Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-12548714-B2
Application number	US-202217877507-A
Country	US
Kind code	B2
Filing date	Jul 29, 2022
Priority date	Dec 31, 2021
Publication date	Feb 10, 2026
Grant date	Feb 10, 2026

Abstract

A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface; a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface, and third and fourth band portions; and first and second plating layers respectively disposed on the first and second band portions. The insulating layer includes an oxide containing Ti. The dielectric layer includes one of BaTiO 3 , (Ba 1-x Ca x )TiO 3 (0<x<1), Ba(Ti 1-y Ca y )O 3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0<x<1, 0<y<1) and Ba(Ti 1-y Zr y )O 3 (0<y<1) as a main component.

First claim

What is claimed is:

1 . A multilayer electronic component, comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a second portion of the first surface; an insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion; and a plating layer including a first plating layer disposed on the first band portion and a second plating layer disposed on the second band portion, wherein the insulating layer comprises an oxide containing Ti, and the dielectric layer comprises at least one of BaTiO3, (Ba1-xCax)TiO3 (0<x<1), Ba(Ti1-yCay)O3 (0<y<1), (Ba1-xCax)(Ti1-yZry)O3 (0<x<1, 0<y<1) and Ba(Ti1-yZry)O3 (0<y<1) as a main component, wherein the insulating layer has an average thickness of 50 nm or more and 1000 nm or less, wherein a ratio of the number of moles of Ti element to the total number of moles of elements other than oxygen, among the elements constituting the insulating layer, is 0.95 or more.

2 . The multilayer electronic component of claim 1 , wherein the oxide containing Ti includes TiO2.

3 . The multilayer electronic component of claim 2 , wherein the dielectric layer comprises BaTiO3 as a main component.

4 . The multilayer electronic component of claim 1 , wherein the dielectric layer comprises (Ba1-xCax)TiO3 (0<x<1) as a main component.

5 . The multilayer electronic component of claim 1 , wherein H 1 ≥H 2 is satisfied, in which H 1 is an average distance from the first surface to an internal electrode closest to the first surface among the first and second internal electrodes in the first direction, and H 2 is an average distance from an extension line of the first surface to ends of the first and second plating layers disposed on the first and second connection portions in the first direction.

6 . The multilayer electronic component of claim 1 , wherein H 1 <H 2 is satisfied, in which H 1 is an average distance from the first surface to an internal electrode closest to the first surface among the first and second internal electrodes in the first direction, and H 2 is an average distance from an extension line of the first surface to ends of the first and second plating layers disposed on the first and second connection portions in the first direction.

7 . The multilayer electronic component of claim 6 , wherein H 2 <T/2, in which T is an average size of the body in the first direction.

8 . The multilayer electronic component of claim 1 , wherein the first and second plating layers are disposed below an extension line of the first surface.

9 . The multilayer electronic component of claim 1 , wherein 0.2≤B 1 /L≤0.4 and 0.2≤B 2 /L≤0.4 are satisfied, in which L is an average size of the body in the second direction, B 1 is an average distance from an extension line of the third surface to an end of the first band portion in the second direction, and B 2 is an average distance from an extension line of the fourth surface to an end of the second band portion in the second direction.

10 . The multilayer electronic component of claim 1 , further comprising an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.

11 . The multilayer electronic component of claim 1 , wherein an average thickness of the dielectric layer is 0.35 μm or less.

12 . The multilayer electronic component of claim 1 , wherein an average thickness of the first and second internal electrodes is 0.35 μm or less.

13 . The multilayer electronic component of claim 1 , wherein the body includes a capacitance formation portion including the first and second internal electrodes alternately disposed with the dielectric layer therebetween, and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction,
wherein an average size of the cover portion in the first direction is 15 μm or less.

14 . The multilayer electronic component of claim 1 , wherein an average thickness of the first and second plating layers is less than an average thickness of the insulating layer.

15 . The multilayer electronic component of claim 1 , wherein the first plating layer is disposed to cover an end of the first insulating layer close to the first surface, and the second plating layer is disposed to cover an end of the second insulating layer close to the first surface.

16 . The multilayer electronic component of claim 1 , wherein the first insulating layer is disposed to cover an end of the first plating layer disposed on the first external electrode, and the second insulating layer is disposed to cover an end of the second plating layer disposed on the second external electrode.

17 . The multilayer electronic component of claim 1 , wherein
the first external electrode includes a first side band portion extending from the first connection portion onto portions of the fifth and sixth surfaces, the second external electrode includes a second side band portion extending from the second connection portion onto portions of the fifth and sixth surfaces, and a size of each of the first and second side band portions in the second direction is increased in a direction toward the first surface.

18 . The multilayer electronic component of claim 1 , wherein
the first and second external electrodes are disposed to be spaced apart from the fifth and sixth surfaces.

19 . The multilayer electronic component of claim 1 , wherein
the first and second external electrodes are disposed to be spaced apart from the second surface.

20 . The multilayer electronic component of claim 1 , wherein
the first and second insulating layers extend to the second surface to be connected to each other.

21 . The multilayer electronic component of claim 1 , wherein
the first and second insulating layers extend to the fifth and sixth surfaces to be connected to each other.

22 . The multilayer electronic component of claim 1 , wherein
the first and second insulating layers are not disposed on the second, fifth and sixth surfaces.

23 . The multilayer electronic component of claim 1 , wherein
the first external electrode further includes a third band portion extending from the first connection portion onto a portion of the second surface, and the second external electrode further includes a fourth band portion extending from the second connection portion onto a portion of the second surface.

24 . The multilayer electronic component of claim 1 , wherein
the body has a 1-3-th corner connecting the first and third surfaces to each other, a 1-4-th corner connecting

Assignees

• Samsung Electro Mech

Inventors

• Park Cheol Woo
• Lim Jin Hyung
• Han Seung Hun
• Jo Ji Hong

Classifications

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G4/1227 Primary

  based on alkaline earth titanates · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title