Multi-layered ceramic electronic component
US-12573555-B2 · Mar 10, 2026 · US
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Jo Ji Hong patents
Jo Ji Hong is listed as an inventor on 294 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jo Ji Hong |
| Total patents | 294 |
| First publication | Dec 10, 2019 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Dielectric ceramic composition and multilayer ceramic capacitor comprising the same
US-12562312-B2 · Feb 24, 2026 · US
Multilayer electronic component
US-12548714-B2 · Feb 10, 2026 · US
Dielectric ceramic composition and multilayer ceramic capacitor comprising same
US-12488941-B2 · Dec 2, 2025 · US
Dielectric ceramic composition and multilayer ceramic capacitor comprising the same
US-12482602-B2 · Nov 25, 2025 · US
Dielectric ceramic composition and multilayer ceramic capacitor comprising the same
US-12444536-B2 · Oct 14, 2025 · US
Multilayer capacitor and method of manufacturing the same
US-2025266209-A1 · Aug 21, 2025 · US
Multilayer electronic component for enhanced moisture resistance and bending strength
US-12362100-B2 · Jul 15, 2025 · US
Ceramic electronic component and method of manufacturing the same
US-12347626-B2 · Jul 1, 2025 · US
Dielectric composition and multilayered electronic component comprising the same
US-12340942-B2 · Jun 24, 2025 · US
Recent patents
Latest publications not already listed above.
Multilayer ceramic electronic component
US-12334264-B2 · Jun 17, 2025 · US
Method of manufacturing multilayer capacitor
US-12327684-B2 · Jun 10, 2025 · US
Electronic component and board having the same mounted thereon
US-12322557-B2 · Jun 3, 2025 · US
Ceramic electronic component including insulating layer
US-12308173-B2 · May 20, 2025 · US
Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component
US-12255023-B2 · Mar 18, 2025 · US
Multilayer electronic component
US-12230449-B2 · Feb 18, 2025 · US
Ceramic electronic component with openings in electrode
US-12217914-B2 · Feb 4, 2025 · US
Multilayer capacitor and substrate including the same mounted thereon
US-12205772-B2 · Jan 21, 2025 · US
Multilayer electronic component and method of manufacturing the same
US-12198860-B2 · Jan 14, 2025 · US
Multilayer electronic component
US-12176149-B2 · Dec 24, 2024 · US
Multilayer electronic component
US-12148572-B2 · Nov 19, 2024 · US
Multilayer electronic component including cover layer having insulating and conductive portions
US-12136518-B2 · Nov 5, 2024 · US
Multilayer capacitor and board having the same mounted thereon
US-12136523-B2 · Nov 5, 2024 · US
Dielectric composition and multilayered electronic component comprising the same
US-2024258032-A1 · Aug 1, 2024 · US
Ceramic electronic component and method of manufacturing the same
US-2024203663-A1 · Jun 20, 2024 · US
Dielectric composition and multilayered electronic component comprising the same
US-11984267-B2 · May 14, 2024 · US
Multilayer ceramic capacitor
US-11961673-B2 · Apr 16, 2024 · US
Multilayer ceramic capacitor
US-11955290-B2 · Apr 9, 2024 · US
Ceramic electronic component and method of manufacturing the same
US-11948752-B2 · Apr 2, 2024 · US
Multi-layered ceramic capacitor
US-2024096559-A1 · Mar 21, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 294 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01G4/30 | 294 |
| H01G4/012 | 250 |
| H01G4/232 | 238 |
| H01G4/1227 | 201 |
| H01G4/1209 | 184 |