Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-12148572-B2
Application number	US-202217960927-A
Country	US
Kind code	B2
Filing date	Oct 6, 2022
Priority date	Dec 31, 2021
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including a dielectric layer and a first internal electrode and a second internal electrode alternately disposed with the dielectric layer interposed therebetween, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface;
an insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion;
a first plating layer disposed on the first band portion; and
a second plating layer disposed on the second band portion,
wherein the insulating layer includes an oxide containing hafnium (Hf).

2. The multilayer electronic component of claim 1 , wherein the oxide containing hafnium (Hf) is HfO 2 .

3. The multilayer electronic component of claim 1 , wherein among elements constituting the insulating layer, a number of moles of hafnium (Hf) element relative to a total number of moles of elements other than oxygen is 0.95 or more.

4. The multilayer electronic component of claim 1 , wherein an average thickness of the insulating layer is in a range from 15 nm to 1000 nm.

5. The multilayer electronic component of claim 1 , wherein the first and second external electrodes include glass.

6. The multilayer electronic component of claim 1 , further comprising a cover layer disposed on the insulating layer and including an oxide containing aluminum (Al).

7. The multilayer electronic component of claim 6 , wherein the oxide containing hafnium (Hf) is HfO 2 , and
the oxide containing aluminum (Al) is A 1 2 O 3 .

8. The multilayer electronic component of claim 6 , wherein among elements constituting the insulating layer, a number of moles of hafnium (Hf) element relative to a total number of moles of elements other than oxygen is 0.95 or more, and
among elements constituting the cover layer, a number of moles of aluminum (Al) element relative to a total number of moles of elements other than oxygen is 0.95 or more.

9. The multilayer electronic component of claim 1 , wherein
H1>H2, where H1 is an average distance from the first surface to an internal electrode, disposed to be closest to the first surface, among the first and second internal electrodes, in the first direction, and H2 is an average distance from an extension line of the first surface to an end of the first plating layer disposed on the first connection portion or to an end of the second plating layer disposed on the second connection portion in the first direction.

10. The multilayer electronic component of claim 1 , wherein
H1<H2, where H1 is an average distance from the first surface to an internal electrode, disposed to be closest to the first surface, among the first and second internal electrodes, in the first direction, and H2 is an average distance from an extension line of the first surface to an end of the first plating layer disposed on the first connection portion or to an end of the second plating layer disposed on the second connection portion in the first direction.

11. The multilayer electronic component of claim 10 , wherein
H2<T/2, where T is an average size of the body in the first direction.

12. The multilayer electronic component of claim 1 , wherein
the first and second plating layers are disposed on a level the same as or lower than a level of an extension line of the first surface.

13. The multilayer electronic component of claim 1 , wherein
0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4, where L is an average size of the body in the second direction, B1 an average distance from an extension line of the third surface to a distal end of the first band portion in the second direction, and B2 is an average distance from an extension line of the fourth surface to a distal end of the second band portion in the second direction.

14. The multilayer electronic component of claim 1 , further comprising:
an additional insulating layer disposed on the first surface and disposed between the first band portion and the second band portion.

15. The multilayer electronic component of claim 1 , wherein
at least one of the dielectric layers has an average thickness of 0.35 μm or less.

16. The multilayer electronic component of claim 1 , wherein
the first and second internal electrodes have an average thickness of 0.35 μm or less.

17. The multilayer electronic component of claim 1 , wherein
the body includes a capacitance formation portion, including the first and second internal electrodes, alternately disposed with the dielectric layers interposed therebetween, and cover portions, respectively disposed on opposite end surfaces of the capacitance formation portion in the first direction, and
an average size of the cover portion in the first direction is 15 μm or less.

18. The multilayer electronic component of claim 1 , wherein
an average thickness of at least one of the first and second plating layers is smaller than an average thickness of the insulating layer.

19. The multilayer electronic component of claim 1 , wherein
the first plating layer is disposed to cover the end of the first insulating layer close to the first surface, and the second plating layer is disposed to cover the end of the second insulating layer close to the first surface.

20. The multilayer electronic component of claim 1 , wherein
the first insulating layer is disposed to cover an end of the first plating layer disposed on the first external electrode, and the second insulating layer is disposed to cover an end of the second plating layer disposed on the second external electrode.

21. The multilayer electronic component of claim 1 , wherein
the first external electrode includes a first side band portion extending from the first connection portion onto portions of the fifth and sixth surfaces,
the second external electrode includes a second side band portion extending from the second connection portion onto portions of the fifth and sixth surfaces, and
a size of each of the first and second band portions in the second direction is increased in a direction toward the first surface.

22. The multilayer electronic component of claim 1 , wherein
the first and second external electrodes are disposed to be spaced apart from the fifth and sixth surfaces.

23. The multilayer electronic component of claim 1 , wherein
the first and second external electrodes are disposed to be spaced apart from the second surface.

24. The multilayer electronic component of claim 1 , wherein
the first and second insulating layers extend to the second surface to be connected to each other.

25. The multilayer electronic component of claim 1 , wherein
the first and second insulating layers extend to the fifth and sixth surfaces to be conne

Assignees

• Samsung Electro Mech

Inventors

• Han Seung Hun
• Na Jae Young
• Kim Sung Soo
• Lim Jin Hyung
• Kang Yun Sung
• Jo Ji Hong

Classifications

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• Y02E60/13

  Energy storage using capacitors · CPC title