Plating apparatus
US-12571120-B2 · Mar 10, 2026 · US
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Hamada Masato patents
Hamada Masato is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hamada Masato |
| Total patents | 20 |
| First publication | Sep 29, 2016 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate liquid processing apparatus and substrate liquid processing method
US-2024318343-A1 · Sep 26, 2024 · US
Plating apparatus
US-2023096305-A1 · Mar 30, 2023 · US
Plating method and plating apparatus
US-2023042744-A1 · Feb 9, 2023 · US
Electrolytic processing jig and electrolytic processing method
US-11542627-B2 · Jan 3, 2023 · US
Electrolytic processing jig and electrolytic processing method
US-11427920-B2 · Aug 30, 2022 · US
Electrolytic treatment apparatus and electrolytic treatment method
US-11427921-B2 · Aug 30, 2022 · US
Electrolytic treatment apparatus and electrolytic treatment method
US-2021285119-A1 · Sep 16, 2021 · US
Manufacturing apparatus and manufacturing method for semiconductor device
US-11111592-B2 · Sep 7, 2021 · US
Substrate processing method
US-10903081-B2 · Jan 26, 2021 · US
Recent patents
Latest publications not already listed above.
Electrolytic treatment apparatus and electrolytic treatment method
US-10392719-B2 · Aug 27, 2019 · US
Electrolytic processing jig and electrolytic processing method
US-2019233963-A1 · Aug 1, 2019 · US
Electrolytic processing jig and electrolytic processing method
US-2019218682-A1 · Jul 18, 2019 · US
Adhesion layer forming method, adhesion layer forming system and recording medium
US-10354915-B2 · Jul 16, 2019 · US
Manufacturing apparatus and manufacturing method for semiconductor device
US-2018355501-A1 · Dec 13, 2018 · US
Substrate processing method
US-2018122641-A1 · May 3, 2018 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2017170021-A1 · Jun 15, 2017 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2017167029-A1 · Jun 15, 2017 · US
Electrolytic treatment apparatus and electrolytic treatment method
US-2017159202-A1 · Jun 8, 2017 · US
Adhesion layer forming method, adhesion layer forming system and recording medium
US-2016284592-A1 · Sep 29, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 20 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/123 | 15 |
| C25D17/001 | 12 |
| C25D21/12 | 12 |
| C25D17/007 | 10 |
| C25D17/10 | 9 |