Hyperchip
US-2025300132-A1 · Sep 25, 2025 · US
This page is not indexed by search engines while we improve data quality.
Ingerly Doug patents
Ingerly Doug is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ingerly Doug |
| Total patents | 26 |
| First publication | Jan 30, 2020 |
| Latest publication | Sep 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Hyperchip
US-12355002-B2 · Jul 8, 2025 · US
Through-silicon via die
US-2024363490-A1 · Oct 31, 2024 · US
Hyperchip
US-12074138-B2 · Aug 27, 2024 · US
Hyperchip
US-2024243099-A1 · Jul 18, 2024 · US
Integrated circuit device structures and double-sided electrical testing
US-2024194533-A1 · Jun 13, 2024 · US
Hyperchip
US-11984430-B2 · May 14, 2024 · US
Package on active silicon semiconductor packages
US-11978727-B2 · May 7, 2024 · US
Hyperchip
US-2024038722-A1 · Feb 1, 2024 · US
Integrated circuit device structures and double-sided electrical testing
US-11854894-B2 · Dec 26, 2023 · US
Recent patents
Latest publications not already listed above.
Device, system and method for providing inductor structures
US-11830829-B2 · Nov 28, 2023 · US
Hyperchip
US-11824041-B2 · Nov 21, 2023 · US
Hyperchip
US-2023238357-A1 · Jul 27, 2023 · US
Device, system and method for providing inductor structures
US-2022302051-A1 · Sep 22, 2022 · US
Recoiled metal thin film for 3D inductor with tunable core
US-11444148-B2 · Sep 13, 2022 · US
Device, system and method for providing inductor structures
US-11387198-B2 · Jul 12, 2022 · US
Transistors with back-side contacts to create three dimensional memory and logic
US-11335686-B2 · May 17, 2022 · US
Hyperchip
US-2021225808-A1 · Jul 22, 2021 · US
Integrated circuit device structures and double-sided electrical testing
US-2021175124-A1 · Jun 10, 2021 · US
Hyperchip
US-11024601-B2 · Jun 1, 2021 · US
Transistors with back-side contacts to create three dimensional memory and logic
US-2021134802-A1 · May 6, 2021 · US
Package on active silicon semiconductor packages
US-2021013188-A1 · Jan 14, 2021 · US
Integrated circuit structures
US-10872820-B2 · Dec 22, 2020 · US
Device, system and method for providing inductor structures
US-2020258852-A1 · Aug 13, 2020 · US
Hyperchip
US-2020066679-A1 · Feb 27, 2020 · US
Integrated circuit device structures and double-sided fabrication techniques
US-2020035560-A1 · Jan 30, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 26 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 23 |
| H10W90/722 | 23 |
| H10W70/65 | 21 |
| H10W90/724 | 18 |
| H10W70/611 | 17 |