Surface-treated copper foil and copper clad laminate

Patent metadata

Field	Value
Publication number	US-12168834-B2
Application number	US-202117560283-A
Country	US
Kind code	B2
Filing date	Dec 23, 2021
Priority date	Nov 5, 2021
Publication date	Dec 17, 2024
Grant date	Dec 17, 2024

Abstract

A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm 3 /μm 2 , and the five-point peak height (S5 p ) of the treating surface is 0.15 to 2.00 μm.

First claim

What is claimed is:

1. A surface-treated copper foil, comprising:
a bulk copper foil, comprising a first surface; and
a first surface treatment layer, disposed on the first surface and comprising a roughening layer, wherein an outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil, the material volume (Vm) of the treating surface is in a range of 0.06 to 1.45 μm 3 /μm 2 , and the five-point peak height (S5p) of the treating surface is in a range of 0.15 to 2.00 μm.

2. The surface-treated copper foil of claim 1 , further comprising:
a counter surface located opposite to the treating surface, wherein the counter surface is an outermost surface of the surface-treated copper foil, and the five-point peak height (S5p) of the counter surface is in a range of 0.55 to 1.50 μm.

3. The surface-treated copper foil of claim 1 , wherein the first surface treatment layer further comprises at least one of a barrier layer, an antirust layer and a coupling layer.

4. The surface-treated copper foil of claim 1 , further comprising:
a second surface treatment layer, disposed on a second surface of the bulk copper foil opposite to the first surface, and the second surface treatment layer comprises at least one of a barrier layer and an antirust layer.

5. The surface-treated copper foil of claim 4 , wherein the five-point peak height (S5p) of an outermost surface of the second surface treatment layer is in a range of 0.55 to 1.50 μm.

6. The surface-treated copper foil of claim 5 , wherein an outermost surface of the antirust layer is the outermost layer of the second surface treatment layer.

7. The surface-treated copper foil of claim 4 , wherein a composition of the barrier layer comprises nickel, zinc, chromium, cobalt, molybdenum, iron, tin, vanadium, tungsten or titanium, and a composition of the antirust layer comprises nickel, zinc, chromium, cobalt, molybdenum, iron, tin, vanadium, tungsten, titanium, porphyrin group, benzotriazole, trithiol or the combination thereof, wherein porphyrin group comprises porphyrin, porphyrinic macrocycle, expanded porphyrin, contracted porphyrin, linear porphyrin polymer, porphyrin sandwich complex, coordination or porphyrin array, 5,10,15,20-tetrakis(4-aminophenyl)-porphyrin-zinc (II), and the composition of the barrier layer is different from the composition of the antirust layer.

8. A copper-clad laminate, comprising:
a board; and
the surface-treated copper foil of claim 1 , wherein the treating surface is attached to the board.

9. The copper-clad laminate of claim 8 , wherein the treating surface is in direct contact with the board.

Assignees

• Chang Chun Petrochemical Co Ltd

Inventors

• Huang Jian-Ming
• Lai Yao-Sheng
• Chou Jui-Chang

Classifications

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• B32B15/08

  of synthetic resin · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title