Method for orienting solder balls on a bga device
US-2023112097-A1 · Apr 13, 2023 · US
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Gilbert Scott A patents
Gilbert Scott A is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Gilbert Scott A |
| Total patents | 13 |
| First publication | Jan 12, 2016 |
| Latest publication | Apr 13, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for orienting solder balls on a BGA device
US-11528809-B2 · Dec 13, 2022 · US
Method for orienting solder balls on a bga device
US-2021185830-A1 · Jun 17, 2021 · US
Method for orienting solder balls on a BGA device
US-10980134-B2 · Apr 13, 2021 · US
Method for orienting solder balls on a bga device
US-2019230795-A1 · Jul 25, 2019 · US
Land side and die side cavities to reduce package z-height
US-10297542-B2 · May 21, 2019 · US
Method for orienting solder balls on a BGA device
US-10278292-B2 · Apr 30, 2019 · US
Land side and die side cavities to reduce package z-height
US-9799556-B2 · Oct 24, 2017 · US
Land side and die side cavities to reduce package z-height
US-9721882-B2 · Aug 1, 2017 · US
Land side and die side cavities to reduce package z-height
US-2016181145-A1 · Jun 23, 2016 · US
Recent patents
Latest publications not already listed above.
Bga structure using ctf balls in high stress regions
US-2016128207-A1 · May 5, 2016 · US
Land side and die side cavities to reduce package Z-height
US-9293426-B2 · Mar 22, 2016 · US
BGA structure using CTF balls in high stress regions
US-9237659-B2 · Jan 12, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 11 |
| Hossain Md Altaf | 2 |
| Gilbert Scott A | 2 |
| Tahoe Res Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 13 |
| H10W70/093 | 13 |
| H05K1/111 | 13 |
| Y02P70/50 | 13 |
| H01L21/4853 | 11 |