Electrodeposited copper foil with low repulsive force

Patent metadata

Field	Value
Publication number	US-2018298509-A1
Application number	US-201715626877-A
Country	US
Kind code	A1
Filing date	Jun 19, 2017
Priority date	Apr 18, 2017
Publication date	Oct 18, 2018
Grant date	—

Abstract

The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mm 2 to 55 kgf/mm 2 . The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.

First claim

1 . (canceled)

2 . An electrodeposited copper foil comprising:
(a) a lightness L* value of a nodule untreated side, based on the L*a*b* color system, in the range of 75 to 90; (b) a tensile strength in the range of 20 kgf/mm 2 to 29 kgf/mm 2 , further comprising a low angle grain boundary (LAGB) percentage, as measured via electron backscatter diffraction (ESBD) of less than 7.0%.

3 . An electrodeposited copper foil comprising:
(a) a lightness L* value of a nodule untreated side, based on the L*a*b* color system, in the range of 75 to 90; (b) a tensile strength in the range of 20 kgf/mm 2 to 29 kgf/mm 2 , further comprising a grain size in the range of 4.5 μm to 7.5 μm.

4 . An electrodeposited copper foil comprising:
(a) lightness L* value of a nodule untreated side, based on the L*a*b* color system, in the range of 75 to 90; (b) a tensile strength in the range of 20 kgf/mm 2 to 29 kgf/mm 2 , further comprising a degree of curl, as measured by the lamination curl test, is in the range of 0.45 mm to 3 mm.

5 .- 6 . (canceled)

7 . The electrodeposited copper foil of claim 3 , wherein the grain size value is in the range of 7.0 μm to 7.5 μm and the degree of curl, as measured by the lamination curl test, is in the range of 0.45 mm to 1.5 mm.

8 . The electrodeposited copper foil of claim 3 , wherein the grain size value is in the range of 5.0 μm to 5.5 μm and the degree of curl, as measured by the lamination curl test, is in the range of 1.5 mm to 2.5 mm.

9 . The electrodeposited copper foil of claim 3 , wherein the grain size value is in the range of 4.5 μm to 5.0 μm and the degree of curl, as measured by the lamination curl test, is in the range of 2.5 mm to 3.0 mm.

10 . The electrodeposited copper foil of claim 2 , further comprising an anti-tarnish layer.

11 - 17 . (canceled)

18 . A flexible printed circuit comprising an electrodeposited copper foil according to claim 2 .

19 . An electronic component comprising a flexible printed circuit board according to claim 18 .

20 . An electronic device comprising an electronic component according to claim 18 .

21 . The electrodeposited copper foil of claim 2 , further comprising a repulsive force, as measured via lamination repulsive force testing, of between 12 and 14 grams.

22 . (canceled)

23 . The electrodeposited copper foil of claim 2 , further comprising a nodule treated side opposite the nodule untreated side.

24 . The electrodeposited copper foil of claim 23 , further comprising a passivation layer formed on the nodule treated side and the nodule untreated side.

25 . The electrodeposited copper foil of claim 10 , wherein the anti-tarnish layer is one selected from the group consisting of a chromate, substituted triazole, or combinations thereof.

26 . An electrodeposited copper foil comprising:
(a) a lightness L* value of a nodule untreated side, based on the L*a*b color system, in the range of 80.5 to 90; and (b) a tensile strength in the range of 20 kgf/mm 2 to 36 kgf/mm 2 .

Assignees

• Chang Chun Petrochemical Co Ltd

Inventors

• Lai Yao-Sheng
• Cheng Kuei-Seng
• Huang Jian-Ming

Classifications

• C25D1/04 Primary

  Wires; Strips; Foils · CPC title

• C25D1/20

  Separation of the formed objects from the electrodes {with no destruction of said electrodes} · CPC title

• H01M4/0469

  Electroforming a self-supporting electrode; Electroforming of powdered electrode material · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title

• C25D3/38

  of copper · CPC title