Electronic component and board having the same mounted thereon

Patent metadata

Field	Value
Publication number	US-12322557-B2
Application number	US-202217734355-A
Country	US
Kind code	B2
Filing date	May 2, 2022
Priority date	Sep 18, 2019
Publication date	Jun 3, 2025
Grant date	Jun 3, 2025

Abstract

An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.

First claim

What is claimed is:

1. An electronic component, comprising:
a multilayer capacitor, the multilayer capacitor including a body, and first and second external electrodes, wherein the first and second external electrodes include first and second head portions disposed on both surfaces of the body opposing in a first direction, respectively, and first and second band portions extending from the first and second head portions to a portion of a lower surface of the body, respectively;
a first metal frame including a first support portion attached to the first band portion, a first mounting portion located lower than a lowermost portion of the first external electrode in a third direction perpendicular to the first direction, and a first connection portion connecting the first support portion to the first mounting portion, the first mounting portion being spaced apart from the first head portion and away from the body in the first direction;
a second metal frame including a second support portion attached to the second band portion, a second mounting portion located lower than a lowermost portion of the second external electrode in the third direction, and a second connection portion connecting the second support portion to the second mounting portion, the second mounting portion being spaced apart from the second head portion and away from the body in the first direction; and
a capsule portion encapsulating the multilayer capacitor to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame,
wherein the first connection portion includes a first extension portion extending upwardly from an end of the first mounting portion proximate to the body, a third extension portion extending upwardly from the first support portion and spaced apart from the first head portion and away from the body in the first direction, and a second extension portion connecting the first extension portion and the third extension portion in the first direction wherein the second connection portion includes a fourth extension portion extending upwardly from an end of the second mounting portion proximate to the body, a sixth extension portion extending upwardly from the second support portion and spaced apart from the second head portion and away from the body in the first direction, and a fifth extension portion connecting the fourth extension portion and the sixth extension portion in the first direction, and
wherein the first extension portion and the fourth extension portion are apart from the capsule portion.

2. The electronic component of claim 1 , wherein a first conductive bonding layer disposed between the first band portion and an upper surface of the first support portion bonds the first band portion and the first support portion, and a second conductive bonding layer disposed between the second band portion and an upper surface of the second support portion bonds the first band portion and the first support portion.

3. The electronic component of claim 1 , wherein the first and fourth extension portions are disposed outside the capsule portion, the third and sixth extension portions are disposed inside the capsule portion, and the second and fifth extension portions extend from inside of the capsule portion to outside of the capsule portion.

4. The electronic component of claim 1 , wherein the body includes a dielectric layer, and first and second internal electrodes alternatively disposed with the dielectric layer interposed therebetween, and the first and second internal electrodes includes nickel.

5. The electronic component of claim 1 , wherein the capsule portion includes at least one of epoxy resin and silica based epoxy molding compound (EMC).

6. The electronic component of claim 1 , wherein the first external electrode includes a first sintered electrode including copper and a first plating layer covering a surface of the first sintered electrode, and the second external electrode includes a second sintered electrode including copper and a second plating layer covering a surface of the second sintered electrode.

7. The electronic component of claim 6 , wherein plating layer includes a first nickel plating layer covering the surface of the first sintered electrode and a first tin plating layer covering a surface of the first nickel plating layer, and
the second plating layer includes a second nickel plating layer covering the surface of the second sintered electrode and a second tin plating layer covering a surface of the second nickel plating layer.

8. The electronic component of claim 7 , wherein a first conductive bonding layer disposed between the first band portion and an upper surface of the first support portion bonds the first band portion and the first support portion, and a second conductive bonding layer disposed between the second band portion and an upper surface of the second support portion bonds the first band portion and the first support portion.

9. The electronic component of claim 8 , wherein the first conductive bonding layer include the same metal component as a metal component of the first band portion as a main component, and
the second conductive bonding layer include the same metal component as a metal component of the second band portion as a main component.

10. The electronic component of claim 1 , wherein
the first external electrode is disposed to be spaced apart from the first extension portion, and the second external electrode is disposed to be spaced apart from the fourth extension portion.

11. The electronic component of claim 10 , wherein at least a portion of capsule portion is disposed in a space where the first external electrode and the first extension portion are spaced apart from each other, and in a space where the second external electrode and the fourth extension portion are spaced apart from each other.

12. The electronic component of claim 1 , wherein the first connection portion is located lower than an uppermost portion of the first external electrode in the third direction, and the second connection portion is located lower than an uppermost portion of the second external electrode in the third direction.

13. The electronic component of claim 1 , wherein at least one protruding portion is disposed on a lower surface of the capsule portion.

14. The electronic component of claim 13 , wherein the protruding portion is disposed in vicinity of edges of the lower surface of the capsule portion.

15. The electronic component of claim 13 , wherein a lower end of the protruding portion is located below the first and second mounting portions.

16. The electronic component of claim 13 , wherein the capsule portion includes a plurality of protruding portions, and
the plurality of protruding portions include two or more protruding portions spaced apart from each other in the first direction in vicinity of each of both edges opposing each other on the lower surface of the capsule portion.

17. The electronic component of claim 13 , wherein the protruding portion is located in the center of the capsule portion in the first direction.

18. The electronic component of claim 13 , wherein the protruding portion is arranged in a position offset from the center of the capsule portion in the first direction.

19. The electronic component of claim 13 , wherein a lower end of the protruding portion has any one of a triangular shape having a lower end which is pointed, a semicircular shape having a lower end which is convex, or a quadrangular shape having a lower end which is f

Assignees

• Samsung Electro Mech

Inventors

• Kim Ki Young
• Na Jae Young
• Cho Beom Joon
• Jo Ji Hong
• Shin Woo Chul

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/228

  Terminals · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title