Surface-treated copper foil and copper clad laminate
US-12168834-B2 · Dec 17, 2024 · US
This page is not indexed by search engines while we improve data quality.
Huang Jian-Ming patents
Huang Jian-Ming is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Huang Jian-Ming |
| Total patents | 18 |
| First publication | May 4, 2017 |
| Latest publication | Dec 17, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Surface-treated copper foil and copper clad laminate
US-2023144190-A1 · May 11, 2023 · US
Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
US-11365486-B2 · Jun 21, 2022 · US
Process for forming metal-insulator-metal structures
US-11145592-B2 · Oct 12, 2021 · US
Process for Forming Metal-Insulator-Metal Structures
US-2021249350-A1 · Aug 12, 2021 · US
Contact structure and semiconductor device and method of forming the same
US-10867851-B2 · Dec 15, 2020 · US
Electrolytic copper foil and electrode and lithium ion cell comprising the same
US-10826052-B1 · Nov 3, 2020 · US
Electrolytic copper foil with low profile
US-10787751-B2 · Sep 29, 2020 · US
Electrolytic copper foil for printed circuit board with low transmission loss
US-10765010-B2 · Sep 1, 2020 · US
Electrolytic copper foil with low profile
US-2020248328-A1 · Aug 6, 2020 · US
Recent patents
Latest publications not already listed above.
Electrolytic copper foil for printed circuit board with low transmission loss
US-2020253061-A1 · Aug 6, 2020 · US
Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
US-2020119360-A1 · Apr 16, 2020 · US
Contact structure and semiconductor device and method of forming the same
US-2019267284-A1 · Aug 29, 2019 · US
Electrodeposited copper foil with low repulsive force
US-10190225-B2 · Jan 29, 2019 · US
Electrodeposited copper foil with low repulsive force
US-2018298508-A1 · Oct 18, 2018 · US
Electrodeposited copper foil with low repulsive force
US-2018298509-A1 · Oct 18, 2018 · US
Electrodeposited copper foil with low repulsive force
US-10081875-B1 · Sep 25, 2018 · US
Touch display system, and driving apparatus and driving method thereof
US-2017123527-A1 · May 4, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Chang Chun Petrochemical Co Ltd | 13 |
| Taiwan Semiconductor Mfg Co Ltd | 4 |
| Himax Tech Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.