises at least one of trimethylaluminum (TMA), triethylaluminum (TEA), dimethylaluminumhydride (DMAH), or tritertbutylaluminum (TTBA).

12. The method of claim 10 , wherein the doped metal carbide film comprises an aluminum-doped transition metal carbide film.

13. The method of claim 12 , wherein the aluminum-doped transition metal carbide film comprises a composite material including doped transition metal carbide regions, aluminum carbide regions, and carbon regions.

14. The method of claim 1 , further comprising depositing the doped metal carbide film on the substrate to a thickness of between approximately 10 Angstroms and 15 Angstroms.

15. The method of claim 1 , wherein the plasma is generated by direct plasma, remote plasma, or microwave plasma.

16. The method of claim 1 , wherein the hydrogen-containing gas comprises at least one of hydrogen (H 2 ), ammonia (NH 3 ), hydrazine, or a hydrazine derivative.

17. The method of claim 1 , wherein the contacting the doped metal carbide film with the plasma further comprises removing a portion of a carbon region from the doped metal carbide film.

18. The method of claim 1 , wherein the contacting the doped metal carbide film with the plasma further comprises removing a portion of an oxygen region from the doped metal carbide film.

19. The method of claim 1 , wherein the contacting the doped metal carbide film with the plasma further comprises removing a portion of a chlorine region from the doped metal carbide film.

20. The method of claim 1 , wherein the contacting the doped metal carbide film with the plasma further comprises reducing the electrical resistivity of the doped metal carbide film.

21. The method of claim 1 , wherein the contacting the doped metal carbide film with the plasma further comprises reducing an effective work function of a gate structure including the doped metal carbide film.

22. The method of claim 1 , wherein the contacting the doped metal carbide film with the plasma further comprises heating the substrate to a temperature less than 400° C.

23. A semiconductor device structure formed according to the method of claim 1 .

24. The method of claim 1 , wherein the substrate with the doped metal carbide film disposed thereon is transferred from the first reaction chamber to the second reaction chamber under controlled environmental conditions to substantially prevent oxidation of the doped metal carbide film.

25. The method of claim 1 , further comprising directly depositing a transition metal nitride film over the doped metal carbide film after the doped metal carbide film has been contacted with the plasma.

26. The method of claim 25 , wherein depositing the transition metal nitride film and contacting the doped metal carbide film with the plasma are performed in a same reaction chamber.

27. The method of claim 25 , wherein the transition metal nitride film comprises an amorphous titanium nitride.

28. The method of 25 , wherein depositing the metal nitride film comprises contacting the substrate with a metal precursor and contacting the substrate with a plasma generated from a nitrogen-containing gas.

29. The method of claim 28 , wherein the plasma is generated utilizing a remote microwave plasma generator employing ammonia (NH 3 ) as the nitrogen-containing gas.

Assignees

• Asm Ip Holding Bv

Inventors

• Li Dong
• Hsu Peng-Fu
• Raisanen Petri
• Mousa Moataz Bellah
• Johnson Ward
• Chen Xichong

Classifications

• H10D64/01318 Primary

  the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN (comprising a layer of alloys of Si, Ge or C H10D64/01314) · CPC title

• H10D84/0165

  the components including complementary IGFETs, e.g. CMOS devices · CPC title

• H10D64/662

  the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures · CPC title

• H10D30/60

  Insulated-gate field-effect transistors [IGFET] (H10D30/40 takes precedence) · CPC title

• H10D64/691

  comprising metallic compounds, e.g. metal oxides or metal silicates  (insulators comprising nitrogen H10D64/693) · CPC title